公开(公告)号：US20060143908A1

公开(公告)日：2006-07-06

申请号：US11275319

申请日：2005-12-22

申请人： Pierre-Luc Duchesne ,  Pierre Laroche ,  Nicolas Tessier ,  Roch Thivierge ,  Stephane Vanier

发明人： Pierre-Luc Duchesne ,  Pierre Laroche ,  Nicolas Tessier ,  Roch Thivierge ,  Stephane Vanier

IPC分类号： H05K3/10 ,  A21C11/12

CPC分类号： B28D5/0011 ,  B28D5/0047 ,  H05K1/0306 ,  H05K3/0052 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T225/12 ,  Y10T225/325

摘要： A method and an apparatus for subdividing a sheet of brittle insulating material (a silicon wafer substrate) with a plurality of semiconductor chips disposed thereon and electrically bonded to respective underlying circuit blocks printed on the sheet to provide each chip with its own substrate. The chips are arranged in rows and columns separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the substrate in a flexible conformable carrier having a solid bottom and a top having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet; positioning a rigid convex, arched anvil parallel to the scribe lines in the row kerfs, pneumatically or hydraulically forcing the sheet containing carrier to conform to the arch of the anvil and thereby fracture the sheet along the scribe lines in the row kerfs lying parallel to the arch; removing the pneumatic force, rotating the anvil ninety degrees to parallel the scribe lines in the column kerfs, pneumatically forcing the conformable carrier against the rotated anvil to fracture the sheet along the scribe lines in the column kerfs, removing the pneumatic force, removing the carrier from the apparatus and removing the individualized chip bearing substrates from the carrier.

摘要翻译： 一种脆性绝缘材料薄片（硅晶片基片）与设置在其上的多个半导体芯片进行分割并与印刷在薄片上的各个底层电路块电连接以向每个芯片提供自己的衬底的方法和装置。 这些芯片被排列成行和列，每行和列分别包含相应的划线。 片材的细分通过将基底放置在具有固体底部的柔性适形载体中，并且顶部具有由肋形成的开放格栅，每个肋位于片材表面上的相应划线之上; 将刚性凸起的拱形砧平行于行切割中的划线，气动地或液压地迫使片材载体符合砧座的拱形，从而沿着平行于所述砧座的行切口中的划线断裂片材 拱; 去除气动力，使砧座旋转九十度以平行切割线中的划线，气动地迫使适形载体抵靠旋转的砧座沿着切线中的划线断裂片材，去除气动力，移除载体 从设备中取出个体化的承载芯片的载体。

公开(公告)号：US3615047A

公开(公告)日：1971-10-26

申请号：US3615047D

申请日：1969-06-30

申请人： BELL TELEPHONE LABOR INC

发明人： FELDMAN DAVID ,  SIBILIA JOHN T

IPC分类号： B28D5/00 ,  H01L21/00 ,  H01L21/302 ,  H01L49/02 ,  B26F3/00

CPC分类号： H01L21/67092 ,  B28D5/0047 ,  H01L21/302 ,  H01L49/02 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/30 ,  Y10T225/325

摘要： APPARATUS FOR SEPARATING A SCRIBED PLATE OF BRITTLE MATERIAL UTILIZES TWO FLEXIBLE MEMBRANES BETWEEN WHICH THE PLATE IS VACUUM CLAMPED. A UNIFORM FORCE SUCH AS FLUID PRESSURE FORCES THE MEMBRANES INTO A DIE WHICH CAUSES THE MEMBRANES TO TRANSMIT UNIAXIAL STRESSES TO THE PLATE TO SEPARATE IT ALONG SCRIBE LINES. SEPARATION ALONG A SET OF SCRIBE LINES ORTHOGONAL TO THE FIRST SET IS ACHIEVED BY USING A DIE WHICH IS ORTHOGONAL TO THE FIRST DIE.

公开(公告)号：US20100194011A1

公开(公告)日：2010-08-05

申请号：US12364183

申请日：2009-02-02

申请人： Chester Hann Huei Chang ,  Michael John Moore ,  Michael Yoshiya Nishimoto ,  Chunhe Zhang

发明人： Chester Hann Huei Chang ,  Michael John Moore ,  Michael Yoshiya Nishimoto ,  Chunhe Zhang

IPC分类号： B23Q3/02 ,  B24C3/04 ,  B24C1/04

CPC分类号： H01L21/78 ,  B28D5/0047 ,  B28D5/0052 ,  B33Y80/00 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T83/0591 ,  Y10T83/364

摘要： Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to dice the material sheet when suspended.

摘要翻译： 方法和设备提供将受控的气体供给到至少一个航空机械装置以赋予气流以悬浮材料片材; 防止材料片在悬挂时在至少一个方向上的横向移动; 并且从与所述至少一个航空机械装置相对的所述材料片的一侧施加水流，以在悬挂时切割所述材料片。

公开(公告)号：US07559446B2

公开(公告)日：2009-07-14

申请号：US11275319

申请日：2005-12-22

申请人： Pierre-Luc Duchesne ,  Pierre Laroche ,  Nicolas Tessier ,  Roch Thivierge ,  Stephane Vanier

发明人： Pierre-Luc Duchesne ,  Pierre Laroche ,  Nicolas Tessier ,  Roch Thivierge ,  Stephane Vanier

IPC分类号： B26F3/00

CPC分类号： B28D5/0011 ,  B28D5/0047 ,  H05K1/0306 ,  H05K3/0052 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T225/12 ,  Y10T225/325

摘要： An apparatus for subdividing a sheet of brittle insulating material with a plurality of semiconductor chips disposed thereon. The chips are separated by row and column kerfs each of which contains a respective scribed line. The subdivision of the sheet is accomplished by placing the sheet in a flexible conformable carrier having an open grid, formed of ribs, with each rib positioned over a respective scribe line on the surface of the sheet and forcing the sheet against an arched anvil, thereby fracturing the sheet along the scribe lines.

摘要翻译： 一种用于将脆性绝缘材料薄片与设置在其上的多个半导体芯片分开的装置。 芯片由行和列切口分开，每个切口都包含相应的划线。 片材的细分通过将片材放置在具有由肋形成的开放格栅的柔性适形载体中来实现，每个肋条位于片材表面上的相应划线之上，并且迫使片材抵靠拱形砧座，由此 沿着划线压裂片材。

公开(公告)号：US20180009130A1

公开(公告)日：2018-01-11

申请号：US15543897

申请日：2016-01-13

申请人： SILTECTRA GmbH

发明人： Jan Richter

IPC分类号： B28D5/00

CPC分类号： B26F3/06 ,  B28D5/0047 ,  H01L21/84

摘要： The present invention relates to a device (1) for separating at least one wafer from a donor substrate (2). The device (1) according to the invention comprises at least a housing (4) with a receiving space (6) for receiving at least one multi-layer arrangement (8) which consists of at least one donor substrate (2) and a receiving layer (10) arranged or generated thereon, and an application device (12) for the contactless application of the multi-layer arrangement (8) for generating crack-conducting stresses in the multi-layer arrangement (8).

公开(公告)号：US20130302971A1

公开(公告)日：2013-11-14

申请号：US13946490

申请日：2013-07-19

申请人： CORNING INCORPORATED

发明人： Chester Hann Huei Chang ,  Michael John Moore ,  Michael Yoshiya Nishimoto ,  Chunhe Zhang

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B28D5/0047 ,  B28D5/0052 ,  B33Y80/00 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T83/0591 ,  Y10T83/364

摘要： Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to dice the material sheet when suspended.

摘要翻译： 方法和设备提供将受控的气体供给到至少一个航空机械装置以赋予气流以悬浮材料片材; 防止材料片在悬挂时在至少一个方向上的横向移动; 并且从与所述至少一个航空机械装置相对的所述材料片的一侧施加水流，以在悬挂时切割所述材料片。

公开(公告)号：US5527744A

公开(公告)日：1996-06-18

申请号：US342988

申请日：1994-11-21

申请人： Michael A. Mignardi ,  Rafael C. Alfaro

发明人： Michael A. Mignardi ,  Rafael C. Alfaro

IPC分类号： B28D5/00 ,  B81C1/00 ,  B81C99/00 ,  H01L21/301 ,  H01L21/304 ,  H01L21/78

CPC分类号： B81C1/00896 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0047 ,  H01L21/304 ,  H01L21/3043 ,  H01L21/78 ,  Y10S148/028 ,  Y10T156/1064 ,  Y10T225/12

摘要： A process for partially sawing the streets on semiconductor wafers. After sawing the streets can be covered by a protective material, and then the wafer continues its processing as before. After the wafer is broken, the protective material may or may not be removed. Additionally, the wafer may be broken into individual chips using a wedge piece that has a number of individual wedges on it, where the individual wedges press against the partially sawn streets, causing the wafer to break.

摘要翻译： 在半导体晶片上部分锯切街道的过程。 锯切之后，街道可以被保护材料覆盖，然后晶片像以前一样继续其处理。 在晶片破裂之后，保护材料可能会被剥离，也可能不会被去除。 此外，可以使用在其上具有多个单独的楔块的楔形块将晶片破碎成单独的芯片，其中各个楔块压靠部分锯割的街道，导致晶片断裂。

公开(公告)号：US3507426A

公开(公告)日：1970-04-21

申请号：US3507426D

申请日：1968-02-23

申请人： RCA CORP

发明人： BIELEN JOSEPH M ,  MORRIS GILBERT V

IPC分类号： B28D5/00 ,  H01L21/304 ,  B26F3/00

CPC分类号： H01L21/3043 ,  B28D5/0047 ,  Y10T225/12 ,  Y10T225/325

公开(公告)号：US11691313B2

公开(公告)日：2023-07-04

申请号：US16745614

申请日：2020-01-17

申请人： DISCO CORPORATION

发明人： Toshiyasu Rikiishi ,  Yasushi Katagiri

IPC分类号： H01L21/304 ,  B28D5/00 ,  H01L21/67

CPC分类号： B28D5/0047 ,  H01L21/3043 ,  H01L21/67092 ,  H01L21/6704

摘要： A processing apparatus includes a chuck table for holding a workpiece, a processing unit for processing the workpiece held on the chuck table as supplying a processing water to the workpiece, and a water pan fixed to a bottom of the processing apparatus for receiving the processing water as a water leaked.

公开(公告)号：US08528886B2

公开(公告)日：2013-09-10

申请号：US12364183

申请日：2009-02-02

申请人： Chester Hann Huei Chang ,  Michael John Moore ,  Michael Yoshiya Nishimoto ,  Chunhe Zhang

发明人： Chester Hann Huei Chang ,  Michael John Moore ,  Michael Yoshiya Nishimoto ,  Chunhe Zhang

IPC分类号： B23Q3/00 ,  B25B1/00 ,  B25B11/00 ,  B65G25/00 ,  H01L21/302 ,  B24B49/00

CPC分类号： H01L21/78 ,  B28D5/0047 ,  B28D5/0052 ,  B33Y80/00 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6838 ,  Y10T83/0591 ,  Y10T83/364

摘要： Methods and apparatus provide for delivering a controlled supply of gas to at least one aero-mechanical device to impart a gas flow to suspend a material sheet; preventing lateral movement of the material sheet in at least one direction when suspended; and imparting a stream of water, from a side of the material sheet opposite the at least one aero-mechanical device, to cut the material sheet when suspended.

摘要翻译： 方法和设备提供将受控的气体供给到至少一个航空机械装置以赋予气流以悬浮材料片材; 防止材料片在悬挂时在至少一个方向上的横向移动; 并且从与所述至少一个航空机械装置相对的所述材料片的一侧施加水流，以在悬挂时切割所述材料片。