-
公开(公告)号:US08377319B2
公开(公告)日:2013-02-19
申请号:US12027597
申请日:2008-02-07
申请人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
发明人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
IPC分类号: G01D15/00
CPC分类号: B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
摘要翻译: 提供了用于在微机电装置中形成喷嘴的技术。 在将层粘合到装置的另一部分之前,喷嘴形成在一层中。 在接合之前在层中形成喷嘴可以形成具有期望深度和期望几何形状的喷嘴。 为喷嘴选择特定的几何形状可以降低油墨流动的阻力,并且提高喷嘴在整个微机电装置上的均匀性。
-
公开(公告)号:US20080128387A1
公开(公告)日:2008-06-05
申请号:US12027597
申请日:2008-02-07
申请人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
发明人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
IPC分类号: G11B5/127
CPC分类号: B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
摘要翻译: 提供了用于在微机电装置中形成喷嘴的技术。 在将层粘合到装置的另一部分之前,喷嘴形成在一层中。 在接合之前在层中形成喷嘴可以形成具有期望深度和期望几何形状的喷嘴。 为喷嘴选择特定的几何形状可以降低油墨流动的阻力,并且提高喷嘴在整个微机电装置上的均匀性。
-
公开(公告)号:US07347532B2
公开(公告)日:2008-03-25
申请号:US10913571
申请日:2004-08-05
申请人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
发明人: Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
CPC分类号: B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
摘要翻译: 提供了用于在微机电装置中形成喷嘴的技术。 在将层粘合到装置的另一部分之前,喷嘴形成在一层中。 在接合之前在层中形成喷嘴可以形成具有期望深度和期望几何形状的喷嘴。 为喷嘴选择特定的几何形状可以降低油墨流动的阻力,并且提高喷嘴在整个微机电装置上的均匀性。
-
公开(公告)号:US08969105B2
公开(公告)日:2015-03-03
申请号:US13810696
申请日:2011-07-22
申请人: Paul A. Hoisington , Jeffrey Birkmeyer , Andreas Bibl , Mats G. Ottosson , Gregory De Brabander , Zhenfang Chen , Mark Nepomnishy , Shinya Sugimoto
发明人: Paul A. Hoisington , Jeffrey Birkmeyer , Andreas Bibl , Mats G. Ottosson , Gregory De Brabander , Zhenfang Chen , Mark Nepomnishy , Shinya Sugimoto
CPC分类号: H01L41/332 , B41J2/14233 , B41J2/1607 , B41J2/161 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1646 , B41J2002/14241 , H01L41/098 , H01L41/22 , H01L41/316 , H01L41/33
摘要: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.
摘要翻译: 公开了一种用于形成具有弯曲压电膜的致动器的工艺。 该工艺利用具有由平面表面包围的弯曲表面的轮廓转印衬底以形成弯曲的压电膜。 用于压电致动器的压电材料沉积在轮廓转移衬底的至少曲面上,然后从曲面压电膜的下侧移除轮廓转移衬底。 所形成的弯曲压电膜包括柱状和对准的晶粒结构,并且所有或基本上所有的柱状晶粒局部垂直于压电膜的弯曲表面。
-
公开(公告)号:US20130210175A1
公开(公告)日:2013-08-15
申请号:US13810696
申请日:2011-07-22
申请人: Paul A. Hoisington , Jeffrey Birkmeyer , Andreas Bibl , Mats G. Ottosson , Gregory De Brabander , Zhenfang Chen , Mark Nepomnishy , Shinya Sugimoto
发明人: Paul A. Hoisington , Jeffrey Birkmeyer , Andreas Bibl , Mats G. Ottosson , Gregory De Brabander , Zhenfang Chen , Mark Nepomnishy , Shinya Sugimoto
IPC分类号: H01L41/22
CPC分类号: H01L41/332 , B41J2/14233 , B41J2/1607 , B41J2/161 , B41J2/1626 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1642 , B41J2/1646 , B41J2002/14241 , H01L41/098 , H01L41/22 , H01L41/316 , H01L41/33
摘要: Processes for forming an actuator having a curved piezoelectric membrane are disclosed. The processes utilize a profile-transferring substrate having a curved surface surrounded by a planar surface to form the curved piezoelectric membrane. The piezoelectric material used for the piezoelectric actuator is deposited on at least the curved surface of the profile-transferring substrate before the profile-transferring substrate is removed from the underside of the curved piezoelectric membrane. The resulting curved piezoelectric membrane includes grain structures that are columnar and aligned, and all or substantially all of the columnar grains are locally perpendicular to the curved surface of the piezoelectric membrane.
-
公开(公告)号:US20060028508A1
公开(公告)日:2006-02-09
申请号:US10913571
申请日:2004-08-05
申请人: Zhenfang Chen , Andreas Bibl , Paul Hoisington
发明人: Zhenfang Chen , Andreas Bibl , Paul Hoisington
IPC分类号: B41J2/16
CPC分类号: B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
-
公开(公告)号:US20050099467A1
公开(公告)日:2005-05-12
申请号:US10962378
申请日:2004-10-08
申请人: Andreas Bibl , Zhenfang Chen , Jeffrey Birkmeyer
发明人: Andreas Bibl , Zhenfang Chen , Jeffrey Birkmeyer
CPC分类号: B41J2/14233 , B41J2/155 , B41J2/1609 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2002/14403 , B41J2202/20
摘要: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.
摘要翻译: 描述了一种用于形成微加工装置的微制造装置和方法。 通过将绝缘体硅衬底粘合到硅衬底上,在硅体上形成包括硅的薄膜。 去除绝缘体上硅衬底的手柄和绝缘体层,留下结合到硅体的硅薄膜,使得膜和体之间不存在中间绝缘体材料层。 压电层与膜结合。
-
公开(公告)号:US20110092049A1
公开(公告)日:2011-04-21
申请号:US12991808
申请日:2009-05-08
IPC分类号: H01L21/30
CPC分类号: B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2002/14266 , C09J5/02 , C09J5/06 , H01L41/313
摘要: Methods for bonding a first substrate to a second substrate are described. A surface of the first substrate is coated with an adhesive layer. The adhesive layer is cured to b-stage. The surface of the first substrate is positioned in contact with the second substrate. An edge of the first substrate is pressed to an edge of the second substrate to initiate Van der Waals bonding. The first and second substrates are allowed to come together by Van der Waals bonding. The bonded first and second substrates are subjected to a sufficient heat for a sufficient time period to cure completely the adhesive layer.
摘要翻译: 描述了将第一衬底接合到第二衬底的方法。 第一基板的表面涂覆有粘合剂层。 粘合剂层固化至b阶段。 第一基板的表面定位成与第二基板接触。 第一衬底的边缘被压到第二衬底的边缘以引发范德华力结合。 允许第一和第二基底通过范德华力粘合而合在一起。 将粘结的第一和第二基底经受充足的热量足够的时间以完全固化粘合剂层。
-
公开(公告)号:US20110115341A1
公开(公告)日:2011-05-19
申请号:US12992246
申请日:2009-05-21
申请人: Jeffrey Birkmeyer , Darren T. Imai , Andreas Bibl , Zhenfang Chen
发明人: Jeffrey Birkmeyer , Darren T. Imai , Andreas Bibl , Zhenfang Chen
IPC分类号: H01L41/047 , H01L41/22
CPC分类号: B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1643 , B41J2/1645 , B41J2/1646 , Y10T29/42 , Y10T29/49156 , Y10T29/49401
摘要: A method of forming an actuator and an actuable device formed by this method are disclosed. This method includes depositing a photoimageable material to form a first photoimageable layer on a piezoelectric layer; patterning the first photoimageable layer to form an aperture; and disposing a first conductive layer on the first photoimageable layer. The first conductive layer partially overlies the first photoimageable layer such that a first portion of the first conductive layer contacts the first photoimageable layer and a second portion of the first conductive layer electrically contacts the piezoelectric layer in the aperture.
摘要翻译: 公开了一种形成致动器的方法和通过该方法形成的致动装置。 该方法包括沉积光致成像材料以在压电层上形成第一可光成像层; 图案化第一可光成像层以形成孔; 以及将第一导电层设置在所述第一可光成像层上。 第一导电层部分地覆盖第一可光成像层,使得第一导电层的第一部分接触第一可光成像层,第一导电层的第二部分与孔中的压电层电接触。
-
公开(公告)号:US07566118B2
公开(公告)日:2009-07-28
申请号:US10962378
申请日:2004-10-08
申请人: Andreas Bibl , Zhenfang Chen , Jeffrey Birkmeyer
发明人: Andreas Bibl , Zhenfang Chen , Jeffrey Birkmeyer
CPC分类号: B41J2/14233 , B41J2/155 , B41J2/1609 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1639 , B41J2/1642 , B41J2/1646 , B41J2002/14403 , B41J2202/20
摘要: A microfabricated device and method for forming a microfabricated device are described. A thin membrane including silicon is formed on a silicon body by bonding a silicon-on-insulator substrate to a silicon substrate. The handle and insulator layers of the silicon-on-insulator substrate are removed, leaving a thin membrane of silicon bonded to a silicon body such that no intervening layer of insulator material remains between the membrane and the body. A piezoelectric layer is bonded to the membrane.
摘要翻译: 描述了一种用于形成微加工装置的微制造装置和方法。 通过将绝缘体硅衬底粘合到硅衬底上,在硅体上形成包括硅的薄膜。 去除绝缘体上硅衬底的手柄和绝缘体层,留下结合到硅体的硅薄膜,使得膜和体之间不存在中间绝缘体材料层。 压电层与膜结合。
-
-
-
-
-
-
-
-
-