公开(公告)号：US09957423B2

公开(公告)日：2018-05-01

申请号：US14916348

申请日：2014-08-22

Applicant: TESA SE

Inventor： Marc Husemann ,  Jan Ellinger ,  Matthias Koop ,  Niko Lübbert

IPC: C09J7/02 ,  C09J133/06 ,  C09J5/00 ,  C09J133/14 ,  C09J11/06 ,  C09J133/04 ,  C08K5/11 ,  C08K5/20 ,  C08K5/3435 ,  C08K5/3475

CPC classification number: C09J133/06 ,  C08K5/11 ,  C08K5/20 ,  C08K5/3435 ,  C08K5/3475 ,  C08L2201/08 ,  C09J5/00 ,  C09J7/385 ,  C09J11/06 ,  C09J133/04 ,  C09J133/14 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2433/00

Abstract: The invention relates to an adhesive tape comprising at least one layer of a pressure-sensitive acrylate adhesive comprising a polymer component and at least one additive, where the polymer component is composed of one or more copolymers each based on the following monomers: a) from 5 to 35% by weight of one or more monomers containing hydroxy groups and having a copolymerizable double bond; b) from 0 to 50% by weight of one or more acrylate and/or methacrylate monomers each having at least one amide group, urethane group, urea group, or carboxylic anhydride unit and/or ethylene glycol unit, c) from 15 to 95% by weight of an alkyl (meth)acrylate, where the alkyl moiety has from 1 to 14 carbon atoms, where the pressure-sensitive acrylate adhesive comprises one or more 2-(2H-Benzotriazol-2-yl) derivatives admixed as additive; and also a corresponding adhesive.

公开(公告)号：US20230323170A9

公开(公告)日：2023-10-12

申请号：US17983188

申请日：2022-11-08

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14

CPC classification number: C09J175/04 ,  C08K5/14 ,  C09J2301/408 ,  C08L2666/66 ,  C08K5/0025

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US11535778B2

公开(公告)日：2022-12-27

申请号：US17051074

申请日：2019-04-26

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14 ,  C08K5/00

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US20210214593A1

公开(公告)日：2021-07-15

申请号：US17051074

申请日：2019-04-26

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US20230092613A1

公开(公告)日：2023-03-23

申请号：US17983188

申请日：2022-11-08

Applicant: tesa SE

Inventor： Marco Kupsky ,  Thilo Dollase ,  Matthias Koop ,  Philipp Preuss

IPC: C09J175/04 ,  C08K5/14

Abstract: The invention relates to an adhesive film which comprises a layer of an adhesive that comprises one or more polymers and at least one peroxide, characterized in that the adhesive comprises at last 50% by weight of thermoplastic polymers that do not have C═C multiple bonds, in that at least one peroxide has the general structural formula R—O—O—R′, wherein R and R′ each represent organyl groups or together represent a cyclic organyl group, and in that the peroxide in solution has a 1-minute half-life temperature of less than 200° C. In a preferred embodiment, the thermoplastic polymer is a polyurethane and the peroxide is a dicumyl peroxide.

公开(公告)号：US10808153B2

公开(公告)日：2020-10-20

申请号：US16097888

申请日：2017-04-18

Applicant: TESA SE

Inventor： Thilo Dollase ,  Markus Brodbeck ,  Alexander Fischer ,  Marco Kupsky ,  Matthias Koop

IPC: C09J133/06 ,  C09J5/00 ,  C09J107/00 ,  C09J121/00 ,  C09J123/00 ,  C09J123/04 ,  C09J123/08 ,  C09J123/10 ,  C09J123/18 ,  C09J133/08 ,  C09J133/10 ,  C09J163/00 ,  C09J175/04 ,  B32B27/26 ,  B32B27/30 ,  B32B27/32 ,  B32B27/38 ,  B32B27/40 ,  C08K5/00 ,  C08K5/19 ,  C09J179/00 ,  C08K5/17 ,  C08K5/02 ,  C08L33/06 ,  C08K5/45

Abstract: The invention relates to a thermally curable adhesive compound consisting of the following components: (A) 4.9 to 34.9 wt % (relative to the total amount of the curable adhesive compound) of an epoxide-functionalized (co)polymer having a weight-average molar mass in the range of 5,000 g/mol to 200,000 g/mol, based on more than 30 to 100 wt %, preferably 50 to 100 wt %, (relative to the total amount of the monomers on which the epoxide-functionalized (co)polymer is based) of at least one type of (meth)acrylic (co)monomer (a) functionalized with an epoxy group, (B) 0.1 to 5 wt % (relative to the total amount of the curable adhesive compound) of at least one thermally activatable curing agent for a cationic curing of epoxides, (C) 65 to 95 wt % (relative to the total amount of the curable adhesive compound) of at least one type of matrix polymer as a film-forming agent, (D) optionally 0 to 30 wt % of additional components.