公开(公告)号：US20150303167A1

公开(公告)日：2015-10-22

申请号：US14790146

申请日：2015-07-02

Applicant: c/o SONY CORPORATION

Inventor： Satoru WAKIYAMA ,  Hiroshi OZAKI

IPC: H01L23/00 ,  H01L25/00

CPC classification number: H01L24/81 ,  H01L21/563 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/1134 ,  H01L2224/11416 ,  H01L2224/11436 ,  H01L2224/11825 ,  H01L2224/11848 ,  H01L2224/13019 ,  H01L2224/13076 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13655 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/8102 ,  H01L2224/81193 ,  H01L2224/81355 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81805 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2224/81951 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/15321 ,  H01L2924/15788 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2224/27416 ,  H01L2224/27436 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A semiconductor apparatus, including: a semiconductor component; a Cu stud bump that is formed on the semiconductor component; and a solder bump configured to electrically connect to the Cu stud bump.

Abstract translation: 一种半导体装置，包括：半导体元件; 形成在所述半导体部件上的Cu凸块; 以及被配置为电连接到所述Cu柱凸块的焊料凸块。