公开(公告)号：US07011868B2

公开(公告)日：2006-03-14

申请号：US10627894

申请日：2003-07-24

申请人： Carlo Waldfried ,  Qingyuan Han ,  Orlando Escorcia ,  Ralph Albano ,  Ivan L. Berry, III ,  Atsushi Shiota

发明人： Carlo Waldfried ,  Qingyuan Han ,  Orlando Escorcia ,  Ralph Albano ,  Ivan L. Berry, III ,  Atsushi Shiota

IPC分类号： C08J7/18 ,  H01L21/26 ,  H01L21/3105 ,  H01L21/314 ,  H05L1/24

CPC分类号： H01L21/3105 ,  C01B33/126 ,  C23C16/56 ,  H01B3/46 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/0234 ,  H01L21/31116 ,  H01L21/31138 ,  H01L21/3124 ,  H01L21/31695 ,  Y10T428/31663

摘要： Low dielectric constant porous materials with improved elastic modulus and material hardness. The process of making such porous materials involves providing a porous dielectric material and plasma curing the porous dielectric material with a fluorine-free plasma gas to produce a fluorine-free plasma cured porous dielectric material. Fluorine-free plasma curing of the porous dielectric material yields a material with improved modulus and material hardness, and with comparable dielectric constant. The improvement in elastic modulus is typically greater than or about 50%, and more typically greater than or about 100%. The improvement in material hardness is typically greater than or about 50%. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims 37 CFR §1.72(b).

摘要翻译： 低介电常数多孔材料具有改善的弹性模量和材料硬度。 制造这种多孔材料的过程包括提供多孔电介质材料，并用无氟等离子体气体等离子体固化多孔介电材料，以产生无氟等离子体固化的多孔电介质材料。 多孔电介质材料的无氟等离子体固化产生具有改善的模量和材料硬度以及相当的介电常数的材料。 弹性模量的改善通常大于或约50％，更典型地大于或约100％。 材料硬度的改善通常大于或约50％。 要强调的是，该摘要被提供以符合要求摘要的规则，这将允许搜索者或其他读者快速确定技术公开的主题。 提交它的理解是，它不会用于解释或限制权利要求37 CFR§1.72（b）的范围或含义。