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公开(公告)号：US09790606B2
公开(公告)日：2017-10-17
申请号：US14556154
申请日：2014-11-30
发明人： Koichi Yomogida
CPC分类号： C25D3/48 , C23C22/05 , C23C22/60 , C23F11/10 , C23F11/161 , C25D5/48 , H05K3/282 , H05K2203/122
摘要： To provide a surface treatment solution and treatment method for gold or gold alloy plating that effectively suppresses corrosion of underlying metal or substrate metal from pinholes that develop on the gold or gold alloy plating film.[Solution] A surface treatment solution containing a disulfide compound is brought into contact with a gold or gold alloy plating film. A compound represented by the following formula (2) is preferred as the disulfide compound. X1O3S—R3—S—S—R4—SO3X2 (2) in the formula, R3 and R4 independently represent a linear or branched alkylene group having from 1 to 10 carbon atoms, cyclic alkylene group having from 3 to 10 carbon atoms, or phenylene group, R3 and R4 independently may be substituted by one or more substituents selected from an alkyl group, halogen atom, hydroxyl group, or alkoxy group, and X1 and X2 represent monovalent cations.
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公开(公告)号：US09612217B2
公开(公告)日：2017-04-04
申请号：US14693818
申请日：2015-04-22
发明人： Matthew A. Thorseth
CPC分类号： G01N27/026 , C25D3/38 , C25D21/14
摘要： Electrochemical impedance spectroscopy is used to determine the amount of organic additive in a metal electroplating bath.
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公开(公告)号：US09076719B2
公开(公告)日：2015-07-07
申请号：US13972307
申请日：2013-08-21
IPC分类号： H01L21/38 , H01L21/22 , H01L21/225 , H01L21/04 , H01L21/385
CPC分类号： H01L21/2254 , H01L21/0455 , H01L21/2225 , H01L21/225 , H01L21/228 , H01L21/385
摘要： Disclosed herein is a method for doping a substrate, comprising disposing a coating of a composition comprising a dopant-containing polymer and a non-polar solvent on a substrate; and annealing the substrate at a temperature of 750 to 1300° C. for 1 second to 24 hours to diffuse the dopant into the substrate; wherein the dopant-containing polymer is a polymer having a covalently bound dopant atom; wherein the dopant-containing polymer is free of nitrogen and silicon; and wherein the method is free of a step of forming an oxide capping layer over the coating prior to the annealing step.
摘要翻译： 本文公开了一种用于掺杂衬底的方法，包括在衬底上设置包含含掺杂剂的聚合物和非极性溶剂的组合物的涂层; 并在750-1300℃的温度下退火衬底1秒至24小时以将掺杂剂扩散到衬底中; 其中所述含掺杂剂的聚合物是具有共价结合的掺杂剂原子的聚合物; 其中所述含掺杂剂的聚合物不含氮和硅; 并且其中所述方法没有在所述退火步骤之前在所述涂层上形成氧化物覆盖层的步骤。
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4.发明授权公开(公告)号：US08975001B2
公开(公告)日：2015-03-10
申请号：US13407508
申请日：2012-02-28
申请人： Young Cheol Bae , Rosemary Bell , Thomas Cardolaccia , Seung-Hyun Lee , Yi Liu , Jong Keun Park
发明人： Young Cheol Bae , Rosemary Bell , Thomas Cardolaccia , Seung-Hyun Lee , Yi Liu , Jong Keun Park
CPC分类号： G03F7/0397 , G03F7/091 , G03F7/2041 , G03F7/325
摘要： Provided are photoresist compositions useful in forming photolithographic patterns. Also provided are substrates coated with the photoresist compositions and methods of forming photolithographic patterns. The compositions, methods and coated substrates find particular applicability in the manufacture of semiconductor devices.
摘要翻译： 提供了可用于形成光刻图案的光致抗蚀剂组合物。 还提供了涂覆有光致抗蚀剂组合物的基材和形成光刻图案的方法。 组合物，方法和涂覆的基材在半导体器件的制造中具有特别的适用性。
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5.发明授权Self-assembled structures, method of manufacture thereof and articles comprising the same 有权自组装结构，其制造方法和包含该组合结构的制品公开(公告)号：US08822130B2
公开(公告)日：2014-09-02
申请号：US13681019
申请日：2012-11-19
CPC分类号： G03F7/2004 , C08F2438/03 , C08G2261/126 , C08G2261/136 , C08G2261/146 , G03F7/0046 , G03F7/038 , G03F7/0382 , G03F7/40
摘要： Disclosed herein is a composition comprising a graft block copolymer comprising a first block polymer; the first block polymer comprising a backbone polymer and a first graft polymer; where the first graft polymer comprises a surface energy reducing moiety; and a second block polymer; the second block polymer being covalently bonded to the first block; wherein the second block comprises the backbone polymer and a second graft polymer; where the second graft polymer comprises a functional group that is operative to crosslink the graft block copolymer; a photoacid generator; and a crosslinking agent.
摘要翻译： 本文公开了包含含有第一嵌段聚合物的接枝嵌段共聚物的组合物; 所述第一嵌段聚合物包含主链聚合物和第一接枝聚合物; 其中第一接枝聚合物包含表面能减少部分; 和第二嵌段聚合物; 第二嵌段聚合物共价键合到第一嵌段; 其中所述第二嵌段包含主链聚合物和第二接枝聚合物; 其中第二接枝聚合物包含可操作地交联接枝嵌段共聚物的官能团; 光致酸发生器; 和交联剂。
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公开(公告)号：US08697338B2
公开(公告)日：2014-04-15
申请号：US13607729
申请日：2012-09-09
申请人： Young Cheol Bae , Rosemary Bell , Jong Keun Park , Seung-Hyun Lee
发明人： Young Cheol Bae , Rosemary Bell , Jong Keun Park , Seung-Hyun Lee
IPC分类号： G03F7/26
CPC分类号： G03F7/11 , G03F7/0397 , G03F7/168 , G03F7/20 , G03F7/2041 , G03F7/325 , H01L21/3081
摘要： Provided are photoresist overcoat compositions, substrates coated with the overcoat compositions and methods of forming electronic devices by a negative tone development process. The compositions, coated substrates and methods find particular applicability in the manufacture of semiconductor devices.
摘要翻译： 提供光刻胶外涂层组合物，涂覆有外涂层组合物的基材和通过负色调显影方法形成电子器件的方法。 组合物，涂覆的基底和方法在半导体器件的制造中特别适用。
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公开(公告)号：US07919222B2
公开(公告)日：2011-04-05
申请号：US11698397
申请日：2007-01-26
摘要： Underlying coating compositions are provided for use with an overcoated photoresist composition. In one aspect, the coating composition can be crosslinked and comprise one or more components that contain one or more acid-labile groups and/or one or more base-reactive groups that are reactive following crosslinking. In another aspect, underlying coating composition are provided that can be treated to provide a modulated water contact angle. Preferred underlying coating compositions can exhibit enhanced etch rates in plasma etchants. Additional preferred coating compositions can enhance lithographic performance of an associated photoresist composition.
摘要翻译： 提供底涂层组合物用于外涂光致抗蚀剂组合物。 在一个方面，涂料组合物可以是交联的并且包含一种或多种含有一个或多个酸不稳定基团的组分和/或一个或多个在交联后是反应性的碱反应性基团。 在另一方面，提供了可以处理以提供调制水接触角的下面的涂料组合物。 优选的下层涂料组合物可以在等离子体蚀刻剂中显示出增强的蚀刻速率。 另外优选的涂料组合物可以增强相关光致抗蚀剂组合物的平版印刷性能。
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公开(公告)号：US10604856B2
公开(公告)日：2020-03-31
申请号：US15560228
申请日：2015-04-28
发明人： Lingli Duan , Chen Chen , Tong Sun , Zukhra I. Niazimbetova , Maria Anna Rzeznik
IPC分类号： C25D3/32 , C25D3/38 , C25D3/58 , C25D3/60 , C08G73/10 , C08G73/00 , C25D3/30 , C08K5/17 , H05K3/24 , C25D7/00
摘要： Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.
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公开(公告)号：US08815754B2
公开(公告)日：2014-08-26
申请号：US12969183
申请日：2010-12-15
申请人： Gerhard Pohlers
发明人： Gerhard Pohlers
IPC分类号： H01L21/31 , H01L21/469
CPC分类号： H01L21/266 , G03F7/0388 , G03F7/0392 , G03F7/0395 , G03F7/0397 , G03F7/40 , H01L21/0274 , H01L29/36
摘要： New photoresists are provided that comprise preferably as distinct components: a resin, a photoactive component and a phenolic component Preferred photoresists of the invention are can be useful for ion implant lithography protocols.
摘要翻译： 提供了新的光致抗蚀剂，其优选地包含不同的组分：树脂，光活性组分和酚组分。本发明的优选光刻胶可用于离子注入光刻方案。
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公开(公告)号：US20100216302A1
公开(公告)日：2010-08-26
申请号：US12655554
申请日：2009-12-31
申请人： Yu Luo , Neil D. Brown , Michael P. Toben
发明人： Yu Luo , Neil D. Brown , Michael P. Toben
IPC分类号： H01L21/768 , C25D3/60 , C25D7/12
摘要： Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
摘要翻译： 公开了用于在基材上沉积锡合金的电解质组合物。 电解质组合物包括锡离子，一种或多种合金金属的离子，黄酮化合物和二羟基双硫化物。 电解质组合物不含铅和氰化物。 还公开了在基板上沉积锡合金的方法以及在半导体器件上形成互连凸点的方法。
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