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公开(公告)号：US08907480B2
公开(公告)日：2014-12-09
申请号：US13802848
申请日：2013-03-14
发明人： Thorsten Meyer , Hans-Joachim Barth , Reinhard Mahnkopf , Sven Albers , Andreas Augustin , Christian Mueller
CPC分类号： H01L24/17 , H01L23/5256 , H01L23/5382 , H01L25/0657 , H01L2224/02379 , H01L2224/0401 , H01L2224/0557 , H01L2224/131 , H01L2224/16146 , H01L2224/1703 , H01L2224/17107 , H01L2224/17154 , H01L2224/17181 , H01L2224/17517 , H01L2224/81193 , H01L2924/12042 , H01L2924/014 , H01L2924/00
摘要： A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.
摘要翻译： 芯片布置可以包括：第一芯片，其包括第一触点，第二触点和将第一触点电耦合到第二触点的再分配结构; 包括触点的第二芯片; 以及电耦合到第一芯片的第二触点的多个互连，其中多个互连件中的至少一个互连将第一芯片的第二触点电耦合到第二芯片的触点。
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公开(公告)号：US09589501B2
公开(公告)日：2017-03-07
申请号：US14932118
申请日：2015-11-04
发明人： Atsushi Hirama
IPC分类号： G06F3/038 , G09G3/32 , H01L21/768 , H01L27/32
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
摘要翻译： 形成在与玻璃基板上形成的引线连接的由玻璃实施方式制造的芯片中形成的显示驱动电路包括矩形形状的基板，形成在基板上的电源线，沿着 长方形基板的长边，形成在矩形基板上的多个输出端子，输出端子沿着电源线配置，多个凸块电极，每个凸起电极将输出端子中的一个连接到 引线，沿着电源线布置的开关，每个开关连接在一个输出端子和电源线之间，设置在电源线中间附近的单个电源端子连接到 电源线。
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公开(公告)号：US20160055795A1
公开(公告)日：2016-02-25
申请号：US14932118
申请日：2015-11-04
发明人： Atsushi HIRAMA
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
摘要翻译： 形成在与玻璃基板上形成的引线连接的由玻璃实施方式制造的芯片中形成的显示驱动电路包括矩形形状的基板，形成在基板上的电源线，沿着 长方形基板的长边，形成在矩形基板上的多个输出端子，输出端子沿着电源线配置，多个凸块电极，每个凸起电极将输出端子中的一个连接到 引线，沿着电源线布置的开关，每个开关连接在一个输出端子和电源线之间，设置在电源线中间附近的单个电源端子连接到 电源线。
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公开(公告)号：US09799265B2
公开(公告)日：2017-10-24
申请号：US15424766
申请日：2017-02-03
发明人： Atsushi Hirama
IPC分类号： G09G5/00 , G09G3/3225 , G09G3/3266 , G09G3/3275 , H01L27/32
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
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公开(公告)号：US09208716B2
公开(公告)日：2015-12-08
申请号：US14190495
申请日：2014-02-26
发明人： Atsushi Hirama
IPC分类号： G09G5/00 , G09G3/32 , H01L21/768
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
摘要翻译： 形成在与玻璃基板上形成的引线连接的由玻璃实施方式制造的芯片中形成的显示驱动电路包括矩形形状的基板，形成在基板上的电源线，沿着 长方形基板的长边，形成在矩形基板上的多个输出端子，输出端子沿着电源线配置，多个凸块电极，每个凸起电极将输出端子中的一个连接到 引线，沿着电源线布置的开关，每个开关连接在一个输出端子和电源线之间，设置在电源线中间附近的单个电源端子连接到 电源线。
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公开(公告)号：US20140176522A1
公开(公告)日：2014-06-26
申请号：US14190495
申请日：2014-02-26
发明人： Atsushi HIRAMA
IPC分类号： G09G3/32
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
摘要翻译： 形成在与玻璃基板上形成的引线连接的由玻璃实施方式制造的芯片中形成的显示驱动电路包括矩形形状的基板，形成在基板上的电源线，沿着 长方形基板的长边，形成在矩形基板上的多个输出端子，输出端子沿着电源线配置，多个凸块电极，每个凸起电极将输出端子中的一个连接到 引线，沿着电源线布置的开关，每个开关连接在一个输出端子和电源线之间，设置在电源线中间附近的单个电源端子连接到 电源线。
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公开(公告)号：US20080143699A1
公开(公告)日：2008-06-19
申请号：US11907200
申请日：2007-10-10
申请人： Atsushi Hirama
发明人： Atsushi Hirama
IPC分类号： G09G5/00
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
摘要翻译： 形成在与玻璃基板上形成的引线连接的由玻璃实施方式制造的芯片中形成的显示驱动电路包括矩形形状的基板，形成在基板上的电源线，沿着 长方形基板的长边，形成在矩形基板上的多个输出端子，输出端子沿着电源线配置，多个凸块电极，每个凸起电极将输出端子中的一个连接到 引线，沿着电源线布置的开关，每个开关连接在一个输出端子和电源线之间，设置在电源线中间附近的单个电源端子连接到 电源线。
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公开(公告)号：US11678502B2
公开(公告)日：2023-06-13
申请号：US17012115
申请日：2020-09-04
发明人： Hyun A Lee , Kyung Rok Ko , Yong Hoon Kwon , Byung Hoon Kim , Jung Hyun Kim , Tae Oh Kim , June Hyoung Park , Hyun Ji Lee , So Mi Jung
CPC分类号： H01L51/5246 , H01L24/05 , H01L24/06 , H01L24/16 , H01L24/17 , H01L27/3276 , H01L27/3258 , H01L2224/0557 , H01L2224/06154 , H01L2224/16145 , H01L2224/17154
摘要： A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.
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公开(公告)号：US20170148381A1
公开(公告)日：2017-05-25
申请号：US15424766
申请日：2017-02-03
发明人： Atsushi HIRAMA
IPC分类号： G09G3/3225 , G09G3/3275 , H01L27/32 , G09G3/3266
CPC分类号： G09G3/3225 , G09G3/3208 , G09G3/3216 , G09G3/3266 , G09G3/3275 , G09G2300/0408 , G09G2300/0426 , G09G2320/0223 , G09G2320/0233 , G09G2330/021 , H01L21/76897 , H01L27/3279 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/17154 , H01L2924/00014 , H01L2924/01079 , H01L2924/12044 , H01L2924/19043 , H01L2924/3011 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A display drive circuit formed in a chip manufactured by a chip on glass implementation, which is connected to lead lines formed on a glass substrate, includes a rectangularly-shaped substrate, a power supply line formed on the substrate, the line being elongated along the longer side of the rectangular shaped substrate, a plurality of output terminals formed on the rectangular shaped substrate, the output terminal being disposed along the power supply line, a plurality of bump electrodes, each of which connects one of the output terminal to one of the lead lines, switches disposed along the power supply line, each of which is connected between the one of the output terminals and the power supply line, a single power supply terminal, which is disposed near the middle of the power supply line, being connected to the power supply line.
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公开(公告)号：US20140264832A1
公开(公告)日：2014-09-18
申请号：US13802848
申请日：2013-03-14
申请人： Thorsten Meyer , Hans-Joachim Barth , Reinhard Mahnkopf , Sven Albers , Andreas Augustin , Christian Mueller
发明人： Thorsten Meyer , Hans-Joachim Barth , Reinhard Mahnkopf , Sven Albers , Andreas Augustin , Christian Mueller
IPC分类号： H01L23/00
CPC分类号： H01L24/17 , H01L23/5256 , H01L23/5382 , H01L25/0657 , H01L2224/02379 , H01L2224/0401 , H01L2224/0557 , H01L2224/131 , H01L2224/16146 , H01L2224/1703 , H01L2224/17107 , H01L2224/17154 , H01L2224/17181 , H01L2224/17517 , H01L2224/81193 , H01L2924/12042 , H01L2924/014 , H01L2924/00
摘要： A chip arrangement may include: a first chip including a first contact, a second contact, and a redistribution structure electrically coupling the first contact to the second contact; a second chip including a contact; and a plurality of interconnects electrically coupled to the second contact of the first chip, wherein at least one interconnect of the plurality of interconnects electrically couples the second contact of the first chip to the contact of the second chip.
摘要翻译： 芯片布置可以包括：第一芯片，其包括第一触点，第二触点和将第一触点电耦合到第二触点的再分配结构; 包括触点的第二芯片; 以及电耦合到第一芯片的第二触点的多个互连，其中多个互连件中的至少一个互连将第一芯片的第二触点电耦合到第二芯片的触点。
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