摘要:
An ion beam irradiation apparatus is provided with a plasma production device 30 which produces a plasma 12 through the radio frequency discharge and supplies the produced plasma in the vicinity of the substrate 4. The plasma production device 30 includes a plasma producing chamber 32 being elongated along an axis 33 extending in scanning directions X in which the ion beam is moved; a plasma emission hole 34 being provided in a side thereof and elongated along the axis 33 of the plasma producing chamber; and a magnet 36 provided outside the plasma producing chamber 32 for producing a magnetic field having a direction along the axis 33. The magnetic field developed by the magnet 36 contains a magnetic field which has a direction along the axis and bends to the substrate ions contained in the plasma 12 emitted from a plasma emission hole 34.
摘要:
A charged particle beam exposure method includes the steps of creating dot pattern data indicative of a pattern to be exposed, storing the dot pattern data in a first storage device having a first access speed, transferring the dot pattern data from the first storage device to a second storage device having a second, higher access speed, reading the dot pattern data out from the second storage device, and producing a plurality of charged particle beams in response to the dot pattern data read out from the second storage device by means of a blanking aperture array, wherein the blanking aperture array includes a plurality of apertures each causing turning-on and turning-off of a changed particle beam pertinent to the aperture in response to the dot pattern data.
摘要:
A beam delivery system uses a set of electronically controlled magnets with a common magnetic yoke to steer the beam directly onto the products being irradiated with a very short distance between the magnets and the products.
摘要:
An investigation device includes a time of flight mass spectrometer with an entrance opening, and an electrically conductive tip on a cantilever which is movable from a first position near a sample on a sample holder to a second position near the entrance opening. A sample particle is obtained with the tip being in the first position from the sample. The tip, with the particle, is moved into the second position where the particle can be accelerated towards the entrance opening. The particle is analyzable by the time of flight mass spectrometer.
摘要:
A system for inhibiting the transport of contaminant particles with an ion beam includes an electric field generator for generating an electric field relative to a path of travel for the ion beam. A particle located in the ion beam and in a region of the electric field is charged to a polarity according to the ion beam, so that the electric field may urge the charged particle out of the ion beam.
摘要:
Methods are provided for exposing a selected feature of an IC device, such as a selected conductor, from the back side of the substrate without disturbing adjacent features of the device, such as active regions. One such method comprises: (a) determining a region of the IC device in which the selected feature is located; (b) acquiring from the back side of the substrate an IR optical microscope image of the region; (c) aligning the IR optical microscope image with a coordinate system of a milling system; and (d) using structures visible in the IR optical microscope image as a guide, operating the milling system to expose the selected feature from the back side of the IC device without disturbing adjacent features.
摘要:
A system for inhibiting the transport of contaminant particles with an ion beam includes a particle charging system for charging particles within a region through which the ion beam travels. An electric field is generated downstream relative to the charged region so as to urge charged particles away from a direction of travel for the ion beam.
摘要:
Multiple methods are known to process materials or alter their properties using an electron beam. Until now, it was not possible to impinge upon minuscule surface sections (pixel) with a given arrangement on the surface in order to achieve certain effects. According to the invention, the object to be impinged upon is moved contact-free under a mask. A bidimensional deflectable electron beam oscillating at a high frequency perpendicular to the direction of movement of the object is moved on the mask, the speed being essentially faster than that of the movement of the object. Said method can be used for processing any material, preferably plane or band-shaped objects, in order to achieve processing effects by means of physical or chemical reaction.
摘要:
An electron beam aperture element (10) comprises a body (11) provided with a passage (12) for an electron beam (E) and with a blocking surface (15) for blocking travel of part or all of the beam otherwise than through the passage. The blocking surface (15) is angled to cause departing electrons derived from the blocked beam or part thereof to be directed away from the axis (13) of the passage and, in particular, into an electron trap cavity (21) bounded by the surface (15) and a wall of a screening member (17). The wall returns electrons to the blocking surface (15) for redirection back into the cavity (21), thus preventing escape of scattered electrons or delaying their escape until sufficient absorption has taken place to render them largely harmless to the interior environment of an electron beam column equipped with the element.
摘要:
A Rutherford backscattering detector for determining the angle of incidence between an ion beam and the crystalline lattice structure of a semiconductor workpiece. A process chamber defines a chamber interior into which one or more workpieces can be inserted for ion treatment, and a rotating workpiece support is disposed within the process chamber for mounting one or more semiconductor workpieces. An energy source sets up an ion plasma from which is created an ion beam which is caused to impact the surface of the semiconductor workpiece. A Rutherford backscattering detector measures the intensity of backscattered particles and the backscattered ion intensity is correlated to an angle of incidence between the ion beam and the crystalline structure of the semiconductor workpiece.