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    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
    1.
    发明申请
    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING 有权
    用于高功率密度IC的高性能集成MLC冷却装置及其制造方法

    公开(公告)号：US20060266497A1

    公开(公告)日：2006-11-30

    申请号：US10908758

    申请日：2005-05-25

    申请人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    发明人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10S165/908 ,  H01L2924/00

    摘要： A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

    摘要翻译： 一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或 冷却。 歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。 歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。 气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。

    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING
    2.
    发明申请
    HIGH PERFORMANCE INTEGRATED MLC COOLING DEVICE FOR HIGH POWER DENSITY ICS AND METHOD FOR MANUFACTURING 审中-公开
    用于高功率密度IC的高性能集成MLC冷却装置及其制造方法

    公开(公告)号：US20080060792A1

    公开(公告)日：2008-03-13

    申请号：US11756873

    申请日：2007-06-01

    申请人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    发明人： Daniel Berger ,  Raschid Bezama ,  Lester Herron ,  Bruno Michel ,  Govindarajan Natarajan

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10S165/908 ,  H01L2924/00

    摘要： A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

    摘要翻译： 一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或 冷却。 歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。 歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。 气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。

    Electronic package with improved current carrying capability and method of forming the same
    3.
    发明申请
    Electronic package with improved current carrying capability and method of forming the same 有权
    具有改善载流能力的电子封装及其形成方法

    公开(公告)号：US20070045816A1

    公开(公告)日：2007-03-01

    申请号：US11529027

    申请日：2006-09-28

    申请人： Govindarajan Natarajan ,  Raschid Bezama

    发明人： Govindarajan Natarajan ,  Raschid Bezama

    IPC分类号： H01L23/04

    CPC分类号： H05K1/0265 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/09881 ,  H01L2924/00

    摘要： An electronic package and method for forming such package that expands the current capability of lines and/or reducing line resistance for packages with a given feature dimension while relaxing feature tolerances. The methods and structures include electrical wirings having regions of larger wire cross-sectional areas in locations where the package must supply higher current distribution to the electronic devices and/or where signal lines need lower electrical resistance. These larger wire cross-sectional areas are vertically extended conductors applied to either the entire conductor or portions of the conductor.

    摘要翻译： 一种用于形成这种封装的电子封装和方法，其在放宽特征容差的同时，扩展线的电流能力和/或降低具有给定特征尺寸的封装的线路电阻。 所述方法和结构包括具有较大导线截面面积的区域的电线，该区域在封装必须向电子器件提供较高电流分布的位置和/或信号线需要较低电阻的位置。 这些较大的导线横截面积是垂直延伸的导体，其应用于导体的整个导体或部分。

    HIGH POWER MICROJET COOLER
    6.
    发明申请
    HIGH POWER MICROJET COOLER 失效
    高功率微型冷却器

    公开(公告)号：US20070227173A1

    公开(公告)日：2007-10-04

    申请号：US11308504

    申请日：2006-03-30

    申请人： Raschid Bezama ,  Govindarajan Natarajan

    发明人： Raschid Bezama ,  Govindarajan Natarajan

    IPC分类号： F28D5/00 ,  F25D23/12

    CPC分类号： H01L23/4735 ,  F28F3/12 ,  F28F13/02 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A distribution apparatus, system and method for thermal control whereby a plate of a manifold assembly has predetermined surface features positioned on specific locations on a surface thereof for enhancing the cooling capabilities of the assembly. The predetermined surface features of the plate delay a velocity decay of a fluid impinging the surface of the plate, while also increase the surface area of the plate exposed to the impinging liquid, which in turn, maximize both the reliability and thermal performance of the overall thermal system at a given maximum operating pressure.

    摘要翻译： 一种用于热控制的分配设备，系统和方法，其中歧管组件的板具有定位在其表面上的特定位置上的预定表面特征，以增强组件的冷却能力。 板的预定表面特征延迟了撞击板表面的流体的速度衰减，同时还增加了暴露于冲击液体的板的表面积，这进而使整体的可靠性和热性能最大化 热系统在给定的最大工作压力。

    MICROJET MODULE ASSEMBLY
    7.
    发明申请
    MICROJET MODULE ASSEMBLY 失效

    公开(公告)号：US20060260784A1

    公开(公告)日：2006-11-23

    申请号：US10908622

    申请日：2005-05-19

    申请人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

    发明人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

    摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

    High performance integrated MLC cooling device for high power density ICS and method for manufacturing
    8.
    发明授权
    High performance integrated MLC cooling device for high power density ICS and method for manufacturing 有权
    高性能集成MLC冷却装置，用于高功率密度ICS和制造方法

    公开(公告)号：US07255153B2

    公开(公告)日：2007-08-14

    申请号：US10908758

    申请日：2005-05-25

    申请人： Daniel G. Berger ,  Raschid J. Bezama ,  Lester W. Herron ,  Bruno Michel ,  Govindarajan Natarajan

    发明人： Daniel G. Berger ,  Raschid J. Bezama ,  Lester W. Herron ,  Bruno Michel ,  Govindarajan Natarajan

    IPC分类号： H05K7/20

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  Y10S165/908 ,  H01L2924/00

    摘要： A manifold apparatus, system and method for thermally controlling a substrate whereby a manifold body having a microjet array and a drain array traversing there-through in a direction orthogonal to a substrate surface and parallel to each other is attached to the substrate surface for heating or cooling thereof. A cavity of the manifold body resides over the substrate surface such that liquid is emitted from the liquid microjets into the cavity for contact with the substrate surface, while the drains orthogonally remove spent liquid from the cavity. The manifold body is designed and configured into a plurality of cooling cells, whereby each cooling cell has a liquid microjet surrounded by at least three drains for preventing interactions between adjacent liquid microjets within adjacent cooling cells. Gas microjets may also traverse through the manifold body to form an atomized liquid spray for contact with the substrate surface.

    摘要翻译： 一种用于热控制基板的歧管装置，系统和方法，由此具有在与基板表面正交并且彼此平行的方向上横过其的微喷射阵列和排列阵列的歧管主体附接到基板表面用于加热或 冷却。 歧管体的腔体位于衬底表面上，使得液体从液体微喷射器发射到腔体中以与衬底表面接触，而排水口从腔体正交地去除废液体。 歧管主体被设计和构造成多个冷却单元，由此每个冷却单元具有由至少三个排水沟包围的液体微型喷射器，以防止相邻冷却单元内的相邻液体微型喷嘴之间的相互作用。 气体微粒也可以穿过歧管体以形成用于与衬底表面接触的雾化液体喷雾。

    Glass sheet laminating system
    9.
    发明授权
    Glass sheet laminating system 有权
    玻璃板层压系统

    公开(公告)号：US08916017B2

    公开(公告)日：2014-12-23

    申请号：US13456516

    申请日：2012-04-26

    申请人： Govindarajan Natarajan ,  Nathaniel David Wetmore

    发明人： Govindarajan Natarajan ,  Nathaniel David Wetmore

    IPC分类号： B29C65/00 ,  B32B37/00 ,  B32B17/00 ,  B32B17/10 ,  C03C27/00 ,  G02C7/00 ,  B60J1/00 ,  E06B3/00 ,  E06B5/00 ,  E06B7/00 ,  E06B3/24

    CPC分类号： B32B17/10018 ,  B32B17/10889 ,  B32B17/10954 ,  B32B37/12 ,  B32B38/1841 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2315/08 ,  B32B2457/20

    摘要： A contoured glass sheet laminating system may include a glass-side vacuum bed, a laminate-side vacuum bed and a lamination actuator. The glass-side vacuum bed may include a vacuum backside and a mold-receiving side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the glass-side vacuum bed between the vacuum backside and the mold-receiving side of the glass-side vacuum bed. The laminate-side vacuum bed may include a vacuum backside and a thin-film loading side and may have sufficient permeability to permit a vacuum system to pull a vacuum across a thickness of the laminate-side vacuum bed between the vacuum backside and the thin-film loading side of the of the laminate-side vacuum bed.

    摘要翻译： 成型玻璃板层压系统可以包括玻璃侧真空床，层压板真空床和层压致动器。 玻璃侧真空床可以包括真空背面和模具接收侧，并且可以具有足够的渗透性，以允许真空系统在真空背面和模具接收之间拉动真空穿过玻璃侧真空床的厚度 侧玻璃侧真空床。 层压体侧真空床可以包括真空背面和薄膜装载侧，并且可以具有足够的渗透性，以允许真空系统在真空背面和薄膜真空床之间拉动层压体侧真空床的厚度， 层压板真空床的膜装载侧。