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公开(公告)号：US09421771B2
公开(公告)日：2016-08-23
申请号：US14706857
申请日：2015-05-07
发明人： Junji Tatsumi , Genji Inada , Sayaka Seki , Yuichiro Akama
IPC分类号： B41J2/14 , B41J2/16 , B32B38/00 , B32B37/18 , B32B37/12 , B32B27/06 , B29C65/52 , B32B9/00 , B32B3/06 , F16B11/00 , B29K701/00 , B29K707/00 , B29K709/02 , B29L31/00 , B29C65/48 , B29C65/00 , B29C65/14
CPC分类号： B41J2/16 , B29C65/1406 , B29C65/4835 , B29C65/4845 , B29C65/524 , B29C66/1122 , B29C66/54 , B29C66/71 , B29C66/73112 , B29C66/7461 , B29K2701/00 , B29K2707/00 , B29K2709/02 , B29L2031/767 , B32B3/06 , B32B9/00 , B32B9/005 , B32B27/06 , B32B37/1292 , B32B37/18 , B32B38/0004 , B32B2037/1253 , B32B2250/02 , B32B2313/00 , B32B2315/02 , B41J2/14 , B41J2/1433 , B41J2/1603 , B41J2/162 , B41J2/1623 , F16B11/00 , F16B11/006 , Y10T156/1064 , B29K2083/00
摘要： A liquid ejection head includes a recording element substrate that ejects liquid, and an element-substrate support member to which the recording element substrate is bonded with an adhesive. A groove to be filled with the adhesive is provided in a bonding region of the element-substrate support member, at which the element-substrate support member and the recording element substrate are bonded together, along a part or an entirety of the outer circumference of the recording element substrate.
摘要翻译： 液体喷射头包括喷射液体的记录元件基板和用粘合剂粘结记录元件基板的元件 - 基板支撑元件。 在元件 - 衬底支撑构件的元件 - 衬底支撑构件和记录元件衬底结合在一起的接合区域中，沿着一部分或整体的外周的一部分或全部设置有待填充有粘合剂的沟槽 记录元件基板。
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2.发明申请公开(公告)号：US20170310890A1
公开(公告)日：2017-10-26
申请号：US15138568
申请日：2016-04-26
发明人： Tsung Wei Wan , Ting-Yu Cheng , Wei-Ping Chen , Chuen-Yi Yin
IPC分类号： H04N5/232 , A61B1/00 , A61B1/05 , B29C43/02 , B29C43/18 , B29C65/48 , H04N5/225 , G02B13/00 , G02B9/10 , B29D11/00 , B29C65/00 , B29K63/00 , B29K105/20 , B29K701/00 , B29K709/08 , B29L31/00 , G02B5/20
CPC分类号： H04N5/23238 , A61B1/00096 , A61B1/0011 , A61B1/00186 , A61B1/051 , B29C43/021 , B29C43/18 , B29D11/00009 , B29D11/00307 , B29D11/0073 , B29K2063/00 , B29K2105/20 , B29K2701/00 , B29K2709/08 , B29L2011/00 , B29L2031/753 , G02B5/20 , G02B9/10 , G02B13/003 , G02B13/006 , G02B13/0085 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N2005/2255
摘要： An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.
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公开(公告)号：US09874329B2
公开(公告)日：2018-01-23
申请号：US14667854
申请日：2015-03-25
CPC分类号： F21S41/29 , B29C65/1635 , B29C65/1654 , B29C65/1667 , B29C65/167 , B29C65/1674 , B29C65/1687 , B29C65/169 , B29C66/114 , B29C66/1142 , B29C66/131 , B29C66/301 , B29C66/542 , B29C66/71 , B29K2701/00 , B29L2011/00 , B29L2031/30 , B29L2031/3055 , B29L2031/747 , F21S41/295 , F21S43/27 , B29K2069/00 , B29K2033/12 , B29K2055/02
摘要： A method of manufacturing an automotive light including the steps of: providing a container body delimited by a first perimetral profile; providing a lenticular body delimited by a second perimetral profile; associating the profiles, with a contact surface therebetween defining a welding interface; providing a laser emission device emitting radiation, operatively connected to a first light guide with an output to distribute radiation via a spatial distribution including with lobes; providing a second light guide inside the lenticular body adapted to obtain a light guide of radiation inside the lenticular body, having walls defined by a first lobe; arranging the guides to route a first lobe of radiation from the output towards the second guide, to propagate at least one lobe of radiation inside the second light guide towards the welding interface; wherein the container body acts as an absorbing member and the lenticular body acts as a transmissive member.
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公开(公告)号：US10399433B2
公开(公告)日：2019-09-03
申请号：US15651381
申请日：2017-07-17
发明人： Shinsuke Amano , Hideki Iwata
IPC分类号： B60K15/03 , B29C49/20 , B29L31/00 , B29K705/00 , B29K701/00
摘要： There is provided a fuel tank including: a tank main body that stores fuel at an interior and has a pair of wall portions that face one another; and a supporting pillar that spans between the pair of wall portions, wherein the supporting pillar includes a shaft portion that is disposed with an axial direction thereof being a direction in which the pair of wall portions face one another, a pair of flange portions that extend-out toward a radial direction outer side of the shaft portion from axial direction both end portions of the shaft portion, and that are joined to the pair of wall portions, and plural ribs that are formed at a periphery of the shaft portion, and that span between the shaft portion and the pair of flange portions, and that have weak portions that are weakened locally.
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公开(公告)号：US10343316B2
公开(公告)日：2019-07-09
申请号：US15322979
申请日：2015-07-01
发明人： Tim Willem Joseph Leonard Dassen , Davy Wilhelmus Anna Brands , Claire Martin , Angel Stoyanov Yanev
IPC分类号： B29C43/18 , B29C45/14 , B29C45/00 , B62D29/04 , B29L23/00 , B29K105/12 , B29K701/00 , B29K105/20 , B29L31/30
摘要： A method for manufacturing a hollow overmolded polymeric article comprising: positioning a hollow polymeric structure (10) in a mold (100); supporting the interior surface of the hollow polymeric structure; disposing a fibrous polymeric material (12) into the mold proximal to the outer surface of the hollow polymeric structure; overmolding the fibrous polymeric material onto to the outer surface of the hollow polymeric structure; opening the mold; and removing a hollow overmolded polymeric article comprising the fibrous polymeric material overmolded on the hollow polymeric structure.
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6.发明授权公开(公告)号：US10075636B2
公开(公告)日：2018-09-11
申请号：US15138568
申请日：2016-04-26
发明人： Tsung Wei Wan , Ting-Yu Cheng , Wei-Ping Chen , Chuen-Yi Yin
IPC分类号： H04N7/00 , H04N5/232 , H04N5/225 , G02B13/00 , G02B9/10 , B29C43/18 , B29C43/02 , B29D11/00 , A61B1/05 , A61B1/00 , G02B5/20 , B29K63/00 , B29K105/20 , B29K701/00 , B29K709/08 , B29L31/00
CPC分类号： A61B1/00186 , A61B1/00096 , A61B1/0011 , A61B1/041 , A61B1/051 , B29C43/021 , B29C43/18 , B29D11/00009 , B29D11/00307 , B29D11/0073 , B29K2063/00 , B29K2105/20 , B29K2701/00 , B29K2709/08 , B29L2011/00 , B29L2031/753 , G02B5/20 , G02B9/10 , G02B13/003 , G02B13/006 , G02B13/0085 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N2005/2255
摘要： An ultra-small camera module with wide field of view includes (a) a wafer-level lens system for forming, on an image plane, an image of a wide field-of-view scene, wherein the wafer-level lens system includes (i) a distal planar surface positioned closest to the scene and no more than 2.5 millimeters away from the image plane in direction along optical axis of the wafer-level lens system, and (ii) a plurality of lens elements optically coupled in series along the optical axis, each of the lens elements having a curved surface, and (b) an image sensor mechanically coupled to the wafer-level lens system and including a rectangular array of photosensitive pixels, positioned at the image plane, for capturing the image, wherein cross section of the ultra-small camera module, orthogonal to the optical axis, is rectangular with side lengths no greater than 1.5 millimeters.
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