Abstract:
A package assembly including a semiconductor die electrically coupled to a substrate by an interconnected joint structure. The semiconductor die includes a bump overlying a semiconductor substrate, and a molding compound layer overlying the semiconductor substrate and being in physical contact with a first portion of the bump. The substrate includes a no-flow underfill layer on a conductive region. A second portion of the bump is in physical contact with the no-flow underfill layer to form the interconnected joint structure.
Abstract:
A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.
Abstract:
A method of fabricating polysilicon patterns. The method includes depositing polysilicon on a substrate. The polysilicon may be doped or pre-doped depending upon the application. A mask layer is applied and patterned. Thereafter, the polysilicon is etched to form the polysilicon patterns and an oxidizing step is performed. The mask layer is removed after the oxidizing step is performed.
Abstract:
Methods and systems are described for determining floating body delay effects in an SOI wafer, wherein test apparatus is provided in a wafer comprising a plurality of floating body devices fabricated in series in the wafer, and a pulse generation circuit providing a pulse output corresponding to a delay time associated with the floating body chain according to an input pulse edge and a propagated pulse edge from the floating body devices.
Abstract:
A real-time and in-line process control system maintains stable plating performance in copper electrochemical plating IC devices by using a real time, on-line programmable controller. Two or more valves to direct the flow of the electrolyte from the electroplating cell back to the reservoir connect an alternative carbon-filter as well as a mirco-filter. The programmable controller controls the operation of at least two in-line valves to direct the flow of the electrolyte within the system.
Abstract:
Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.
Abstract:
Systems and/or methods that accessing data to/from a memory are presented. A memory component can employ an optimized buffer component that can provide a single precharge control signal to facilitate precharging a bitline(s), a y-decoder component(s), an input/output line(s), and/or other lines or components associated with a buffer cell(s) in the optimized buffer component to facilitate optimized timing control associated with execution of operations to facilitate reducing errors that can be caused by charge sharing problems. The optimized buffer component can include an x-decoder component that can employ a JIT power component that can facilitate enabling a wordline associated with a buffer cell(s) only for the length of time access to the buffer cell is desired to read data therefrom or write data thereto to facilitate minimizing the access time and thereby minimize power consumption and/or thermal loading.
Abstract:
A novel, low-temperature metal deposition method which is suitable for depositing a metal film on a substrate, such as in the fabrication of metal-insulator-metal (MIM) capacitors, is disclosed. The method includes depositing a metal film on a substrate using a deposition temperature of less than typically about 270 degrees C. The resulting metal film is characterized by enhanced thickness uniformity and reduced grain agglomeration which otherwise tends to reduce the operational integrity of a capacitor or other device of which the metal film is a part. Furthermore, the metal film is characterized by intrinsic breakdown voltage (Vbd) improvement.
Abstract:
Provided is a multi-segment rotation robotic arm which contains a plurality of concatenated robotic arm segments which can rotate 360 degrees along an adjacent oblique section thereof. Any one of the concatenated robotic arm segments of the multi-segment rotation robotic arm can be arbitrarily concatenate in accordance with use requirements. When the concatenated robotic arm segments rotate relatively, they can rotate 360 degrees without affecting the electric supply, and can also reduce the volume increase by rotated joints. Therefore, the multi-segment rotation robotic arm of the present invention can effectively adapt to complex and tortuous spaces in the body cavity to reduce the possibility of expanding the opening of the minimally invasive surgery and causing damage to organs or tissues in the body cavity.
Abstract:
Provided is a multi-segment rotation robotic arm which contains a plurality of concatenated robotic arm segments which can rotate 360 degrees along an adjacent oblique section thereof. Any one of the concatenated robotic arm segments of the multi-segment rotation robotic arm can be arbitrarily concatenate in accordance with use requirements. When the concatenated robotic arm segments rotate relatively, they can rotate 360 degrees without affecting the electric supply, and can also reduce the volume increase by rotated joints. Therefore, the multi-segment rotation robotic arm of the present invention can effectively adapt to complex and tortuous spaces in the body cavity to reduce the possibility of expanding the opening of the minimally invasive surgery and causing damage to organs or tissues in the body cavity.