THERMOMETER
    1.
    发明申请
    THERMOMETER 审中-公开

    公开(公告)号:US20190195697A1

    公开(公告)日:2019-06-27

    申请号:US14123125

    申请日:2012-05-25

    摘要: The invention relates to a thermometer, especially for determining the winding temperature of an electric power transformer. The invention is characterised in that, in a thermometer for determining the winding temperature of an electric power transformer, an electric temperature sensor, a mechanical temperature sensor and a heating element are arranged inside a coupling part formed from a heat-conductive material, and an insulating sleeve consisting of a thermally stable material is provided between an outer wall of the coupling part and an inner wall of the housing, the housing, the insulating sleeve and the coupling part forming a coaxial structure without leaving any air gaps such that thus definable heat transfers are generated between the individual components, namely the coupling part, the insulating sleeve and the tubular housing.

    Solid thermal simulator sensing device
    3.
    发明授权
    Solid thermal simulator sensing device 有权
    固体热敏模拟感测装置

    公开(公告)号:US09470587B1

    公开(公告)日:2016-10-18

    申请号:US13969141

    申请日:2013-08-16

    IPC分类号: G01K1/00 G01K15/00

    CPC分类号: G01K15/005 G01K2007/422

    摘要: A solid thermal simulator sensing device, the device can simulate and sense the thermal characteristics of a perishable element and is easily calibrated to a verifiable standard. The device is fabricated from a single piece of solid material sized to have a thermal mass substantially equal to that of said perishable element. A sensing channel is located within the single piece of solid material. The sensing channel extends from one end towards the center. A temperature sensor is mounted within the sensing channel. The thermal response time of the device is slowed by the single piece of solid material to mimic the thermal properties of the perishable element. A calibration channel is extends from the outer surface of the device to a point adjacent the temperature sensor. A calibration probe may be inserted into the calibration channel to quickly verify the accuracy of the device.

    摘要翻译: 一种固体热敏模拟感测装置,该装置可以模拟和感测易变元素的热特性,并且易于校准到可验证的标准。 该装置由单片固体材料制成,其尺寸设定成具有基本上等于所述易损元件的热质量的热质量。 感测通道位于单片固体材料内。 感测通道从一端向中心延伸。 温度传感器安装在传感通道内。 该装置的热响应时间由单片固体材料减慢,以模拟易变元素的热性能。 校准通道从设备的外表面延伸到与温度传感器相邻的点。 可以将校准探针插入到校准通道中,以快速验证器件的精度。

    CALIBRATING THERMAL BEHAVIOR OF ELECTRONICS
    4.
    发明申请
    CALIBRATING THERMAL BEHAVIOR OF ELECTRONICS 有权
    校准电子的热行为

    公开(公告)号:US20160252408A1

    公开(公告)日:2016-09-01

    申请号:US15154448

    申请日:2016-05-13

    IPC分类号: G01K15/00 G01K7/02

    摘要: A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.

    摘要翻译: 一种方法包括在校准过程期间确定处理器的间接热数据与与处理器相关联的测量温度之间的关系,在处理器的实际操作期间获得处理器的间接热数据,以及确定与处理器相关联的实际显着温度 处理器在实际操作期间使用间接热量数据为处理器在处理器的实际操作过程中与之关系。

    TEMPERATURE TELEMETRY IN PROCESSING OF MATERIAL
    5.
    发明申请
    TEMPERATURE TELEMETRY IN PROCESSING OF MATERIAL 有权
    材料加工温度测试

    公开(公告)号:US20100203227A1

    公开(公告)日:2010-08-12

    申请号:US12670084

    申请日:2008-07-23

    IPC分类号: B05D1/02 G01K13/00

    摘要: In the process of coating pharmaceutical tablets in a moving bed, the temperature of the tablets is measured by incorporating a temperature transducer in the form of tablet into the bed of tablets, and transmitting temperature data to an external receiver by wireless telemetry.

    摘要翻译: 在移动床上涂覆药物片剂的过程中,通过将片剂形式的温度传感器并入片剂床中并通过无线遥测将温度数据传送到外部接收器来测量片剂的温度。

    SUBSTRATE FOR TEMPERATURE MEASUREMENT AND TEMPERATURE MEASURING SYSTEM
    6.
    发明申请
    SUBSTRATE FOR TEMPERATURE MEASUREMENT AND TEMPERATURE MEASURING SYSTEM 审中-公开
    温度测量和温度测量系统基板

    公开(公告)号:US20080144695A1

    公开(公告)日:2008-06-19

    申请号:US11947629

    申请日:2007-11-29

    申请人: Tetsuya Hamada

    发明人: Tetsuya Hamada

    IPC分类号: G01K11/00

    摘要: A substrate for temperature measurement has seventeen temperature measuring elements mounted thereto and each having a built-in quartz resonator. Each of the temperature measuring elements is connected to one coaxial cable covered with fluorocarbon resin having excellent heat resistance. The seventeen cables are bonded to the substrate for temperature measurement using an adhesive so that all the paths of the cables from their contacts with the temperature measuring elements to their boundary points to the outside of the substrate run on the upper surface of the substrate for temperature measurement, and that they are made to have a substantially equal length from their contacts to their boundary points. This minimizes and makes uniform thermal disturbances given to each of the temperature measuring elements from the cables, thus enabling high-precision substrate temperature measurement.

    摘要翻译: 用于温度测量的基板具有安装在其上的17个温度测量元件,并且每个具有内置的石英谐振器。 每个温度测量元件连接到具有优异耐热性的氟碳树脂覆盖的同轴电缆上。 使用粘合剂将17根电缆结合到用于温度测量的基板上,使得电缆从与温度测量元件的接触到其与衬底外部的边界点的所有路径在衬底的上表面上运行,用于温度 测量,并且使它们具有从它们的接触到其边界点的基本相等的长度。 这样可以最大限度地减少并且对来自电缆的每个温度测量元件产生均匀的热扰动,从而实现高精度的衬底温度测量。

    Thermally determining flow and/or heat load distribution in parallel paths
    8.
    发明授权
    Thermally determining flow and/or heat load distribution in parallel paths 有权
    热平衡路径中的流量和/或热负荷分布

    公开(公告)号:US09518875B2

    公开(公告)日:2016-12-13

    申请号:US14982623

    申请日:2015-12-29

    摘要: A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

    摘要翻译: 一种方法,包括获得热传递组件中的至少一个子部件的校准数据,其中所述校准数据包括对于所述子部件的给定表面温度增量的所述子部件的冷却剂流率的至少一个指示,以及 给予所述子部件的热负荷,确定测量到所述子部件的热负荷,确定所述子部件的测量的表面温度增量,以及确定包括所述子部件的所述子部件的所述子部件的第一流路中的冷却剂流量分布 校准数据根据测量的热负荷和测量的表面温度增量分量。

    THERMALLY DETERMINING FLOW AND/OR HEAT LOAD DISTRIBUTION IN PARALLEL PATHS
    9.
    发明申请
    THERMALLY DETERMINING FLOW AND/OR HEAT LOAD DISTRIBUTION IN PARALLEL PATHS 有权
    热平衡和热负荷分布的并行测定

    公开(公告)号:US20160109305A1

    公开(公告)日:2016-04-21

    申请号:US14982623

    申请日:2015-12-29

    IPC分类号: G01K15/00

    摘要: A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

    摘要翻译: 一种方法,包括获得热传递组件中的至少一个子部件的校准数据,其中所述校准数据包括对于所述子部件的给定表面温度增量的所述子部件的冷却剂流率的至少一个指示,以及 给予所述子部件的热负荷,确定测量到所述子部件的热负荷,确定所述子部件的测量的表面温度增量,以及确定包括所述子部件的所述子部件的所述子部件的第一流路中的冷却剂流量分布 校准数据根据测量的热负荷和测量的表面温度增量分量。

    TEMPERATURE COMPUTING INSTRUMENT AND METHOD FOR CALIBRATING TEMPERATURE OF SENSOR PART USED THEREFOR
    10.
    发明申请
    TEMPERATURE COMPUTING INSTRUMENT AND METHOD FOR CALIBRATING TEMPERATURE OF SENSOR PART USED THEREFOR 有权
    温度计算仪器及其所用传感器部件的温度校准方法

    公开(公告)号:US20090110024A1

    公开(公告)日:2009-04-30

    申请号:US12257703

    申请日:2008-10-24

    IPC分类号: G01K15/00 G01K13/00

    CPC分类号: G01K15/00 G01K2007/422

    摘要: A sensor part is provided with a printed circuit board that is made of resin and formed with a pair of electrically conductive metal patterns. Each of the pair of electrically conductive metal patterns includes: a first pattern part connected to a pair of electrodes of a temperature sensor; a second pattern part connected to a pair of conductive wires; and a connection part making a connection between the first and second pattern parts. The connection between the pair of electrodes of the temperature sensor and the first pattern part or between the pair of conductive wires and the second pattern part is made with the use of Dotite or solder.

    摘要翻译: 传感器部件设置有由树脂制成并形成有一对导电金属图案的印刷电路板。 一对导电金属图案中的每一个包括:连接到温度传感器的一对电极的第一图案部分; 连接到一对导线的第二图案部分; 以及连接部分,其形成第一和第二图案部分之间的连接。 温度传感器的一对电极与第一图案部分之间或一对导线与第二图案部分之间的连接是用Dotite或焊料制成的。