Abstract:
A scanning force microscope is disclosed which includes integrated optics for viewing the optical lever arm, probe and sample to be examined. The scanning force microscope includes a simplified mounting of laser and related adjustments and the locating of a detector independent of the scanner, to improve ease of handling and providing convenient locations for adjustments. In one preferred embodiment of the scanning force microscope, the surface of samples may be imaged while the cantilever portion of the scanner is immersed in liquids without special set-up or special adapters.
Abstract:
The present invention provides a new extractor for a micro-column and an alignment method of the aperture of the extractor and an electron emitter for a micro-column. Further, the present invention provides a measuring system, a method for measuring, and an alignment method using the principle of the alignment.
Abstract:
An opaque defect is processed by scanning with a high load or height fixed mode using a probe harder than a pattern material of a photomask at the time of going scanning, and is observed by scanning with a low load or intermittent contact mode at the time of returning scanning so as to detect an ending point of the opaque defect by the height information. When there is a portion reaching to a glass substrate as an ending point, this portion is not scanned by the high load or height fixed mode in the next processing, and only a portion not reaching to the ending point is scanned by the high load or height fixed mode.
Abstract:
There is provided a device in which a probe can be used for both of observation and correction, and which can, even if a next generation photomask of ultra minute structure is made an object, perform a desired processing without injuring a normal portion in a process of obtaining information of a position and a shape of a defect part, and without impairing the probe also at a processing time. It has been adapted such that, at an observation time, a contact pressure between a probe and a mask is reduced to 0.1 nN by applying a vibration of 1 kHz to 1 MHz to the probe. It has been adapted such that a cantilever used in the present invention is formed by a silicon material of 100–600 μm in length and 5–50 μm in thickness and, at the observation time, the probe contacts with the mask at the contact pressure of 0.1 nN and, at the processing time, a defect correction can be performed by causing the probe to contact with the mask at the contact pressure of 10 nN to 1 mN.