ZERO NOISE MAGNETIC FIELD SYSTEM
    1.
    发明公开

    公开(公告)号:US20240266098A1

    公开(公告)日:2024-08-08

    申请号:US18431428

    申请日:2024-02-02

    摘要: The present invention is a system that produces zero noise magnetic field, which consists of: a coil made of superconducting wire, a precision current source, a Normally Closed Reed (NC) Relay, a Normally Opened (NO) Reed Relay, a cooling mechanism to maintain the superconductor temperature below the critical temperature. The precision current source generates the necessary initial current to act as source for the superconducting coil. The NO reed relay connects the precision current source to the superconductive coil. When this current start to flow, the NC Relay is used to close a superconductive path of the superconductive coil on to itself. Once the system becomes stabilized, the NO reed relay is made open, cutting off the precision source while the Normally Closed relay is closed, thereby a steady value current keeps flowing inside the superconducting coil with zero resistance and zero magnetic noise.

    QUANTUM DEVICE
    3.
    发明公开
    QUANTUM DEVICE 审中-公开

    公开(公告)号:US20240206350A1

    公开(公告)日:2024-06-20

    申请号:US18544605

    申请日:2023-12-19

    申请人: NEC Corporation

    摘要: A quantum device includes on a wiring pattern of first lines and second lines coupled capacitively and inductively to qubits, respectively, and third lines and fourth lines coupled capacitively and inductively to couplers, respectively. The wiring pattern includes a first pattern of adjacent three lines in which one of the second line and the fourth line is disposed between two lines selected from the first lines and the third lines, and/or a second pattern of adjacent three lines in which two lines selected from the second lines and the fourth lines are disposed on both sides of one of the first line and the third line.

    GRAPHITIC ROOM-TEMPERATURE SUPERCONDUCTOR
    5.
    发明公开

    公开(公告)号:US20230284539A1

    公开(公告)日:2023-09-07

    申请号:US18179085

    申请日:2023-03-06

    申请人: Terra Quantum AG

    IPC分类号: H10N60/82 H10N60/85 H10N60/01

    摘要: A superconductor device comprises a graphite structure, a first electrode, a second electrode, and a wrinkle region. The graphite structure comprises at least one topmost atomic layer. The first electrode is arranged over the at least one topmost atomic layer. The second electrode is arranged over the at least one topmost atomic layer and spaced apart from the first electrode. The wrinkle region is comprised in the at least one topmost atomic layer. The wrinkle region is arranged between the first electrode and the second electrode and comprises a plurality of wrinkles with a pair of wrinkles. The first electrode and the second electrode both electrically contact both wrinkles of the pair. A distance between the wrinkles of the pair is at most 0.2 μm.

    SOLDER-SHIELDED CHIP BONDING
    8.
    发明公开

    公开(公告)号:US20240215460A1

    公开(公告)日:2024-06-27

    申请号:US18069996

    申请日:2022-12-21

    摘要: A structure includes a first device having a first chip and a second chip. The second chip has a first side with a plurality of bumps and a second side with a plurality of first superconducting lines. A solder bonded layer attaches the first chip to the second chip. A second device has a first side with a plurality of pads facing the plurality of bumps in the second chip and a second side opposite the first side having a plurality of second superconducting lines. A solder shield material surrounds the plurality of bumps and the plurality of pads, and the plurality of bumps on the second chip are bonded to the plurality of pads on the second device. The solder shield material is connected to the plurality of first superconducting lines of the first device and to the plurality of second superconducting lines of the second device.

    SUPERCONDUCTING DEVICE, METHOD OF MANUFACTURING SUPERCONDUCTING DEVICE, AND LAMINATED BODY

    公开(公告)号:US20240237557A1

    公开(公告)日:2024-07-11

    申请号:US18351575

    申请日:2023-07-13

    申请人: Fujitsu Limited

    发明人: Makoto NAKAMURA

    摘要: A superconducting device includes: a substrate; a through hole provided in the substrate; a through electrode provided in the through hole, the through hole including a first portion and a second portion provided between the first portion and an inner wall surface of the through hole, in which the second portion is formed of a material including a first metal exhibiting superconductivity at a temperature lower than a criteria; a junction electrode electrically coupled to the through electrode, the junction electrode having at least a part provided outside the through hole and being formed of a material including a second metal exhibiting superconductivity at a temperature lower than a criteria; and a partition wall provided between the through electrode and the junction electrode and being formed of a material including the first metal, wherein a melting point of the first metal is higher than that of the second metal.