摘要:
A method evaluates a defect region of a semiconductor substrate based on C-V characteristics of a MOS structure formed on the semiconductor substrate, including determining a relationship between defect region and flat band voltage or fixed charge density by using a semiconductor substrate having a known defect region, under a heat treatment condition and a C-V characteristic evaluating condition identical to conditions for evaluating a defect region of a semiconductor substrate to be evaluated, determining a flat band voltage or a fixed charge density of the semiconductor substrate to be evaluated from C-V characteristics of a MOS structure formed on the semiconductor substrate to be evaluated, and identifying the defect region of the semiconductor substrate to be evaluated based on the relationship between defect region and flat band voltage or fixed charge density previously determined, whereby the defect region of the semiconductor substrate is evaluated.
摘要:
A method evaluates a defect region of a semiconductor substrate based on C-V characteristics of a MOS structure formed on the semiconductor substrate, including determining a relationship between defect region and flat band voltage or fixed charge density by using a semiconductor substrate having a known defect region, under a heat treatment condition and a C-V characteristic evaluating condition identical to conditions for evaluating a defect region of a semiconductor substrate to be evaluated, determining a flat band voltage or a fixed charge density of the semiconductor substrate to be evaluated from C-V characteristics of a MOS structure formed on the semiconductor substrate to be evaluated, and identifying the defect region of the semiconductor substrate to be evaluated based on the relationship between defect region and flat band voltage or fixed charge density previously determined, whereby the defect region of the semiconductor substrate is evaluated.
摘要:
A semiconductor arrangement may include a multiplicity of semiconductor elements with controlling paths and controlled paths, the controlled paths having controllable conductivities and being connected parallel to each other. The semiconductor arrangement may also include a current evaluation circuit configured to measure current strengths of currents present in the controlled paths and to provide a signal representing the sum of the measured current strengths, and a control circuit connected to the controlling paths and configured to control the conductivities of the controlled paths in accordance with an input signal and the signal representing the sum of the current strengths. The at least one controlled path is controlled to have minimum conductivity if the signal representing the sum of the current strengths is below a threshold value.
摘要:
A test structure and testing method are provided for characterizing the time-dependent drift in the parasitic PFET leakage current that flows along the sidewall of a deep trench isolation structure from the P-type active area to the P-type substrate in a semiconductor integrated circuit structure. The capacitive coupling characteristics of the deep trench isolation structure are used to control the electrical “bias” of the deep trench structure through the use of a large auxiliary trench mesh network that is formed as part of the deep trench structure. The trench mesh network can be placed adjacent to a Vdd ring or a ground ring and then, by using a ratioed capacitive voltage dividing network, the electrical potential at the trench can be controlled.
摘要:
A gate capacitance of a MOS transistor is determined by (a) measuring the gate capacitance and dissipation factor; (b) obtaining a channel resistance and a tunneling resistance; (c) setting an initial capacitance and an error dissipation factor; (d) calculating a direct dissipation factor using the channel resistance, the tunneling resistance, and the initial capacitance; (e) calculating a calculated dissipation factor using the error dissipation factor, the direct dissipation factor, and the measured dissipation factor; (f) calculating a calculated capacitance using the channel resistance, the tunneling resistance, the initial capacitance, the error dissipation factor, and the measured dissipation factor; and (g) detecting the initial capacitance as an accurate gate capacitance of the transistor if it is determined that the calculated capacitance is equal to the measured capacitance and the calculated dissipation factor is equal to the measured dissipation factor, and otherwise repeating steps (c) through (g).
摘要:
An apparatus for measuring the surface potential and impurity concentration in a semi-conductor body by monitoring the current flowing in a semiconductor body when the body is biased with a ramp voltage above its flat band voltage and summing the monitored current with the ramp voltage biasing the body. The apparatus provides direct measurement of surface potential and impurity concentration in a semiconductor structure and is especially useful in metal insulator semiconductor (MIS) structures.
摘要:
A method and apparatus are disclosed for testing susceptibility of a gate insulator in MOS and MIS devices to irradiation without use of ionizing radiation. The method consists of simulating the effects of radiation by applying a high magnitude, pulsed electric field to the device under test. An apparatus capable of determining the relationship between voltage applied to the device under test and the device capacitance is used to provide the desired susceptibility information.
摘要:
A method for predicting remaining life of electromigration failure is disclosed. The methods includes: establishing an electromigration life model of a MOS device; acquiring a normal electromigration failure lifetime τ1, based on a current density and a first environment temperature under a preset normal operating condition and the electromigration life model; acquiring a current density stress, based on a target prognostic point τ2, a second environment temperature and the electromigration life model; inputting the current density stress into a MOS device electromigration failure warning circuit based on a prognostic cell; and if the prognostic circuit of EM failure for a MOS device outputs a high level after a time τ3, acquiring a remaining life of electromigration failure corresponding to τ2′ based on τ1, τ2 and τ3. A device for remaining life prediction for electromigration failure is also disclosed.
摘要:
An apparatus includes a resistor and a circuit. The resistor may be fabricated on a die using a semiconductor process. The circuit may be fabricated on the die using the semiconductor process and may be configured to (i) generate a measurement voltage at a node of the resistor as a function of a capacitance value and a frequency of a clock signal and (ii) generate a codeword in response to the measurement voltage. The codeword generally has a plurality of possible values. A particular value of the possible values may verify that the voltage is between a plurality of threshold voltages.
摘要:
A method for manufacturing a display panel including a display unit in which pixels, in rows and columns, include an organic EL element and a drive transistor, includes, performed on the display panel having a line defect which is a pixel column that emits light of luminance not reflecting display gray level signals: displaying, overlappingly, a lighted line, which is a pixel column inputted with uniform display gray level signals, and the line defect by displaying the lighted line on the display unit and scanning the display unit with the lighted line in the row direction; reducing a bright/dark part range in the line defect by uniformly changing the display gray level inputted to the pixel column in the lighted line overlapping with the line defect; and identifying a defective pixel, which is the line defect origin, from the position of the reduced bright/dark part range in the display unit.