公开(公告)号：US06576487B1

公开(公告)日：2003-06-10

申请号：US10126363

申请日：2002-04-19

申请人： Zhigang Wang ,  Harpreet Kaur Sachar ,  Kuo-Tung Chang

发明人： Zhigang Wang ,  Harpreet Kaur Sachar ,  Kuo-Tung Chang

IPC分类号： G01R3126

CPC分类号： H01L22/34 ,  H01L21/76229 ,  H01L21/76232

摘要： The present invention details a method which characterizes an STI fabrication process, and more particularly provides information relating to a variation in the STI sidewall profile between trenches in a middle portion of an array and a trench on an outer portion thereof. The method comprises forming two STI arrays with an STI fabrication process, forming a conductive layer over each array, biasing each conductive layer and determining a current associated therewith. The two current are then utilized to ascertain the variation of interest.

摘要翻译： 本发明详细描述了一种表征STI制造工艺的方法，并且更具体地提供了与阵列的中间部分中的沟槽和其外部部分上的沟槽之间的STI侧壁轮廓变化有关的信息。 该方法包括用STI制造工艺形成两个STI阵列，在每个阵列上形成导电层，偏置每个导电层并确定与之相关联的电流。 然后利用两个电流来确定兴趣的变化。

公开(公告)号：US07906807B2

公开(公告)日：2011-03-15

申请号：US12827069

申请日：2010-06-30

申请人： Ning Cheng ,  Calvin Gabriel ,  Angela Hui ,  Lei Xue ,  Harpreet Kaur Sachar ,  Phillip Lawrence Jones ,  Hiro Kinoshita ,  Kuo-Tung Chang ,  Huaqiang Wu

发明人： Ning Cheng ,  Calvin Gabriel ,  Angela Hui ,  Lei Xue ,  Harpreet Kaur Sachar ,  Phillip Lawrence Jones ,  Hiro Kinoshita ,  Kuo-Tung Chang ,  Huaqiang Wu

IPC分类号： H01L29/92 ,  H01L29/76 ,  H01L21/336

CPC分类号： H01L27/11568 ,  H01L29/4234 ,  H01L29/66833 ,  H01L29/7923

摘要： Memory devices having improved TPD characteristics and methods of making the memory devices are provided. The memory devices contain two or more memory cells on a semiconductor substrate and bit line dielectrics between the memory cells. The bit line dielectrics can extend into the semiconductor. The memory cell contains one or more charge storage nodes, a first poly gate, a pair of first bit lines, and a pair of second bit lines. The second bit line can be formed at a higher energy level, a higher concentration of dopants, or a combination thereof compared to an energy level and a concentration of dopants of the first bit line.

摘要翻译： 提供了具有改善的TPD特性的存储器件和制造存储器件的方法。 存储器件在半导体衬底上包含两个或更多存储器单元，并且在存储器单元之间包含位线电介质。 位线电介质可以延伸到半导体中。 存储单元包含一个或多个电荷存储节点，第一多晶硅栅极，一对第一位线和一对第二位线。 与第一位线的能级和掺杂剂的浓度相比，第二位线可以形成在更高的能级，更高浓度的掺杂剂或其组合。

公开(公告)号：US07776688B2

公开(公告)日：2010-08-17

申请号：US11835538

申请日：2007-08-08

申请人： Ning Cheng ,  Calvin Gabriel ,  Angela Hui ,  Lei Xue ,  Harpreet Kaur Sachar ,  Phillip Lawrence Jones ,  Hiro Kinoshita ,  Kuo-Tung Chang ,  Huaqiang Wu

发明人： Ning Cheng ,  Calvin Gabriel ,  Angela Hui ,  Lei Xue ,  Harpreet Kaur Sachar ,  Phillip Lawrence Jones ,  Hiro Kinoshita ,  Kuo-Tung Chang ,  Huaqiang Wu

IPC分类号： H01L21/336 ,  H01L21/4763 ,  H01L21/3205

CPC分类号： H01L27/11568 ,  H01L29/4234 ,  H01L29/66833 ,  H01L29/7923

摘要： Memory devices having improved TPD characteristics and methods of making the memory devices are provided. The memory devices contain two or more memory cells on a semiconductor substrate and bit line dielectrics between the memory cells. The bit line dielectrics can extend into the semiconductor. The memory cell contains one or more charge storage nodes, a first poly gate, a pair of first bit lines, and a pair of second bit lines. The second bit line can be formed at a higher energy level, a higher concentration of dopants, or a combination thereof compared to an energy level and a concentration of dopants of the first bit line.

摘要翻译： 提供了具有改善的TPD特性的存储器件和制造存储器件的方法。 存储器件在半导体衬底上包含两个或更多存储器单元，并且在存储器单元之间包含位线电介质。 位线电介质可以延伸到半导体中。 存储单元包含一个或多个电荷存储节点，第一多晶硅栅极，一对第一位线和一对第二位线。 与第一位线的能级和掺杂剂的浓度相比，第二位线可以形成在更高的能级，更高浓度的掺杂剂或其组合。

公开(公告)号：US20060035431A1

公开(公告)日：2006-02-16

申请号：US10915771

申请日：2004-08-11

申请人： Shenqing Fang ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Zhigang Wang

发明人： Shenqing Fang ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Zhigang Wang

IPC分类号： H01L21/336

CPC分类号： H01L29/66825

摘要： According to one exemplary embodiment, a method for fabricating a floating gate memory cell on substrate comprises a step of forming a spacer adjacent to a source sidewall of a stacked gate structure, where the stacked gate structure is situated over a channel region in substrate. The method further comprises forming a high energy implant doped region adjacent to the spacer in the source region of substrate. The method further comprises forming a recess in a source region of the substrate, where the recess has a sidewall, a bottom, and a depth, and where the sidewall of the recess is situated adjacent to a source of the floating gate memory cell. According to this exemplary embodiment, the spacer causes the source to have a reduced lateral straggle and diffusion in the channel region, which causes a reduction in drain induced barrier lowering (DIBL) in the floating gate memory cell.

摘要翻译： 根据一个示例性实施例，用于在衬底上制造浮动栅极存储器单元的方法包括形成与层叠栅极结构的源极侧壁相邻的间隔物的步骤，其中堆叠的栅极结构位于衬底中的沟道区域之上。 该方法还包括在衬底的源区中形成与间隔物相邻的高能注入掺杂区。 该方法还包括在衬底的源极区域中形成凹部，其中凹部具有侧壁，底部和深度，并且凹部的侧壁位于与浮动栅极存储单元的源极相邻的位置。 根据该示例性实施例，间隔件导致源极在通道区域中具有减小的横向偏移和扩散，这导致浮动栅极存储单元中的漏极感应势垒降低（DIBL）的减小。

公开(公告)号：US07488657B2

公开(公告)日：2009-02-10

申请号：US11155707

申请日：2005-06-17

申请人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

发明人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

IPC分类号： H01L21/336

CPC分类号： H01L29/7883 ,  H01L21/2652 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/66825

摘要： Embodiments of the present invention disclose a memory device having an array of flash memory cells with source contacts that facilitate straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column is implanted with n-type dopants after the formation of a tunnel oxide layer and a first polysilicon layer. The implanted source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions associated with memory cells in the array. A source contact is coupled to the implanted source column for providing electrical coupling with the plurality of source regions. The source contact is collinear with a row of drain contacts that are coupled to drain regions associated with a row of memory cells. The arrangement of source contacts collinear with the row of drain contacts allows for straight word line formation.

摘要翻译： 本发明的实施例公开了一种存储器件，其具有具有促进直线字线的源极触点的闪存单元阵列及其制造方法。 阵列由隔离多个存储单元列的多个不相交的浅沟槽隔离（STI）区域组成。 在形成隧道氧化物层和第一多晶硅层之后，源极列注入n型掺杂剂。 植入的源极柱耦合到耦合到与阵列中的存储器单元相关联的多个源极区域的多个公共源极线。 源极触点耦合到植入源极柱，用于提供与多个源极区域的电耦合。 源触点与一排漏极触点共线，该排触点耦合到与一行存储器单元相关联的漏极区。 与漏极触点排共线的源触点的布置允许直线字线形成。

公开(公告)号：US07170130B2

公开(公告)日：2007-01-30

申请号：US10915771

申请日：2004-08-11

申请人： Shenqing Fang ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Zhigang Wang

发明人： Shenqing Fang ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Zhigang Wang

IPC分类号： H01L29/788

CPC分类号： H01L29/66825

摘要： According to one exemplary embodiment, a method for fabricating a floating gate memory cell on substrate comprises a step of forming a spacer adjacent to a source sidewall of a stacked gate structure, where the stacked gate structure is situated over a channel region in substrate. The method further comprises forming a high energy implant doped region adjacent to the spacer in the source region of substrate. The method further comprises forming a recess in a source region of the substrate, where the recess has a sidewall, a bottom, and a depth, and where the sidewall of the recess is situated adjacent to a source of the floating gate memory cell. According to this exemplary embodiment, the spacer causes the source to have a reduced lateral straggle and diffusion in the channel region, which causes a reduction in drain induced barrier lowering (DIBL) in the floating gate memory cell.

摘要翻译： 根据一个示例性实施例，用于在衬底上制造浮动栅极存储器单元的方法包括形成与层叠栅极结构的源极侧壁相邻的间隔物的步骤，其中堆叠的栅极结构位于衬底中的沟道区域之上。 该方法还包括在衬底的源区中形成与间隔物相邻的高能注入掺杂区。 该方法还包括在衬底的源极区域中形成凹部，其中凹部具有侧壁，底部和深度，并且凹部的侧壁位于与浮动栅极存储单元的源极相邻的位置。 根据该示例性实施例，间隔件导致源极在通道区域中具有减小的横向偏移和扩散，这导致浮动栅极存储单元中的漏极感应势垒降低（DIBL）的减小。

公开(公告)号：US20060286750A1

公开(公告)日：2006-12-21

申请号：US11155707

申请日：2005-06-17

申请人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

发明人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

IPC分类号： H01L21/336

CPC分类号： H01L29/7883 ,  H01L21/2652 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/66825

摘要： Embodiments of the present invention disclose a memory device having an array of flash memory cells with source contacts that facilitate straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column is implanted with n-type dopants after the formation of a tunnel oxide layer and a first polysilicon layer. The implanted source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions associated with memory cells in the array. A source contact is coupled to the implanted source column for providing electrical coupling with the plurality of source regions. The source contact is collinear with a row of drain contacts that are coupled to drain regions associated with a row of memory cells. The arrangement of source contacts collinear with the row of drain contacts allows for straight word line formation.

公开(公告)号：US07851306B2

公开(公告)日：2010-12-14

申请号：US12327641

申请日：2008-12-03

申请人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

发明人： Shenqing Fang ,  Hiroyuki Ogawa ,  Kuo-Tung Chang ,  Pavel Fastenko ,  Kazuhiro Mizutani ,  Zhigang Wang

IPC分类号： H01L21/336

CPC分类号： H01L29/7883 ,  H01L21/2652 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/66825

摘要： Embodiments of the present invention disclose a memory device having an array of flash memory cells with source contacts that facilitate straight word lines, and a method for producing the same. The array is comprised of a plurality of non-intersecting shallow trench isolation (STI) regions that isolate a plurality of memory cell columns. A source column is implanted with n-type dopants after the formation of a tunnel oxide layer and a first polysilicon layer. The implanted source column is coupled to a plurality of common source lines that are coupled to a plurality of source regions associated with memory cells in the array. A source contact is coupled to the implanted source column for providing electrical coupling with the plurality of source regions. The source contact is collinear with a row of drain contacts that are coupled to drain regions associated with a row of memory cells. The arrangement of source contacts collinear with the row of drain contacts allows for straight word line formation.

摘要翻译： 本发明的实施例公开了一种存储器件，其具有具有促进直线字线的源极触点的闪存单元阵列及其制造方法。 阵列由隔离多个存储单元列的多个不相交的浅沟槽隔离（STI）区域组成。 在形成隧道氧化物层和第一多晶硅层之后，源极列注入n型掺杂剂。 植入的源极柱耦合到耦合到与阵列中的存储器单元相关联的多个源极区域的多个公共源极线。 源极触点耦合到植入源极柱，用于提供与多个源极区域的电耦合。 源触点与一排漏极触点共线，该排触点耦合到与一行存储器单元相关联的漏极区。 与漏极触点排共线的源触点的布置允许直线字线形成。

公开(公告)号：US07151028B1

公开(公告)日：2006-12-19

申请号：US10981174

申请日：2004-11-04

申请人： Shenqing Fang ,  Rinji Sugino ,  Kuo-Tung Chang ,  Zhigang Wang ,  Kazuhiro Mizutani ,  Pavel Fastenko

发明人： Shenqing Fang ,  Rinji Sugino ,  Kuo-Tung Chang ,  Zhigang Wang ,  Kazuhiro Mizutani ,  Pavel Fastenko

IPC分类号： H01L21/26

CPC分类号： H01L29/66636 ,  H01L29/1037 ,  H01L29/66659 ,  H01L29/66825 ,  H01L29/7881

摘要： According to one exemplary embodiment, a method for fabricating a floating gate memory cell on a substrate comprises a step of forming a first spacer adjacent to a source sidewall of a stacked gate structure, where the stacked gate structure is situated over a channel region in the substrate. The method further comprises forming a high energy implant doped region adjacent to the first spacer in a source region of the substrate. The method further comprises forming a recess in the source region, where a sidewall of the recess is situated adjacent to a source of the floating gate memory cell, and where forming the recess comprises removing the first spacer. The method further comprises forming a second spacer adjacent to the source sidewall of the stacked gate structure, where the second spacer extends to a bottom of the recess, and where the second spacer comprises plasma-grown oxide.

摘要翻译： 根据一个示例性实施例，用于在衬底上制造浮动栅极存储器单元的方法包括形成邻近层叠栅极结构的源极侧壁的第一间隔物的步骤，其中堆叠的栅极结构位于 基质。 该方法还包括在衬底的源区中形成与第一间隔物相邻的高能注入掺杂区。 该方法还包括在源极区域中形成凹部，其中凹部的侧壁位于与浮动栅极存储单元的源极相邻处，并且其中形成凹槽包括移除第一间隔物。 该方法还包括形成邻近层叠栅极结构的源极侧壁的第二间隔物，其中第二间隔物延伸到凹部的底部，并且其中第二间隔物包括等离子体生长的氧化物。

公开(公告)号：US08455268B2

公开(公告)日：2013-06-04

申请号：US11848515

申请日：2007-08-31

申请人： Chungho Lee ,  Hiroyuki Kinoshita ,  Kuo-Tung Chang ,  Rinji Sugino ,  Chi Chang ,  Huaqiang Wu

发明人： Chungho Lee ,  Hiroyuki Kinoshita ,  Kuo-Tung Chang ,  Rinji Sugino ,  Chi Chang ,  Huaqiang Wu

IPC分类号： H01L21/00 ,  H01L21/311

CPC分类号： H01L29/7923 ,  H01L21/28273 ,  H01L21/28282 ,  H01L27/115 ,  H01L27/11521 ,  H01L27/11568 ,  H01L29/42332 ,  H01L29/42348 ,  H01L29/7887

摘要： Methods of replacing/reforming a top oxide around a charge storage element of a memory cell and methods of improving quality of a top oxide around a charge storage element of a memory cell are provided. The method can involve removing a first poly over a first top oxide from the memory cell; removing the first top oxide from the memory cell; and forming a second top oxide around the charge storage element. The second top oxide can be formed by oxidizing a portion of the charge storage element or by forming a sacrificial layer over the charge storage element and oxidizing the sacrificial layer to a second top oxide.

摘要翻译： 提供了替换/重整存储单元的电荷存储元件周围的顶部氧化物的方法和提高存储单元的电荷存储元件周围的顶部氧化物的质量的方法。 该方法可以包括从存储器单元去除第一顶部氧化物上的第一多晶硅; 从存储器单元中去除第一顶部氧化物; 以及在所述电荷存储元件周围形成第二顶部氧化物。 可以通过氧化电荷存储元件的一部分或通过在电荷存储元件上形成牺牲层并将牺牲层氧化成第二顶部氧化物来形成第二顶部氧化物。