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公开(公告)号：US20110092049A1
公开(公告)日：2011-04-21
申请号：US12991808
申请日：2009-05-08
IPC分类号： H01L21/30
CPC分类号： B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2002/14266 , C09J5/02 , C09J5/06 , H01L41/313
摘要： Methods for bonding a first substrate to a second substrate are described. A surface of the first substrate is coated with an adhesive layer. The adhesive layer is cured to b-stage. The surface of the first substrate is positioned in contact with the second substrate. An edge of the first substrate is pressed to an edge of the second substrate to initiate Van der Waals bonding. The first and second substrates are allowed to come together by Van der Waals bonding. The bonded first and second substrates are subjected to a sufficient heat for a sufficient time period to cure completely the adhesive layer.
摘要翻译： 描述了将第一衬底接合到第二衬底的方法。 第一基板的表面涂覆有粘合剂层。 粘合剂层固化至b阶段。 第一基板的表面定位成与第二基板接触。 第一衬底的边缘被压到第二衬底的边缘以引发范德华力结合。 允许第一和第二基底通过范德华力粘合而合在一起。 将粘结的第一和第二基底经受充足的热量足够的时间以完全固化粘合剂层。
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公开(公告)号：US20110212261A1
公开(公告)日：2011-09-01
申请号：US13106737
申请日：2011-05-12
申请人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
发明人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
IPC分类号： C09D5/20
CPC分类号： B41J2/1606 , B41J2/1433 , B82Y30/00
摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.
摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。
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公开(公告)号：US20110250403A1
公开(公告)日：2011-10-13
申请号：US13063355
申请日：2009-08-18
CPC分类号： B41J2/1631 , B41J2/161 , B41J2/1623 , B41J2/1626 , B41J2/1632 , Y10T428/24612 , Y10T428/31504
摘要： A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a lower membrane surface and an upper membrane surface, a transducer having a transducer surface substantially parallel to the upper membrane surface, and an adhesive connecting the membrane to the transducer surface. In some implementations, the lower membrane surface is substantially contiguous and the upper membrane surface protrudes therefrom. In some other implementations, the upper membrane surface is substantially contiguous and the lower membrane surface is recessed therein.
摘要翻译： 公开了一种用于在硅衬底上接合的方法和装置。 一种装置包括具有下膜表面和上膜表面的膜，具有基本上平行于上膜表面的换能器表面的换能器以及将膜连接到换能器表面的粘合剂。 在一些实施方式中，下膜表面基本上邻接，并且上膜表面从其突出。 在一些其他实施方案中，上膜表面基本上邻接并且下膜表面凹入其中。
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公开(公告)号：US08523322B2
公开(公告)日：2013-09-03
申请号：US11479152
申请日：2006-06-30
申请人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
发明人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
IPC分类号： B41J2/135
CPC分类号： B41J2/1606 , B41J2/1433 , B82Y30/00
摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.
摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。
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公开(公告)号：US08226208B2
公开(公告)日：2012-07-24
申请号：US13106737
申请日：2011-05-12
申请人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory De Brabander , Paul A. Hoisington , Andreas Bibl
发明人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory De Brabander , Paul A. Hoisington , Andreas Bibl
IPC分类号： B41J2/135
CPC分类号： B41J2/1606 , B41J2/1433 , B82Y30/00
摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.
摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。
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公开(公告)号：US07837310B2
公开(公告)日：2010-11-23
申请号：US11457022
申请日：2006-07-12
申请人： John A. Higginson , Michael Rocchio , Jeffrey Birkmeyer , Stephen R. Deming , Kevin Von Essen , Andreas Bibl , Deane A. Gardner , Daniel Alan West
发明人： John A. Higginson , Michael Rocchio , Jeffrey Birkmeyer , Stephen R. Deming , Kevin Von Essen , Andreas Bibl , Deane A. Gardner , Daniel Alan West
IPC分类号： B41J2/175
CPC分类号： B41J29/13 , B41J2/175 , B41J2/1752 , B41J2/17526 , B41J2/17556 , B41J2/17596 , B41J29/02
摘要： A fluid deposition device including a platen and a cartridge mount assembly is described. The platen is configured to support a substrate upon which a fluid will be deposited. The cartridge mount assembly includes a receptacle configured to receive a print cartridge and multiple electrical contacts configured to mate with corresponding electrical contacts on the print cartridge. In one implementation, the cartridge mount assembly further includes a vacuum connector configured to mate with a vacuum inlet included on the print cartridge. When the print cartridge is received in the receptacle, the print cartridge can form connections with the electrical contacts and with the vacuum connector of the receptacle at substantially the same time.
摘要翻译： 描述了包括压板和盒安装组件的流体沉积装置。 压板被构造成支撑待沉积流体的基底。 盒安装组件包括被配置为容纳打印盒和被配置为与打印盒上的相应电触点配合的多个电触点的插座。 在一个实施方式中，盒安装组件还包括配置成与包括在打印盒上的真空入口配合的真空连接器。 当打印墨盒被容纳在容器中时，打印墨盒可以在大致相同的时间与电触点和插座的真空连接器形成连接。
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公开(公告)号：US08835940B2
公开(公告)日：2014-09-16
申请号：US13625825
申请日：2012-09-24
申请人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson
发明人： Hsin-Hua Hu , Andreas Bibl , John A. Higginson
IPC分类号： H01L33/48
CPC分类号： H01L21/52 , H01L21/6835 , H01L21/6836 , H01L24/83 , H01L24/93 , H01L24/95 , H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/40 , H01L2221/6835 , H01L2224/95136 , H01L2924/12041 , H01L2924/12042 , H01L2924/1461 , H01L2924/00
摘要： A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
摘要翻译： 公开了一种稳定微器件阵列的方法和结构。 微器件阵列形成在由热固性材料形成的稳定柱阵列上。 每个微型装置包括比直接在底面下面的相应稳定柱更宽的底表面。
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公开(公告)号：US08523323B2
公开(公告)日：2013-09-03
申请号：US12991758
申请日：2009-05-06
CPC分类号： B41J2/14 , B41J2/175 , B41J29/393 , B41J2002/14362
摘要： A system and method for mounting a fluid droplet ejection module to a frame is disclosed, where the fluid ejection module includes a mounting component having a mounting surface. A connector is configured to detachably attach to the frame and is positioned between the frame and the mounting surface of the fluid ejection module. A portion of a mating surface of the connector is positioned adjacent the mounting surface of a corresponding fluid ejection module and is in direct contact with the mounting surface. One or more recesses are formed in at least one of either the mounting surface of the fluid ejection module or the mating surface of the connector. The one or more recesses have a substantially uniform thickness and are filled with an adhesive. The adhesive is cured after aligning the fluid ejection module to the frame.
摘要翻译： 公开了一种用于将流体液滴喷射模块安装到框架的系统和方法，其中流体喷射模块包括具有安装表面的安装部件。 连接器被构造成可拆卸地附接到框架并且被定位在框架和流体喷射模块的安装表面之间。 连接器的配合表面的一部分邻近相应的流体喷射模块的安装表面定位并且与安装表面直接接触。 一个或多个凹部形成在流体喷射模块的安装表面或连接器的配合表面中的至少一个中。 一个或多个凹部具有基本均匀的厚度并且填充有粘合剂。 粘合剂在将流体喷射模块对准框架后固化。
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公开(公告)号：US20130126589A1
公开(公告)日：2013-05-23
申请号：US13372258
申请日：2012-02-13
CPC分类号： H01L33/06 , F21V7/00 , H01L25/0753 , H01L27/15 , H01L29/0684 , H01L33/0079 , H01L33/04 , H01L33/20 , H01L33/28 , H01L33/30 , H01L2224/95
摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
摘要翻译： 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。
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公开(公告)号：US08287093B2
公开(公告)日：2012-10-16
申请号：US12510513
申请日：2009-07-28
IPC分类号： B41J2/14
CPC分类号： B41J2/1433 , B41J2002/14475
摘要： A drop ejection device including a flow path in which fluid is pressurized to eject drops from a nozzle opening on a surface, a piezoelectric actuator for pressurizing said fluid, and one or more waste fluid control apertures on the surface proximate the nozzle opening, the one or more apertures being isolated from the flow path.
摘要翻译： 液滴喷射装置，其包括流体被加压以从表面上的喷嘴开口喷出液滴的流动路径，用于对所述流体加压的压电致动器以及在喷嘴开口附近的表面上的一个或多个废液控制孔， 或更多的孔与流动路径隔离。
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