Abstract:
Disclosed is an integrated circuit (IC) chip incorporating a temperature-sensitive element and temperature stabilization circuitry for ensuring that the temperature of the temperature-sensitive element (TSE) remains essentially constant. The IC chip comprises a temperature-sensitive element and, within at least one region adjacent to the temperature-sensitive element, a first circuit that radiates a first heat amount to the TSE and a second circuit that radiates a second heat amount to the TSE. The second circuit senses changes in a first current amount in the first circuit and, thereby changes in the first heat amount. In response to those changes, the second circuit also automatically adjusts a second current amount in the second circuit and, thereby the second heat amount in order to ensure that the total heat amount radiated by the first circuit and the second circuit, in combination, to the TSE remains constant. Also disclosed is an associated method.
Abstract:
A sensor comprises a substrate having a first surface; a cap structure connected to the substrate, the cap structure configured to define a cavity between an inner surface of the cap structure and the first surface of the substrate, the cap structure configured to block infrared radiation from entering the cavity from outside the cap structure; a plurality of absorbers, each absorber in the plurality of absorbers being connected to the first surface of the substrate and arranged at a respective position within the cavity and configured to absorb infrared radiation at the respective position within the cavity; and a plurality of readout circuits, each readout circuit in the plurality of readout circuits being connected to a respective absorber in the plurality of absorbers and configured to provide a measurement signal that indicates an amount of infrared radiation absorbed by the respective absorber.
Abstract:
A semiconductor device for measuring IR radiation is disclosed. It comprises a substrate and a cap enclosing a cavity, a sensor pixel in the cavity, comprising a first absorber for receiving said IR radiation, a first heater, first temperature measurement means for measuring a first temperature; a reference pixel in the same cavity, comprising a second absorber shielded from said IR radiation, a second heater, and second temperature measurement means for measuring a second temperature; a control circuit for applying a first/second power to the first/second heater such that the first temperature equals the second temperature; and an output circuit for generating an output signal indicative of the IR radiation based on a difference between the first and second power.
Abstract:
Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. The innovation actively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. A temperature monitor and controller are employed to regulate power to resistive temperature devices (RTDs) thereby regulating current (and power) to the RTDs. As a result, temperatures of IR visible objects can be actively stabilized for changes, for example, changes in ambient temperatures, resulting in efficient and accurate temperature readings.
Abstract:
Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. The innovation actively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. A temperature monitor and controller are employed to regulate power to resistive temperature devices (RTDs) thereby regulating current (and power) to the RTDs. As a result, temperatures of IR visible objects can be actively stabilized for changes, for example, changes in ambient temperatures, resulting in efficient and accurate temperature readings.
Abstract:
A unit cell inspecting device includes an inspection unit which captures an image of an edge of a unit cell using long-wave infrared rays and measures a position of an edge of an electrode provided in the unit cell. The inspection unit includes: a main heating part configured to heat the edge of the unit cell, thereby raising a temperature of the edge of the electrode provided in the unit cell; and an image capturing part configured to capture the image of the edge of the unit cell by using the long-wave infrared rays, thereby acquiring a thermal image of the edge of the electrode provided in the unit cell; and an inspection part configured to measure the edge of the electrode in the thermal image captured by the image capturing part, thereby measuring the position of the electrode by using the measured edge of the electrode.
Abstract:
A semiconductor device for measuring IR radiation is disclosed. It comprises a substrate and a cap enclosing a cavity, a sensor pixel in the cavity, comprising a first absorber for receiving said IR radiation, a first heater, first temperature measurement means for measuring a first temperature; a reference pixel in the same cavity, comprising a second absorber shielded from said IR radiation, a second heater, and second temperature measurement means for measuring a second temperature; a control circuit for applying a first/second power to the first/second heater such that the first temperature equals the second temperature; and an output circuit for generating an output signal indicative of the IR radiation based on a difference between the first and second power.
Abstract:
A layered infrared emitter structure includes only semi-transparent metal layers, preferably one semi-transparent metal layer, and one or more dielectric layers on both sides of the semi-transparent metal layer. Further, an electric heating wiring is arranged in or between any of the dielectric layers to heat the semi-transparent metal layer up to a required infrared emission temperature, preferably to a temperature within a range from 400° C. to 1000° C.
Abstract:
Infrared (IR) temperature measurement and stabilization systems, and methods related thereto are provided. One or more embodiments passively stabilizes temperatures of objects in proximity and within the path between an infrared (IR) sensor and target object. A protective housing may encase an IR sensor, which may include a sensing element or IR element, a circuit or signal processor, and a housing seal plug. The IR element may be thermally bonded with a frame or conductive top hat.
Abstract:
A heater (15) for a sensor (10) comprises a substrate (20), an electrically conductive heating structure (21) on the substrate (20), and one or more connecting portions (28) for electrically connecting the heating structure (21) to one or more outside terminals (14) of the sensor (10). The substrate (20) is rigid and can comprise ceramics, preferably alumina ceramics.