公开(公告)号：US20150024589A1

公开(公告)日：2015-01-22

申请号：US14375859

申请日：2013-01-22

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES

发明人： Jean Brun

IPC分类号： H01L23/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05601 ,  H01L2224/0569 ,  H01L2224/0618 ,  H01L2224/45099 ,  H01L2224/4847 ,  H01L2224/4918 ,  H01L2224/78611 ,  H01L2224/78651 ,  H01L2224/7898 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/85805 ,  H01L2224/85862 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00

摘要： Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

摘要翻译： 组装方法包括：提供将线元件从线元件供给装置传送到线元件存储装置的系统; 通过张紧拉伸供料储存装置之间的丝元件; 提供个体化的储存器和分离的芯片元件，每个芯片元件包括连接端子，该连接端子包括具有自由通路的顶部，其中不存在芯片元件; 将芯片元件从储存器传送到供应和存储装置之间的装配区域，在该装置中线元件在组装区域中被紧紧拉伸; 将导电线元件固定到组装区域中的芯片元件连接端子; 并且在将后者固定到形成盖的线元件之后，在芯片元件上添加电绝缘材料，添加在芯片元件的表面上执行的材料，其包括固定到线元件的连接端子，以至少覆盖线元件的连接端子和部分 在后者的固定点。

公开(公告)号：US09953953B2

公开(公告)日：2018-04-24

申请号：US14375859

申请日：2013-01-22

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Jean Brun

IPC分类号： H05K13/02 ,  H05K13/06 ,  H05K13/00 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/04042 ,  H01L2224/05601 ,  H01L2224/0569 ,  H01L2224/0618 ,  H01L2224/45099 ,  H01L2224/4847 ,  H01L2224/4918 ,  H01L2224/78611 ,  H01L2224/78651 ,  H01L2224/7898 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2224/85801 ,  H01L2224/85805 ,  H01L2224/85862 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2933/0066 ,  H01L2924/014 ,  H01L2924/00

摘要： Method for assembling includes: providing a system to transfer wire element from wire element supply device to wire element storage device; stretching wire element between supply and storage devices by tensioning; providing an individualized reservoir and separated chip elements, each including a connection terminal including a top with free access facing in which chip element is not present; transporting the chip element from reservoir to an assembly area between supply and storage devices in which wire element is tightly stretched in assembly area; fixing electrically conducting wire element to chip element connection terminal in assembly area; and adding electrically insulating material on chip element after latter has been fixed to wire element forming a cover, the addition of material being performed on surface of chip element including connection terminal fixed to wire element to cover at least the connection terminal and portion of wire element at fixing point of latter.

公开(公告)号：US20110217877A1

公开(公告)日：2011-09-08

申请号：US13121909

申请日：2009-09-30

申请人： Torsten Linz

发明人： Torsten Linz

IPC分类号： H01R13/40 ,  H01R43/00

CPC分类号： H01R43/0228 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/80 ,  H01L24/85 ,  H01L2224/05553 ,  H01L2224/45565 ,  H01L2224/45599 ,  H01L2224/4847 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/8585 ,  H01L2224/85862 ,  H01L2224/8588 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01R4/029 ,  H01R12/59 ,  H01R12/62 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/01006 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A method connects two parts, which overlap each other only partially and have electrically conducting structures, mechanically and electrically at the same time. For purposes of electrical insulation and/or for mechanical and/or chemical protection, at least one of the conductors is extensively covered with an electrically insulating material beyond the overlapping area and including the connection surface. In order to establish the connection, the conducting parts are pressed against each other in the area of the connection surfaces of said conducting parts and in the area surrounding said connection surfaces. An adhesive is used as the electrically insulating material. The adhesive is put into a sticky state during the connection, thereby forming an electrical contact between the electrical connection surfaces and in the area surrounding said electrical connection surfaces, after which the adhesive is brought into a permanently adhering state.

摘要翻译： 一种方法连接两部分，它们仅部分重叠，同时具有机械和电气的导电结构。 为了电绝缘和/或机械和/或化学保护的目的，导体中的至少一个被覆盖有超过重叠区域并包括连接表面的电绝缘材料。 为了建立连接，导电部件在所述导电部件的连接表面的区域和围绕所述连接表面的区域中彼此压靠。 使用粘合剂作为电绝缘材料。 粘合剂在连接期间处于粘性状态，从而在电连接表面之间和围绕所述电连接表面的区域中形成电接触，之后粘合剂处于永久粘附状态。