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公开(公告)号：US12055811B2
公开(公告)日：2024-08-06
申请号：US18070376
申请日：2022-11-28
申请人： Innolux Corporation
发明人： Luca Hung
IPC分类号： G02F1/1335 , G02F1/1333 , G02F1/1345
CPC分类号： G02F1/133512 , G02F1/133388 , G02F1/13452 , G02F1/13456 , G02F1/13458 , G02F2202/28
摘要： An electronic device is provided, including a panel, a circuit board, and a light shielding element. The panel includes a side surface, and the side surface has a first region and a second region. The circuit board is attached to the first region of the side surface, and includes a top surface. The shielding element is attached to the second region of the side surface and the top surface of the circuit board.
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公开(公告)号：US20230251539A1
公开(公告)日：2023-08-10
申请号：US18302284
申请日：2023-04-18
申请人： Japan Display Inc.
发明人： Hiroyuki ABE , Kentaro AGATA
IPC分类号： G02F1/1362 , G02F1/1333 , G02F1/1339 , G09G3/36 , G02F1/1345
CPC分类号： G02F1/136286 , G02F1/1339 , G02F1/1345 , G02F1/13452 , G02F1/133345 , G09G3/3688 , G02F1/13454 , G02F1/13456 , G02F1/13458 , G02F1/13629 , G02F1/136295 , G09G2300/0408 , G09G2300/0426 , G09G2300/0452 , G09G2310/0297
摘要： It is possible to reduce a size of a lower frame region to ensure a wiring corrosion margin equivalent to that of a conventional technique. In a display device, a video signal wiring arranged in the lower frame region includes, in a region between a terminal section (terminal) and a video signal line, a first wiring formed on a first wiring layer and having one end connected to the terminal section to which a video signal line driving circuit is connected, a second wiring formed on a second wiring layer different from the first wiring layer and having one end connected to the other end of the first wiring, and a third wiring formed on the first wiring layer and having one end connected to the other end of the second wiring. The other end of the third wiring is connected to the video signal line via a fourth wiring formed on the second wiring layer, and the first wiring layer is formed on the side closer to an array substrate than to the second wiring layer.
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公开(公告)号：US11966132B2
公开(公告)日：2024-04-23
申请号：US17479206
申请日：2021-09-20
申请人： Japan Display Inc.
发明人： Keita Sasanuma , Kengo Shiragami , Naoyuki Obinata
IPC分类号： G02F1/1362 , G01R31/317 , G02F1/1345 , G02F1/1368
CPC分类号： G02F1/136254 , G01R31/31713 , G02F1/13456 , G02F1/13452 , G02F1/1368
摘要： A display device includes signal lines, first driver terminals that are provided in a first peripheral region and to which a first driver IC can be coupled, second driver terminals to which a second driver IC can be coupled, a plurality of inspection terminals provided in the first peripheral region, first inspection switches coupled to the first driver terminals and configured to be capable of switching coupling and interruption of the inspection terminals and the signal lines, and second inspection switches coupled to the second driver terminals and configured to be capable of switching coupling and interruption of the inspection terminals and the signal lines.
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公开(公告)号：US11868013B2
公开(公告)日：2024-01-09
申请号：US17955571
申请日：2022-09-29
发明人： Li Tang , Baohong Kang
IPC分类号： G02F1/1345 , G02F1/133 , G02F1/1362 , H01L27/12 , H01L25/00 , H01L23/538 , G09G3/36 , G09G3/00 , H01L23/498 , H01L25/18
CPC分类号： G02F1/13452 , G02F1/13306 , G02F1/13456 , G02F1/136286 , G09G3/035 , G09G3/3685 , H01L23/49838 , H01L23/5386 , H01L25/50 , H01L27/124 , H01L23/4985 , H01L23/5387 , H01L25/18
摘要： A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the second group of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.
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公开(公告)号：US11703726B2
公开(公告)日：2023-07-18
申请号：US17218517
申请日：2021-03-31
发明人： Jae-Han Lee , Wontae Kim
IPC分类号： G02F1/1345
CPC分类号： G02F1/13458 , G02F1/13452 , G02F1/13456
摘要： A display device includes a display panel including a pixel part to display an image, and a pad part connected to the pixel part; a first flexible circuit film coupled to the pad part and including a first alignment mark; and a second flexible circuit film coupled to the pad part, overlapping the first flexible circuit film, and including a second alignment mark aligned with the first alignment mark. The first and second alignment marks are located in an area where the first flexible circuit film overlaps the second flexible circuit film.
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公开(公告)号：US11676974B2
公开(公告)日：2023-06-13
申请号：US17488263
申请日：2021-09-28
发明人： Yueh-Lin Yang , Haijun Chen , Tatao Hsu , Jonathan Huang
IPC分类号： H01L27/12 , G02F1/1345
CPC分类号： H01L27/124 , G02F1/13452 , G02F1/13456 , G02F1/13458
摘要： An electronic device has a display substrate including a display area, a driver area, and a fan-out area. The fan-out area has interconnects providing electrical accesses to display elements of the display area. The device has a driver chip disposed on the driver area. The driver chip includes a first edge adjacent to the display area and multiple pad groups, each pad group including a respective row of electronic pads that is (i) arranged substantially in parallel with the first edge and (ii) electrically coupled to a respective subset of display elements via respective interconnects routed on a respective region of the fan-out area. The pad groups include a first pad group and a second pad group. The first and second pad groups have two different distances from the first edge and correspond to two different subsets of interconnects routed on two non-overlapping regions of the fan-out area.
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公开(公告)号：US11662637B2
公开(公告)日：2023-05-30
申请号：US17192209
申请日：2021-03-04
申请人： Japan Display Inc.
发明人： Hiroyuki Abe , Kentaro Agata
IPC分类号： G02F1/1362 , G02F1/1333 , G02F1/1339 , G09G3/36 , G02F1/1345
CPC分类号： G02F1/136286 , G02F1/1339 , G02F1/1345 , G02F1/13452 , G02F1/133345 , G09G3/3688 , G02F1/13454 , G02F1/13456 , G02F1/13458 , G02F1/13629 , G02F1/136295 , G09G2300/0408 , G09G2300/0426 , G09G2300/0452 , G09G2310/0297
摘要： It is possible to reduce a size of a lower frame region to ensure a wiring corrosion margin equivalent to that of a conventional technique. In a display device, a video signal wiring arranged in the lower frame region includes, in a region between a terminal section (terminal) and a video signal line, a first wiring formed on a first wiring layer and having one end connected to the terminal section to which a video signal line driving circuit is connected, a second wiring formed on a second wiring layer different from the first wiring layer and having one end connected to the other end of the first wiring, and a third wiring formed on the first wiring layer and having one end connected to the other end of the second wiring. The other end of the third wiring is connected to the video signal line via a fourth wiring formed on the second wiring layer, and the first wiring layer is formed on the side closer to an array substrate than to the second wiring layer.
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公开(公告)号：US11982893B2
公开(公告)日：2024-05-14
申请号：US18314839
申请日：2023-05-10
申请人： Japan Display Inc.
发明人： Kentaro Kawai
IPC分类号： G02F1/1333 , G02F1/1335 , G02F1/1345 , G02F1/1362
CPC分类号： G02F1/133388 , G02F1/133512 , G02F1/1345 , G02F1/13452 , G02F1/136286 , G02F1/13456 , G02F1/136209
摘要： A display device includes an array substrate including a display region and a peripheral region, a counter substrate opposite to the array substrate, and a liquid crystal layer between the array substrate and the counter substrate. The display region includes a plurality of data signal lines and a plurality of scanning signal lines, the peripheral region includes a first wiring pattern arranged with a plurality of wirings connected to each of the plurality of scanning signal lines and a second wiring pattern applied with a certain potential, the first wiring pattern includes a first straight portion extending along the first direction, a second straight portion extending along the second direction, and a bending portion connecting the first straight portion and the second straight portion, and the bending portion includes a first wiring having a staircase-like stepped shape.
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公开(公告)号：US11714321B2
公开(公告)日：2023-08-01
申请号：US17870854
申请日：2022-07-22
发明人： Shinsuke Fujikawa
IPC分类号： G02F1/1345 , G02F1/13363
CPC分类号： G02F1/13452 , G02F1/1345 , G02F1/13454 , G02F1/13456 , G02F1/13458 , G02F1/13363
摘要： An electro-optical device includes: a liquid crystal panel; a particle aligned type anisotropic conductive film having a plurality of electrically conductive particles that are arranged in a state of being aligned along a first direction and a second direction intersecting with the first direction; and a printed circuit board coupled to a connection terminal portion of the liquid crystal panel via the particle aligned type anisotropic conductive film, wherein the connection terminal portion includes a plurality of connection terminals, a plurality of recessed portions that are arranged in a state of being aligned along a third direction and a fourth direction intersecting with the third direction are formed on a surface of the connection terminal, and at least one of the first direction and the second direction along which the electrically conductive particles are arranged is different in arrangement direction from both the third direction and the fourth direction.
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公开(公告)号：US20230213822A1
公开(公告)日：2023-07-06
申请号：US17955571
申请日：2022-09-29
发明人： Li Tang , Baohong Kang
IPC分类号： G02F1/1345 , G02F1/133 , G02F1/1362 , H01L27/12 , H01L25/00 , H01L23/498 , H01L23/538 , G09G3/36 , G09G3/00
CPC分类号： G02F1/13452 , G02F1/13306 , G02F1/13456 , G02F1/136286 , G09G3/035 , G09G3/3685 , H01L23/5386 , H01L23/49838 , H01L25/50 , H01L27/124 , H01L23/4985 , H01L25/18
摘要： A chip on film, a display panel, and a method of manufacturing the display panel are provided. The chip on film includes a flexible film and a driver chip. The flexible film includes at least a first group of lines and a second group of lines. M lines of the first group of lines are electrically connected to pins of the driver chip to form driver lines; and N lines of the secondgroup of lines are not electrically connected to any pin of the driver chip, serving as nominal lines. By arranging the nominal lines, a conventional bonding machine may be applied to bond the chip on film to the display substrate. Costs for modifying the bonding machine may be reduced, and application scenarios of the chip on film may be increased.
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