摘要:
The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided.
摘要:
Provided is a curable compound having a low melting temperature, having excellent workability as a result of having good solvent solubility, and being capable of forming a cured product having excellent heat resistance. The curable compound according to an embodiment of the present invention includes the following characteristics (a) to (e). (a) Number average molecular weight (calibrated with polystyrene standard): 1000 to 15000. (b) Proportion of a structure derived from an aromatic ring in the total amount of the curable compound: 50 wt. % or greater. (c) Solvent solubility at 25° C.: 1 g/100 g or greater. (d) Glass transition temperature: 280° C. or lower. (e) 5% Weight loss temperature (Td5) measured at a rate of temperature increase of 10° C./min (in nitrogen), for a cured product of the curable compound: 300° C. or higher.
摘要:
The present invention relates to an organopolysiloxane compound which is either a linear or a branched, and having at least one unit of the following formula (1) as a partial structure, and according to this compound, a novel polyorganosiloxane compound having an ethynyl group, and a method for preparing a linear organopolysiloxane compound having ethynyl groups at both terminals of a molecular chain which can easily adjust a polymerization degree, and excellent in productivity can be provided.