-
公开(公告)号：US20130129970A1
公开(公告)日：2013-05-23
申请号：US13716593
申请日：2012-12-17
申请人： THE BOEING COMPANY
IPC分类号： B32B3/18
CPC分类号： B32B3/18 , B23B3/04 , B29C65/00 , B29C66/01 , B29C66/05 , B29C66/10 , B29C66/11 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/1142 , B29C66/118 , B29C66/1182 , B29C66/122 , B29C66/128 , B32B3/04 , B32B3/06 , B32B3/12 , B32B3/14 , B32B2250/03 , B32B2307/718 , B32B2605/18 , Y10T29/49622 , Y10T29/49982 , Y10T156/10 , Y10T156/1002 , Y10T156/1034 , Y10T156/1093 , Y10T428/239 , Y10T428/24174 , Y10T428/24752 , Y10T428/24777 , Y10T428/249923
摘要： A composite sandwich structure comprises a core sandwiched between composite laminate facesheets. The core includes a plurality of core sections spliced together at joints that incorporate integral features for arresting the propagation of irregularities in the facesheets.
-
公开(公告)号：US20090236028A1
公开(公告)日：2009-09-24
申请号：US12093738
申请日：2006-11-17
申请人： Hiroshi Fukuda
发明人： Hiroshi Fukuda
CPC分类号： B23K20/1265 , B21J5/063 , B21K25/005 , B23K20/127 , B29C65/0681 , B29C65/561 , B29C65/562 , B29C65/606 , B29C65/607 , B29C65/609 , B29C66/11 , B29C66/1122 , B29C66/1162 , B29C66/1282 , B29C66/12841 , B29C66/14 , B29C66/43 , B29C66/81429 , B29C66/8322
摘要： A method for joining materials in which a second material is overlapped over a first material preliminarily formed with a joining hole so as to cover the joining hole. A joining tool arranged in alignment with the joining hole is pressed, while rotated, onto the second material so as to locally soften and enter the second material in solid phase state into the joining hole of the first material through frictional heat generated between the joining tool and the second material. The joining tool is pulled out after a geometric engaging part is provided by the second material in relation with the first material and the engaging part is allowed to harden to join the first and second materials.
摘要翻译： 一种接合材料的方法，其中第二材料重叠在预先形成有接合孔的第一材料上以覆盖接合孔。 与接合孔对准布置的接合工具在旋转的同时被按压到第二材料上，以便通过在连接工具之间产生的摩擦热来局部地软化并以固相状态将第二材料进入第一材料的接合孔 和第二种材料。 在由第二材料相对于第一材料提供几何接合部分之后拉出接合工具，并且允许接合部分硬化以连接第一和第二材料。
-
3.发明授权Methods for joining electronic device housing structures using heat activated thermoset film 有权使用热活化热固性薄膜连接电子设备外壳结构的方法公开(公告)号：US09044898B2
公开(公告)日：2015-06-02
申请号：US13438605
申请日：2012-04-03
IPC分类号： B29C65/18 , H05K13/08 , B29C65/20 , B29C65/34 , B29C65/48 , B29C65/50 , B29C65/00 , H05K5/00 , B29L31/34 , B29C65/16 , B29C65/02
CPC分类号： B29C65/20 , B29C65/02 , B29C65/16 , B29C65/18 , B29C65/3444 , B29C65/3468 , B29C65/3476 , B29C65/348 , B29C65/4835 , B29C65/5057 , B29C66/11 , B29C66/1142 , B29C66/1224 , B29C66/1226 , B29C66/12443 , B29C66/12463 , B29C66/54 , B29C66/71 , B29C66/72321 , B29C66/73921 , B29C66/83221 , B29C66/91411 , B29C66/91431 , B29C66/91655 , B29C66/919 , B29C66/91945 , B29L2031/3481 , H05K5/0004 , H05K13/08 , Y10T156/1052 , B29K2055/02 , B29K2069/00
摘要： An electronic device may have electronic components enclosed within a plastic housing. The plastic housing may include housing members that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip of metal that is placed along a joint between the housing members. The temperature of the metal strip and associated layers of the thermoset polymer film may be raised by applying current to the metal strip using an external tool or the electronic components within the housing. Heat activated thermoset polymer film may be heated using a reactive multilayer metal foil. Heat sink layers of metal may be interposed between the reactive multilayer metal foil and the thermoset polymer film. A heated metal ring or a heated edge portion of a plastic housing member may also be used to heat the thermoset polymer film.
摘要翻译： 电子设备可以具有封装在塑料外壳内的电子部件。 塑料壳体可以包括使用热活化的热固性聚合物膜连接的壳体构件。 热活化的热固性聚合物膜可以使用诸如沿着壳体构件之间的接头放置的金属条的金属结构进行加热。 可以通过使用外部工具或壳体内的电子部件向金属带施加电流来提高金属带和热固性聚合物膜的相关层的温度。 可以使用反应性多层金属箔来加热热活化的热固性聚合物膜。 金属的散热层可以介于反应性多层金属箔和热固性聚合物膜之间。 加热的金属环或塑料外壳构件的加热边缘部分也可用于加热热固性聚合物膜。
-
公开(公告)号：US20130206504A1
公开(公告)日：2013-08-15
申请号：US13797127
申请日：2013-03-12
发明人： Tongan Wang , John Maxon , Andrew Foose , David Charles Hornick , Josef Fila
IPC分类号： B64C1/40
CPC分类号： B64C1/40 , B29C65/00 , B29C66/11 , B29C66/1122 , B29C66/1142 , B29C66/43 , B29K2105/04 , B32B3/12 , B32B5/26 , B32B5/32 , B32B7/02 , B32B2250/02 , B32B2250/03 , B32B2250/04 , B32B2250/05 , B32B2250/20 , B32B2250/22 , B32B2266/0257 , B32B2266/0285 , B32B2266/06 , B32B2307/102 , B32B2307/718 , B32B2605/18 , B64C1/00 , E04B1/82 , E04B1/84 , G10K11/00 , G10K11/02 , Y02T50/46 , Y10T428/24149
摘要： Embodiments of thermal-acoustic sections for an aircraft for reducing noise along an acoustic path produced from an acoustic source are provided herein. The thermal-acoustic section comprises a first porous layer having a first characteristic acoustic impedance. A second porous layer is disposed adjacent to the first porous layer and has a second characteristic acoustic impedance that is greater than the first characteristic acoustic impedance. The thermal-acoustic section is configured to be positioned along the acoustic path such that at least a portion of the noise from the acoustic source is directed through the first porous layer to the second porous layer to promote absorption of the noise.
摘要翻译： 本文提供了用于从声源产生的用于降低沿着声学路径的噪声的用于飞行器的热声部分的实施例。 热声部分包括具有第一特征声阻抗的第一多孔层。 第二多孔层设置成与第一多孔层相邻并且具有大于第一特征声阻抗的第二特征声阻抗。 热声部分被配置成沿着声学路径定位，使得来自声源的噪声的至少一部分被引导通过第一多孔层到第二多孔层以促进噪声的吸收。
-
公开(公告)号：US09216556B2
公开(公告)日：2015-12-22
申请号：US14644348
申请日：2015-03-11
申请人： The Boeing Company
CPC分类号： B32B3/18 , B23B3/04 , B29C65/00 , B29C66/01 , B29C66/05 , B29C66/10 , B29C66/11 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/1142 , B29C66/118 , B29C66/1182 , B29C66/122 , B29C66/128 , B32B3/04 , B32B3/06 , B32B3/12 , B32B3/14 , B32B2250/03 , B32B2307/718 , B32B2605/18 , Y10T29/49622 , Y10T29/49982 , Y10T156/10 , Y10T156/1002 , Y10T156/1034 , Y10T156/1093 , Y10T428/239 , Y10T428/24174 , Y10T428/24752 , Y10T428/24777 , Y10T428/249923
摘要： A composite sandwich structure comprises a core sandwiched between composite laminate facesheets. The core includes a plurality of core sections spliced together at joints that incorporate integral features for arresting the propagation of irregularities in the facesheets.
摘要翻译： 复合夹层结构包括夹在复合层压板之间的芯。 芯包括在接头处拼接在一起的多个芯部分，其包含用于阻止面板中的凹凸的传播的整体特征。
-
公开(公告)号：US20140216845A1
公开(公告)日：2014-08-07
申请号：US14096833
申请日：2013-12-04
发明人： Tongan Wang , John Maxon , Andrew Foose , David Charles Hornick , Josef Fila
IPC分类号： B64C1/40
CPC分类号： B64C1/40 , B29C65/00 , B29C66/11 , B29C66/1122 , B29C66/1142 , B29C66/43 , B29K2105/04 , B32B3/12 , B32B5/26 , B32B5/32 , B32B7/02 , B32B2250/02 , B32B2250/03 , B32B2250/04 , B32B2250/05 , B32B2250/20 , B32B2250/22 , B32B2266/0257 , B32B2266/0285 , B32B2266/06 , B32B2307/102 , B32B2307/718 , B32B2605/18 , B64C1/00 , E04B1/82 , E04B1/84 , G10K11/00 , G10K11/02 , Y02T50/46 , Y10T428/24149
摘要： Embodiments of thermal-acoustic sections for an aircraft for reducing noise along an acoustic path produced from an acoustic source are provided herein. The thermal-acoustic section comprises a first porous layer having a first characteristic acoustic impedance. A second porous layer is disposed adjacent to the first porous layer and has a second characteristic acoustic impedance that is greater than the first characteristic acoustic impedance. The thermal-acoustic section is configured to be positioned along the acoustic path such that at least a portion of the noise from the acoustic source is directed through the first porous layer to the second porous layer to promote absorption of the noise.
摘要翻译： 本文提供了用于从声源产生的用于降低沿着声学路径的噪声的用于飞行器的热声部分的实施例。 热声部分包括具有第一特征声阻抗的第一多孔层。 第二多孔层设置成与第一多孔层相邻并且具有大于第一特征声阻抗的第二特征声阻抗。 热声部分被配置成沿着声学路径定位，使得来自声源的噪声的至少一部分被引导通过第一多孔层到第二多孔层以促进噪声的吸收。
-
7.发明申请Methods for Joining Electronic Device Housing Structures Using Heat Activated Thermoset Film 有权使用热活化热固性膜连接电子设备外壳结构的方法公开(公告)号：US20130255875A1
公开(公告)日：2013-10-03
申请号：US13438605
申请日：2012-04-03
IPC分类号： H05K13/00
CPC分类号： B29C65/20 , B29C65/02 , B29C65/16 , B29C65/18 , B29C65/3444 , B29C65/3468 , B29C65/3476 , B29C65/348 , B29C65/4835 , B29C65/5057 , B29C66/11 , B29C66/1142 , B29C66/1224 , B29C66/1226 , B29C66/12443 , B29C66/12463 , B29C66/54 , B29C66/71 , B29C66/72321 , B29C66/73921 , B29C66/83221 , B29C66/91411 , B29C66/91431 , B29C66/91655 , B29C66/919 , B29C66/91945 , B29L2031/3481 , H05K5/0004 , H05K13/08 , Y10T156/1052 , B29K2055/02 , B29K2069/00
摘要： An electronic device may have electronic components enclosed within a plastic housing. The plastic housing may include housing members that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip of metal that is placed along a joint between the housing members. The temperature of the metal strip and associated layers of the thermoset polymer film may be raised by applying current to the metal strip using an external tool or the electronic components within the housing. Heat activated thermoset polymer film may be heated using a reactive multilayer metal foil. Heat sink layers of metal may be interposed between the reactive multilayer metal foil and the thermoset polymer film. A heated metal ring or a heated edge portion of a plastic housing member may also be used to heat the thermoset polymer film.
摘要翻译： 电子设备可以具有封装在塑料外壳内的电子部件。 塑料壳体可以包括使用热活化的热固性聚合物膜连接的壳体构件。 热活化的热固性聚合物膜可以使用诸如沿着壳体构件之间的接头放置的金属条的金属结构进行加热。 可以通过使用外部工具或壳体内的电子部件向金属带施加电流来提高金属带和热固性聚合物膜的相关层的温度。 可以使用反应性多层金属箔来加热热活化的热固性聚合物膜。 金属的散热层可以介于反应性多层金属箔和热固性聚合物膜之间。 加热的金属环或塑料外壳构件的加热边缘部分也可用于加热热固性聚合物膜。
-
8.发明申请公开(公告)号：US20110135887A1
公开(公告)日：2011-06-09
申请号：US12631029
申请日：2009-12-04
CPC分类号： B32B3/18 , B23B3/04 , B29C65/00 , B29C66/01 , B29C66/05 , B29C66/10 , B29C66/11 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/1142 , B29C66/118 , B29C66/1182 , B29C66/122 , B29C66/128 , B32B3/04 , B32B3/06 , B32B3/12 , B32B3/14 , B32B2250/03 , B32B2307/718 , B32B2605/18 , Y10T29/49622 , Y10T29/49982 , Y10T156/10 , Y10T156/1002 , Y10T156/1034 , Y10T156/1093 , Y10T428/239 , Y10T428/24174 , Y10T428/24752 , Y10T428/24777 , Y10T428/249923
摘要： A composite sandwich structure comprises a core sandwiched between composite laminate facesheets. The core includes a plurality of core sections spliced together at joints that incorporate integral features for arresting the propagation of irregularities in the facesheets.
摘要翻译： 复合夹层结构包括夹在复合层压板之间的芯。 芯包括在接头处拼接在一起的多个芯部分，其包含用于阻止面板中的凹凸的传播的整体特征。
-
公开(公告)号：US20180169958A1
公开(公告)日：2018-06-21
申请号：US15736771
申请日：2016-06-15
申请人： EJOT GmbH & Co. KG
发明人： Mirko BECKER , Steffen LORENZ , Ingo KRAUSSER
CPC分类号： B29C65/06 , B29C65/0672 , B29C65/069 , B29C65/56 , B29C65/602 , B29C65/607 , B29C66/11 , B29C66/1122 , B29C66/21 , B29C66/41 , B29C66/474 , B29C66/49 , B29C66/53 , B29C66/7392 , B29C66/81429 , B29C66/81431 , B29C66/83221 , B29L2031/7288 , F16B5/04 , F16B37/065
摘要： The invention relates to a method for producing a component bond (70, 140) comprising: a fastening structure (60, 160) that has at least one component layer (60A, 60a; 160a, 160b); and a thermoplastic connecting element (10, 110) having a head (12, 112) and a shank (14, 114), in which method the connecting element (10, 110) is driven into the fastening structure (60, 160) under pressure whilst rotating, such that the shank (14, 114) penetrates the fastening structure (60, 160). The connecting element (10, 110), after penetrating the fastening structure (60, 160), is converted by friction into a softened, free-flowing state in a die (44, 144) which is placed against the fastening structure (60, 160) in the opposite direction to the driving direction, resulting in a thicker section (22, 22) that extends beyond the radial extent of some sections of the shank (14, 114). The fastening structure (60, 160) is thus interlockingly held between the head (12, 112) and the thicker section (22, 122).
-
公开(公告)号：US20150183181A1
公开(公告)日：2015-07-02
申请号：US14644348
申请日：2015-03-11
申请人： The Boeing Company
CPC分类号： B32B3/18 , B23B3/04 , B29C65/00 , B29C66/01 , B29C66/05 , B29C66/10 , B29C66/11 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/1142 , B29C66/118 , B29C66/1182 , B29C66/122 , B29C66/128 , B32B3/04 , B32B3/06 , B32B3/12 , B32B3/14 , B32B2250/03 , B32B2307/718 , B32B2605/18 , Y10T29/49622 , Y10T29/49982 , Y10T156/10 , Y10T156/1002 , Y10T156/1034 , Y10T156/1093 , Y10T428/239 , Y10T428/24174 , Y10T428/24752 , Y10T428/24777 , Y10T428/249923
摘要： A composite sandwich structure comprises a core sandwiched between composite laminate facesheets. The core includes a plurality of core sections spliced together at joints that incorporate integral features for arresting the propagation of irregularities in the facesheets.
摘要翻译： 复合夹层结构包括夹在复合层压板之间的芯。 芯包括在接头处拼接在一起的多个芯部分，其包含用于阻止面板中的凹凸的传播的整体特征。
-
-
-
-
-
-
-
-
-
搜索结果
19 条记录 (耗时 0.011 秒)