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公开(公告)号：US09251988B1
公开(公告)日：2016-02-02
申请号：US14753387
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Bing-Chu Du , Peng Liu , Duan-Liang Zhou , Chun-Hai Zhang , Shou-Shan Fan
CPC classification number: H01J1/304 , B82Y10/00 , B82Y30/00 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288 , Y10S977/742 , Y10S977/939
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
Abstract translation: 本发明涉及场致发射阴极。 场发射阴极包括微通道板，阴极电极和多个阴极发射体。 微通道板是绝缘板，包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸通过微通道板的许多孔。 阴极位于第一表面。 阴极发射体的数量填充有孔数并与阴极电连接。
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公开(公告)号：US20160013006A1
公开(公告)日：2016-01-14
申请号：US14753387
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： BING-CHU DU , PENG LIU , DUAN-LIANG ZHOU , CHUN-HAI ZHANG , SHOU-SHAN FAN
CPC classification number: H01J1/304 , B82Y10/00 , B82Y30/00 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288 , Y10S977/742 , Y10S977/939
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
Abstract translation: 本发明涉及场致发射阴极。 场发射阴极包括微通道板，阴极电极和多个阴极发射体。 微通道板是绝缘板，包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸通过微通道板的许多孔。 阴极位于第一表面。 阴极发射体的数量填充有孔数并与阴极电连接。
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Patent Agency Ranking
3.发明申请公开(公告)号：US20130342098A1
公开(公告)日：2013-12-26
申请号：US14000418
申请日：2012-03-13
Applicant: Christopher E. Holland , Charles A. Spindt
Inventor： Christopher E. Holland , Charles A. Spindt
CPC classification number: H01J1/88 , H01J3/022 , H01J9/025 , H01J2203/0272 , H01J2203/0284 , H01J2203/0288 , H01J2329/4673 , H01J2329/4686 , H01J2329/4691
Abstract: Micro-fabricated charge-emission devices comprise an electrically conductive gate electrode with an aperture, an electrically conductive base electrode, a charge-emitting microstructure extending from a surface in electrical contact with the base electrode and terminating near the aperture of the gate electrode, and a dielectric layer stack disposed between the base electrode and the gate electrode. The dielectric layer stack comprises a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed between the second dielectric layer and the base electrode. The first dielectric layer is of a different selectively etchable dielectric material than the second dielectric layer. The dielectric layer stack h formed therein a cavity within which the charge-emitting emitting microstructure is disposed. The cavity has a corrugated wall shaped by the first dielectric layer undercutting the second dielectric layer. The corrugated wall surrounds the charge-emitting microstructure disposed within the cavity.
Abstract translation: 微制造的电荷发射装置包括具有孔的导电栅极电极，导电基极电极，从与基极电接触并在栅电极的孔附近终止的表面延伸的电荷发射微结构，以及 设置在基极和栅电极之间的电介质层叠层。 电介质层堆叠包括第一电介质层和第二电介质层。 第一电介质层设置在第二电介质层和基极之间。 第一电介质层是与第二介电层不同的可选择蚀刻的电介质材料。 其中形成有电荷发射微结构的空腔内的电介质层叠层h。 空腔具有由第一介电层成形的波纹状壁，底层切割第二介电层。 波纹壁围绕设置在空腔内的电荷发射微结构。
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公开(公告)号：US09312089B2
公开(公告)日：2016-04-12
申请号：US14753393
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Bing-Chu Du , Peng Liu , Duan-Liang Zhou , Chun-Hai Zhang , Shou-Shan Fan
CPC classification number: H01J9/025 , H01J1/304 , H01J3/021 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288 , Y10S977/742
Abstract: The disclosure relates to a method for making field emission cathode. A microchannel plate is provided. The microchannel plate includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The plurality of holes are filled with a carbon nanotube slurry. The carbon nanotube slurry is adhered on inner walls of the plurality of holes. The carbon nanotube slurry in the plurality of holes is solidified.
Abstract translation: 本公开涉及一种用于制造场致发射阴极的方法。 提供微通道板。 微通道板包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸通过微通道板的许多孔。 多个孔填充有碳纳米管浆料。 碳纳米管浆料粘附在多个孔的内壁上。 多个孔中的碳纳米管浆料固化。
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公开(公告)号：US20160013007A1
公开(公告)日：2016-01-14
申请号：US14753393
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： BING-CHU DU , PENG LIU , DUAN-LIANG ZHOU , CHUN-HAI ZHANG , SHOU-SHAN FAN
CPC classification number: H01J9/025 , H01J1/304 , H01J3/021 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288 , Y10S977/742
Abstract: The disclosure relates to a method for making field emission cathode. A microchannel plate is provided. The microchannel plate includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The plurality of holes are filled with a carbon nanotube slurry. The carbon nanotube slurry is adhered on inner walls of the plurality of holes. The carbon nanotube slurry in the plurality of holes is solidified.
Abstract translation: 本公开涉及一种用于制造场致发射阴极的方法。 提供微通道板。 微通道板包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸通过微通道板的许多孔。 多个孔填充有碳纳米管浆料。 碳纳米管浆料粘附在多个孔的内壁上。 多个孔中的碳纳米管浆料固化。
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公开(公告)号：US09552953B2
公开(公告)日：2017-01-24
申请号：US14753380
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： Bing-Chu Du , Peng Liu , Duan-Liang Zhou , Chun-Hai Zhang , Shou-Shan Fan
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
Abstract translation: 本发明涉及场致发射阴极。 场发射阴极包括微通道板，阴极电极和多个阴极发射体。 微通道板是绝缘板，包括第一表面和与第一表面相对的第二表面。 微通道板限定了从第一表面到第二表面延伸穿过微通道板的许多孔。 阴极位于第一表面。 阴极发射体的数量填充有孔数并与阴极电连接。
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公开(公告)号：US20160013005A1
公开(公告)日：2016-01-14
申请号：US14753380
申请日：2015-06-29
Applicant: Tsinghua University , HON HAI PRECISION INDUSTRY CO., LTD.
Inventor： BING-CHU DU , PENG LIU , DUAN-LIANG ZHOU , CHUN-HAI ZHANG , SHOU-SHAN FAN
IPC: H01J1/304
CPC classification number: H01J1/304 , H01J3/021 , H01J9/025 , H01J2201/30469 , H01J2203/0268 , H01J2203/0272 , H01J2203/028 , H01J2203/0284 , H01J2203/0288
Abstract: The disclosure relates to a field emission cathode. The field emission cathode includes a microchannel plate, a cathode electrode and a number of cathode emitters. The microchannel plate is an insulative plate and includes a first surface and a second surface opposite to the first surface. The microchannel plate defines a number of holes extending through the microchannel plate from the first surface to the second surface. The cathode electrode is located on the first surface. The number of cathode emitters are filled in the number of holes and electrically connected with the cathode electrode.
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