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公开(公告)号：US20160111408A1
公开(公告)日：2016-04-21
申请号：US14967629
申请日：2015-12-14
IPC分类号： H01L25/00 , H01L25/075
CPC分类号： H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
摘要： Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
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公开(公告)号：US09245875B2
公开(公告)日：2016-01-26
申请号：US14394501
申请日：2013-04-19
IPC分类号： H01L25/075 , H01L23/00 , H01L21/683
CPC分类号： H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
摘要： Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
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公开(公告)号：US12113047B2
公开(公告)日：2024-10-08
申请号：US17545439
申请日：2021-12-08
发明人： Jung Hyun Ahn , Buem Joon Kim , Won Ho Lee , Hyun Deok Im
CPC分类号： H01L24/95 , B41M5/0023 , H01L24/76 , H01L25/167 , H01L24/82 , H01L2224/7655 , H01L2224/76655 , H01L2224/82101 , H01L2224/95102 , H01L2224/95145
摘要： An ink leveling device includes a stage on which a target substrate is disposed, base frames disposed at sides of the stage, moving members coupled to the base frames and movable upward and downward, and at least one plate coupled to the moving members and disposed to press the target substrate. Light-emitting element ink is disposed on the target substrate.
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公开(公告)号：US09418979B2
公开(公告)日：2016-08-16
申请号：US14967629
申请日：2015-12-14
IPC分类号： H01L25/00 , H01L23/00 , H01L21/683 , H01L25/075
CPC分类号： H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
摘要： Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
摘要翻译： 本文公开了一种在衬底上组装发光二极管（LED）管芯的阵列的方法，包括：将管芯定位在流体中; 将模具暴露于磁力以将模具吸引到布置在基板上或附近的预定位置的磁体上; 并且在所述管芯和所述衬底之间形成永久连接，从而在衬底上构成LED管芯阵列。
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公开(公告)号：US20150050761A1
公开(公告)日：2015-02-19
申请号：US14394501
申请日：2013-04-19
IPC分类号： H01L25/075
CPC分类号： H01L25/50 , H01L21/6836 , H01L24/05 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/76 , H01L24/82 , H01L24/83 , H01L24/95 , H01L24/96 , H01L25/0753 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/04026 , H01L2224/05655 , H01L2224/13101 , H01L2224/24225 , H01L2224/245 , H01L2224/291 , H01L2224/32225 , H01L2224/75252 , H01L2224/75283 , H01L2224/75655 , H01L2224/75701 , H01L2224/75733 , H01L2224/75801 , H01L2224/76655 , H01L2224/76701 , H01L2224/76733 , H01L2224/76801 , H01L2224/82002 , H01L2224/82102 , H01L2224/82143 , H01L2224/83002 , H01L2224/83143 , H01L2224/83191 , H01L2224/8323 , H01L2224/83801 , H01L2224/9202 , H01L2224/95101 , H01L2224/95144 , H01L2924/00011 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/3511 , H01L2933/0066 , H01L2924/014 , H01L2924/01047 , H01L2924/00 , H01L2224/83205 , H01L2924/00014
摘要： Disclosed herein is a method of assembling an array of light emitting diode (LED) dies on a substrate comprising: positioning dies in fluid; exposing the dies to a magnetic force to attract the dies onto magnets that are arranged at pre-determined locations either on or near the substrate; and forming permanent connections between the dies and the substrate thereby constituting an array of LED dies on a substrate.
摘要翻译： 本文公开了一种在衬底上组装发光二极管（LED）管芯的阵列的方法，包括：将管芯定位在流体中; 将模具暴露于磁力以将模具吸引到布置在基板上或附近的预定位置的磁体上; 并且在所述管芯和所述衬底之间形成永久连接，从而在衬底上构成LED管芯阵列。
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