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公开(公告)号：US3917464A
公开(公告)日：1975-11-04
申请号：US38112173
申请日：1973-07-20
申请人： US ARMY
CPC分类号： C23C18/34 , Y10S428/926 , Y10S428/936 , Y10T428/12937 , Y10T428/12986
摘要： Improved electroless deposits of cobalt-boron which find particular use in protecting basis metals against corrosive attack, the deposits being prepared from an acid bath having the following preferred composition:
D R A W I N G摘要翻译： 改进的钴 - 硼的无电沉积物，其特别用于保护基础金属免受腐蚀侵蚀，沉积物由具有以下优选组成的酸浴制备：}硫酸钴.7H 2 O 25g / l}琥珀酸钠6H 2 O 25g / l}硫酸钠15g / l}二甲胺硼烷4g / l}
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公开(公告)号：US3632487A
公开(公告)日：1972-01-04
申请号：US3632487D
申请日：1969-09-30
申请人： PENNWALT CORP
CPC分类号： C25D5/36
摘要： Electrolytically coated tinplate having defect-free surfaces is prepared by subjecting steel to hot-rolling pickling, coldrolling to form strip, cleaning, rinsing in an aqueous medium containing a substance in minor concentration that remains on the steel strip and is capable of reacting with carbonaceous material during the batch annealing cycle, winding the strip into a tight coil, batch annealing, temper rolling, cleaning, pickling, and coating with tin by electrolytic means.
摘要翻译： 具有无缺陷表面的电解涂层马口铁通过对钢进行热轧酸洗，冷轧以形成条，清洗，漂洗在含有少量残留在钢带上的物质并能够反应的水性介质中来制备 在分批退火循环期间用含碳材料将带材卷绕成紧密卷材，分批退火，回火轧制，清洗，酸洗和用电解电镀涂层。
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3.发明授权
公开(公告)号：US3527678A
公开(公告)日：1970-09-08
申请号：US3527678D
申请日：1967-09-20
发明人： SUZUKI TAKASHI
CPC分类号： C25D7/0671 , C25D5/02 , C25F3/16
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公开(公告)号：US3420755A
公开(公告)日：1969-01-07
申请号：US3420755D
申请日：1964-01-13
发明人： PARET PIERRE
IPC分类号： B24B1/00 , B24C1/00 , C23C26/00 , C25D7/10 , F16C33/12 , G21C19/10 , C23B5/00 , B24C1/08 , C23B3/00
CPC分类号： C23C26/00 , B24B1/00 , B24C1/00 , C25D7/10 , F16C33/12 , F16C33/125 , F16C33/14 , F16C2204/04 , F16C2204/44 , F16C2204/52 , F16C2220/70 , F16C2223/06 , F16C2223/08 , F16C2223/70 , G21C19/10
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公开(公告)号：US06929722B2
公开(公告)日：2005-08-16
申请号：US09945711
申请日：2001-09-05
申请人： Akihisa Hongo , Naoaki Ogure , Hiroaki Inoue , Norio Kimura , Fumio Kuriyama , Manabu Tsujimura , Kenichi Suzuki , Atsushi Chono
发明人： Akihisa Hongo , Naoaki Ogure , Hiroaki Inoue , Norio Kimura , Fumio Kuriyama , Manabu Tsujimura , Kenichi Suzuki , Atsushi Chono
IPC分类号： C25D7/12 , H01L21/00 , H01L21/288 , H01L21/768 , C25D17/00 , H01M4/29 , C23B3/00
CPC分类号： H01L21/67167 , C25D17/001 , H01L21/2885 , H01L21/67051 , H01L21/67126 , H01L21/67161 , H01L21/67173 , H01L21/6719 , H01L21/67219 , H01L21/6723 , H01L21/76849 , H01L21/76877 , Y10S134/902
摘要： A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit are combined into a unitary arrangement.
摘要翻译： 基板电镀装置在由微细凹槽和/或限定在基板中的细孔构成的互连区域上形成布线层。 基板电镀装置包括用于在包括互连区域的基板的表面上形成镀层的电镀单元，用于对基板进行化学机械抛光以从基板的表面移除镀层的化学机械抛光单元， 互连区域中的镀层，用于在形成镀层之后对基板进行清洗或基板进行化学机械抛光的清洁单元，用于在清洁基板之后使基板干燥的干燥单元，以及用于将基板转印 第一电镀单元，第一化学机械抛光单元，清洁单元和干燥单元中的每一个的基板。 第一电镀单元，第一化学机械抛光单元，清洁单元，干燥单元和基板转移单元组合成一体的布置。
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公开(公告)号：US3973948A
公开(公告)日：1976-08-10
申请号：US594734
申请日：1975-07-10
CPC分类号： B22F1/0096 , C23C4/08
摘要： Free flowing powders, such as for flame spray applications, are produced by spray drying a slurry of finely divided particles of the metal in a solvent-binder system to produce agglomerates, wherein the binder is a soluble compound of the metal. These agglomerates possess sufficient green strength to be screened and exhibit higher apparent densities than comparable powders agglomerated with conventional organic binders. When these powders are heated in a reducing atmosphere above the decomposition temperature of the binder, the binder converts to base metal and harmless by-products, such as nitrogen and water thus avoiding contamination of the product, equipment and work area usually associated with conventional organic binders.
摘要翻译： 通过在溶剂 - 粘合剂体系中喷雾干燥细分散的金属颗粒的浆料来产生自由流动的粉末，例如用于火焰喷涂的粉末，以产生附聚物，其中粘合剂是金属的可溶性化合物。 这些附聚物具有足够的生坯强度以进行筛选并且表现出比用常规有机粘合剂附聚的可比粉末更高的表观密度。 当这些粉末在高于粘合剂分解温度的还原气氛中加热时，粘合剂转化为贱金属和无害的副产物，如氮气和水，从而避免了通常与常规有机物相关的产品，设备和工作区域的污染 粘合剂
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公开(公告)号：US3806393A
公开(公告)日：1974-04-23
申请号：US23087172
申请日：1972-03-01
申请人： HOELLMUELLER FA HANS
发明人： HAAS RAINER
CPC分类号： C23F1/46
摘要： AN APPARATUS FOR ETCHING COPPER AND COPPER ALLOYS BY MEANS OF AN AMMONIACAL ETCHING SOLUTION CONTAINING CHLORIDE IONS AND FOR REGENERATING THIS ETCHING SOLUTION DURING THIS ETCHING PROCESS BY ADDING AN AMMONIACIAL COMPOUND, FOR EXAMPLE, IN THE FORM OF AMMONIUM HYDROXIDE OR AMMONIA GAS, AS WELL AS HYDROCHLORIC ACID AND WATER TO THE ETCHING SOLUTON IN ACCORDANCE WITH CONTINUOUS MEASUREMENTS OF THE PH-VALUE AND THE SPECIFIC GRAVITY OF THE ETCHING SOLUTION.
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公开(公告)号：US3785945A
公开(公告)日：1974-01-15
申请号：US3785945D
申请日：1972-05-04
发明人： MACARTHUR D
IPC分类号： C25F3/08 , C25F7/00 , H01L21/3063 , H01L21/3213 , C23B3/00
CPC分类号： H01L21/32134 , C25F3/08 , C25F7/00
摘要： A TECHNIQUE FOR ELECTROLYTICALLY ETCHING TUNGSTEN FILMS INVOLVES THE USE OF BORATE PHOSPHATE AND CARBONATE BUFFERED ELECTROLYTES HAVING A PH WITHIN THE RANGE OF 7.0 TO 10.5. THE DESCRIBED PROCESS PERMITS AUTOMATION OF THE ETCHING PROCESS AND ELIMINATES THE FORMATION OF ISOLATED ISLANDS OF UNETCHED MATERIALS.
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公开(公告)号：US3751352A
公开(公告)日：1973-08-07
申请号：US3751352D
申请日：1972-03-02
申请人： HUGHES AIRCRAFT CO
摘要： A METHOD OF ELECTROPOLISHING WORKPIECES AS MOLYBDENUM ELECTRODES AND GRIDS AND REMOVAL OF OXIDIATION ON STAINLESS STEEL, WITH A CURRENT DENSITY ON THE ORDER OF 0.9 TO 5 AMPERES PER SQ. INCH IN A VOLTAGE RANGE IN THE ORDER OF 15 TO 90 VOLTS, USING AN ANHYDROUS ACETIC ACID BASED BATH CONTAINING ABOUT 10 PERCENT SULFURIC ACID. THE PROCESS IS RELATIVELY FREE OF VARIOUS HAZARDS COMMON TO THE ELECTROPOLISHING OF METALS, E.G. HIGH CELL VOLTAGE, EXCESSIVE METAL LOSS AND DANGEROUS ELECTROLYTE COMPOSITIONS.
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公开(公告)号：US3880685A
公开(公告)日：1975-04-29
申请号：US87410069
申请日：1969-11-05
发明人： REHM ALFRED , EGGERT WINFRIED
CPC分类号： C23F1/46 , C23F1/08 , Y10S134/902
摘要： Copper and copper alloys, in particular copper-coated laminates, are etched by immersing them in or spraying them with a solution of cupric chloride and regenerating the formed cuprous chloride during continuing operation by adding hydrogen peroxide and hydrochloric acid to the etching solution, the amount of the addition being controlled by measurements of the redox potential by means of a redox electrode and the control being adjusted to add predetermined amounts of the said two additives whenever the copper-I-ion concentration reaches a predetermined value, preferably 0.4 g/l so as to maintain a constant etching speed. An apparatus for use in this method comprises a tank for the etching solution, means for applying the solution to the copper or copper alloy material, a redox electrode immersed in the said tank, supply vessels for holding the regenerating additives, a conduit between said supply vessels and the tank, valve means for passing the regenerating liquid from the supply vessels to the tank and control means for operatively connecting the valve means to the redox electrode.
摘要翻译： 通过将铜和铜合金，特别是铜包覆的层压体浸入或喷洒在氯化铜溶液中并在连续操作期间通过向蚀刻溶液中加入过氧化氢和盐酸再生形成的氯化亚铜来蚀刻， 的添加量通过氧化还原电极的氧化还原电位的测量来控制，并且当铜离子浓度达到预定值（优选0.4g / l）时，调节对照物以调节添加预定量的所述两种添加剂 以保持恒定的蚀刻速度。
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