Aqueous resin composition and its uses
    3.
    发明申请
    Aqueous resin composition and its uses 有权
    水性树脂组合物及其用途

    公开(公告)号:US20040241484A1

    公开(公告)日:2004-12-02

    申请号:US10840346

    申请日:2004-05-07

    IPC分类号: B32B027/30

    CPC分类号: C09D133/08 Y10T428/31935

    摘要: An object of the present invention is to provide an aqueous resin composition and its uses, wherein the aqueous resin composition combines the blocking resistance and the frost damage resistance and thereby can secure the durability over a long period of time even under circumstances where a severe temperature cycle is present. As a means of achieving this object, the aqueous resin composition according to the present invention is an aqueous resin composition comprising an acrylic resin emulsion and a crosslinking agent as essential components, with the aqueous resin composition being characterized in that, when a coating film is formed from the aqueous resin composition, the formed coating film exhibits an elongation ratio (E (%)) that satisfies a specific relational expression along with the glass transition temperature (TgT (null C.)) of the acrylic resin in the emulsion.

    摘要翻译: 本发明的目的在于提供一种水性树脂组合物及其用途,其中水性树脂组合物结合了耐粘连性和耐冻结性,从而即使在严重的温度 循环存在。 作为实现该目的的手段,本发明的水性树脂组合物是以丙烯酸树脂乳液和交联剂为必须成分的水性树脂组合物,其特征在于,当涂膜为 由水性树脂组合物形成的成型涂膜的伸长率(E(%))与丙烯酸树脂的玻璃化转变温度(Tg℃(℃))一致,满足特定的关系式 乳液。

    Resin sealing method for semiconductors and release film used therefor
    7.
    发明申请
    Resin sealing method for semiconductors and release film used therefor 审中-公开
    用于半导体和离型膜的树脂密封方法

    公开(公告)号:US20020142153A1

    公开(公告)日:2002-10-03

    申请号:US09748199

    申请日:2000-12-27

    IPC分类号: B32B025/04 B32B027/30

    摘要: A resin sealing method for semiconductors comprises molding a resin with a release film 1 interposed between a molding die 4 and a sealing surface of a semiconductor chip 2 having terminals 22 or electrodes in such a manner that the sealed semiconductor chip may have the tips of the terminals 22 or the electrodes exposed on the surface of the cured resin which has been in contact with the release film 1, wherein the release film 1 is a composite film comprising a base layer 11 and an auxiliary layer 12 having a lower compressive modulus than the base layer 11, and the release film is used with the auxiliary layer 12 facing the sealing surface of the semiconductor chip 2.

    摘要翻译: 半导体的树脂密封方法包括:将具有介于模具4和具有端子22或电极的半导体芯片2的密封面之间的脱模膜1成型为树脂,使得密封的半导体芯片可以具有 端子22或暴露在已经与脱模膜1接触的固化树脂的表面上的电极,其中脱模膜1是复合膜,其包括基底层11和具有比所述剥离膜1低的压缩模量的辅助层12 基层11,并且与辅助层12面对半导体芯片2的密封面一起使用剥离膜。

    Photopolymerizable composition and photopolmerizable lithographic printing plate
    9.
    发明申请
    Photopolymerizable composition and photopolmerizable lithographic printing plate 有权
    可光聚合组合物和可光聚合的平版印刷版

    公开(公告)号:US20020114966A1

    公开(公告)日:2002-08-22

    申请号:US10079408

    申请日:2002-02-22

    发明人: Toshiyuki Urano

    IPC分类号: B32B027/30

    摘要: A photopolymerizable composition which is highly sensitive to light not only in the visible region but in long-wavelength regions including the near infrared region, is not sensitive to light in the ultraviolet region, and has excellent handling efficiency under day light fluorescent lamps, and a photopolymerizable lithographic printing plate, are presented. A photopolymerizable composition comprising the following components (A), (B) and (C), and a photopolymerizable lithographic printing plate comprising a support and, formed on a surface thereof, a layer of the photopolymerizable composition: (A) an ethylenically unsaturated compound; (B) a dye which has, as a basic structure, a structure having hetero atoms connected via a polymethine chain and which is selected from the group consisting of the following (B-1), (B-2), (B-3) and (B-4): (B-1) a dye having, on a polymethine chain, a substituent containing a chain ether bond which forms an oxonium cation or a chain thioether bond which forms a sulfonium cation, upon resonance in the dye molecule, (B-2) a dye having, on a polymethine chain, two substituents forming a cyclic ether bond which forms an oxonium cation or a cyclic thioether bond which forms a sulfonium cation, upon resonance in the dye molecule, (B-3) a dye having, on a polymethine chain, a substituent containing an amino-vinyl bond which forms an aminium cation upon resonance in the dye molecule, and (B-4) a dye having, on a polymethine chain or other basic structure, a substituent containing an acid anion group, its ester group or a base; and (C) a photopolymerization initiator.

    摘要翻译: 对于不仅在可见光区域而且在包括近红外区域的长波长区域中的光敏性高的光聚合性组合物对紫外线区域的光不敏感,并且在日光灯下具有优异的处理效率, 可光聚合平版印刷版。 包含以下组分(A),(B)和(C)的可光聚合组合物和包含载体的可光聚合平版印刷版,并在其表面上形成一层可光聚合组合物:(A)烯属不饱和化合物 ; (B)作为基本结构的具有通过聚甲炔链连接的杂原子的结构的染料,其选自下列(B-1),(B-2),(B-3) )和(B-4):(B-1)在聚甲炔链上具有形成硫鎓阳离子的链式醚键的取代基或形成锍阳离子的链硫醚键的染料在染料中共振时 分子,(B-2)在染料分子中共振时,在聚甲炔链上具有形成环状醚键的两个取代基,形成氧鎓阳离子或形成锍阳离子的环状硫醚键的染料(B-3) )在聚甲炔链上具有在染料分子中共振时形成氨阳离子的氨基乙烯基键的取代基的染料,和(B-4)在聚甲炔链或其它碱性结构上具有 含有酸阴离子基团的取代基,其酯基或碱基; 和(C)光聚合引发剂。

    Co-extruded pigmented/clear coated polymeric coating for automotive exterior body panels
    10.
    发明申请
    Co-extruded pigmented/clear coated polymeric coating for automotive exterior body panels 审中-公开
    用于汽车外部车身面板的共挤出着色/透明涂层聚合物涂层

    公开(公告)号:US20020114965A1

    公开(公告)日:2002-08-22

    申请号:US09785407

    申请日:2001-02-16

    发明人: John Horansky

    IPC分类号: B32B027/30

    摘要: A coating for an exterior surface of an automotive vehicle body panel is provided including a first layer of an ionomer polymeric coating material with a transparent base which has been pigmented to a desired color and extruded, a second layer of transparent ionomer polymeric coating material which has been co-extruded with the first layer and a third layer of polymeric coating material co-extruded with the first layer opposite the second layer, the third layer being more opaque than the first layer.

    摘要翻译: 提供了一种用于汽车车身面板的外表面的涂层,其包括具有透明基底的第一层离聚物聚合物涂层材料,所述透明基底已被着色为期望的颜色并挤出,第二层透明离聚物聚合物涂层材料具有 与第一层共同挤出,第三层聚合物涂层材料与第二层共面挤出,第三层比第一层更不透明。