Apparatus and method for laser selective bonding technique for making sealed or enclosed microchannel structures
    10.
    发明申请
    Apparatus and method for laser selective bonding technique for making sealed or enclosed microchannel structures 审中-公开
    用于制造密封或封闭微通道结构的激光选择接合技术的装置和方法

    公开(公告)号:US20030071269A1

    公开(公告)日:2003-04-17

    申请号:US10271307

    申请日:2002-10-15

    Inventor: Ampere A. Tseng

    CPC classification number: B81B1/00 B01J2219/00781 B01J2219/00783 B01L3/5027

    Abstract: A method and apparatus for making sealed or closed microchannel structures in semiconductor wafers is disclosed. Two substrates, preferably a transparent cover substrate and an opaque base substrate, are used. The transparent cover substrate is placed over the opaque base substrate. By using the characteristics of the transparent material, electromagnetic waves are directed through the transparent cover substrate to the opaque base substrate. The laser beam heats the base substrate to its phase change temperature, melting the surface of the base substrate that is in contact with a surface of the cover substrate, coalescing the surfaces together and forming a sealed microchannel structure.

    Abstract translation: 公开了一种用于在半导体晶片中制造密封或闭合的微通道结构的方法和装置。 使用两个基板,优选为透明盖基板和不透明基板。 将透明盖基板放置在不透明基板上。 通过使用透明材料的特性,电磁波被引导通过透明盖基板到不透明基底。 激光束将基底基板加热到其相变温度,熔化与基底表面接触的基底基板的表面,将表面聚结在一起并形成密封的微通道结构。

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