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    Cutting implement and method of making same
    1.
    发明授权
    Cutting implement and method of making same 失效
    切割工具及其制作方法

    公开(公告)号：US4534827A

    公开(公告)日：1985-08-13

    申请号：US527165

    申请日：1983-08-26

    Applicant: Donald W. Henderson

    Inventor： Donald W. Henderson

    IPC: A61B17/3211 ,  A61B17/32 ,  A61F2/00 ,  B23P15/40 ,  B24B3/36 ,  B26B9/00 ,  B26B21/58 ,  C23F1/00 ,  C23F1/06

    CPC classification number: A61B17/3211 ,  B26B21/58 ,  A61F2002/30084

    Abstract: A cutting tool, preferably in the form of a scalpel, microtome or razor blade is fabricated from single crystal material such as aluminum oxide with a preferential etching process to produce a radius of curvature less than 100 Angstroms on the edge. Depending upon the etchant, the crystallographic orientation of the blank and the resulting different etch rates on blade surfaces, the preferential etching process not only sharpens a preformed edge but also, in one embodiment, produces an opposing edge which meets the sharpened edge at a point, thereby to produce a particularly efficient scalpel blade configuration having two cutting edges converging at a point for plunging and cutting. With respect to the sharpening of the cutting edge, consistent with all other blade forming requirements, the subject blade is made to a maximum sharpness by utilizing a maximum ratio of bevel plane etch rate to edge plane etch rate. This maximum ratio maximizes the edge sharpness when a steady state etching geometry has been achieved. In one embodiment, and for a given edge sharpness, blade drag is minimized by selecting the crystallographic orientation and etchant such that the etchant chemically polishes the bevels and maintains the planarity of the bevel planes. In order to achieve identical etching of the bevels meeting at the blade edge and thus maintain original blade geometry, the blank can be oriented such that the edge forming planes are crystallographically identical planes.

    Abstract translation: 优选以手术刀，切片机或剃刀刀片形式的切割工具由诸如氧化铝的单晶材料制成，具有优先蚀刻工艺，以在边缘上产生小于100埃的曲率半径。 取决于蚀刻剂，坯料的晶体取向和叶片表面上产生的不同蚀刻速率，优选的蚀刻工艺不仅可以锐化预成型的边缘，而且在一个实施例中，还产生一个相对的边缘，其在一个点处与锋利的边缘相遇 从而产生特别有效的手术刀刀片构造，其具有两个切削刃在一个点处会聚，用于切入和切割。 关于切削刃的磨削，与所有其他刀片成形要求一致，通过利用斜面平面蚀刻速率与边缘平面蚀刻速率的最大比率使主体刀片达到最大锐度。 当达到稳态蚀刻几何形状时，该最大比率使边缘锐度最大化。 在一个实施例中，并且对于给定的边缘清晰度，通过选择晶体取向和蚀刻剂使刀片阻力最小化，使得蚀刻剂化学抛光斜面并保持斜面的平面度。 为了实现在叶片边缘处相遇的斜面的相同蚀刻，从而保持原始叶片几何形状，坯料可以被定向成使得边缘形成平面在晶体学上是相同的平面。

    Solution and process for chemically resharpening smoothing tools, forming tools and cutting tools
    4.
    发明授权
    Solution and process for chemically resharpening smoothing tools, forming tools and cutting tools 失效
    用于化学改性平滑工具，成型工具和切削工具的解决方案和工艺

    公开(公告)号：US5382319A

    公开(公告)日：1995-01-17

    申请号：US133995

    申请日：1993-10-12

    Applicant: Anthony J. Tumminaro, Jr.

    Inventor： Anthony J. Tumminaro, Jr.

    IPC: C23F1/06 ,  C23F1/28 ,  C23F1/00

    CPC classification number: C23F1/06 ,  C23F1/28

    Abstract: This invention relates to a solution and process for chemically resharpening smoothing, forming, and cutting tools such as files, jigsaw blades, hacksaw blades, coping saw blades, bandsaw blades, and the like. The solution contains preferred concentrations of phosphoric acid, anionic and nonionic surfactants including ethyl alcohol and distilled water. The tools are immersed in the solution for a period of 2 to 5 hours depending upon the wear to the tools, after which the tools are removed, wiped, and allowed to air dry to allow a rust resistant coating from the solution to adhere to the tools.

    Abstract translation: 本发明涉及一种用于化学改性平滑化，成型和切割诸如文件，拼图刀片，钢锯刀片，应对锯片，带锯刀片等工具的方法和方法。 该溶液含有优选的磷酸浓度，阴离子和非离子表面活性剂，包括乙醇和蒸馏水。 根据工具的磨损，将工具浸入溶液中2至5小时，然后将工具取出，擦拭并使其风干，以使溶液中的防锈涂层粘附到 工具

    APPARATUS FOR CHEMICALLY ETCHING A WORKPIECE
    7.
    发明申请
    APPARATUS FOR CHEMICALLY ETCHING A WORKPIECE 有权
    化学蚀刻工具的设备

    公开(公告)号：US20100230049A1

    公开(公告)日：2010-09-16

    申请号：US12722614

    申请日：2010-03-12

    Applicant: Oliver Ansell ,  Anthony Barrass ,  Paul Bennett ,  David Tossell

    Inventor： Oliver Ansell ,  Anthony Barrass ,  Paul Bennett ,  David Tossell

    IPC: C23F1/06

    CPC classification number: H01L21/67253 ,  H01J37/32917 ,  H01J37/32935 ,  H01J37/32963 ,  H01J37/32972 ,  H01J37/32981 ,  H01J37/3299

    Abstract: Apparatus for chemically etching a workpiece includes a chamber for receiving a process gas and having a pumping port for extracting exhaust gases, and a workpiece support located in the chamber upstream of the pumping port. The chamber further includes a sub-chamber located upstream of the pumping port and downstream of the workpiece support, and the sub-chamber includes a window and an excitation source, adjacent the window, for creating a plasma in a sample of the exhaust gases to create an optical emission which can be monitored through the window.

    Abstract translation: 用于化学蚀刻工件的设备包括用于接收处理气体并具有用于抽取废气的泵送端口的腔室和位于泵送端口上游的腔室中的工件支撑件。 腔室还包括位于泵送端口的上游并且在工件支撑件的下游的子室，并且子室包括与窗口相邻的窗口和激发源，用于在废气样本中产生等离子体 产生可通过窗口监测的光发射。

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