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公开(公告)号:US20240266098A1
公开(公告)日:2024-08-08
申请号:US18431428
申请日:2024-02-02
发明人: Lal K. C , Gursaran Singh Bhumbra
摘要: The present invention is a system that produces zero noise magnetic field, which consists of: a coil made of superconducting wire, a precision current source, a Normally Closed Reed (NC) Relay, a Normally Opened (NO) Reed Relay, a cooling mechanism to maintain the superconductor temperature below the critical temperature. The precision current source generates the necessary initial current to act as source for the superconducting coil. The NO reed relay connects the precision current source to the superconductive coil. When this current start to flow, the NC Relay is used to close a superconductive path of the superconductive coil on to itself. Once the system becomes stabilized, the NO reed relay is made open, cutting off the precision source while the Normally Closed relay is closed, thereby a steady value current keeps flowing inside the superconducting coil with zero resistance and zero magnetic noise.
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公开(公告)号:US20230217841A1
公开(公告)日:2023-07-06
申请号:US17986774
申请日:2022-11-14
申请人: PsiQuantum Corp.
发明人: Faraz Najafi , Syrus Ziai
IPC分类号: H10N60/83 , H01L29/861 , B32B17/10 , B32B37/26 , H01L21/683 , H01L23/24 , H01L27/12 , H10N60/01 , H10N60/20 , H10N60/30 , H10N60/82
CPC分类号: H10N60/83 , H01L29/861 , B32B17/1055 , B32B37/26 , H01L21/6835 , H01L23/24 , H01L27/1266 , H10N60/01 , H10N60/20 , H10N60/30 , H10N60/82 , H01L2221/6835 , H01L2221/68395
摘要: An electronic device (e.g., a diode) is provided that includes a substrate and a patterned layer of superconducting material disposed over the substrate. The patterned layer forms a first electrode, a second electrode, and a loop coupling the first electrode with the second electrode by a first channel and a second channel. The first channel and the second channel have different minimum widths. For a range of current magnitudes, when a magnetic field is applied to the patterned layer of superconducting material, the conductance from the first electrode to the second electrode is greater than the conductance from the second electrode to the first electrode.
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公开(公告)号:US20240206350A1
公开(公告)日:2024-06-20
申请号:US18544605
申请日:2023-12-19
申请人: NEC Corporation
发明人: Tomohiro Yamaji , Yohei Kawakami
CPC分类号: H10N60/805 , H10N60/12 , H10N60/82 , H10N69/00
摘要: A quantum device includes on a wiring pattern of first lines and second lines coupled capacitively and inductively to qubits, respectively, and third lines and fourth lines coupled capacitively and inductively to couplers, respectively. The wiring pattern includes a first pattern of adjacent three lines in which one of the second line and the fourth line is disposed between two lines selected from the first lines and the third lines, and/or a second pattern of adjacent three lines in which two lines selected from the second lines and the fourth lines are disposed on both sides of one of the first line and the third line.
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公开(公告)号:US11915100B2
公开(公告)日:2024-02-27
申请号:US17115971
申请日:2020-12-09
申请人: NEC CORPORATION
发明人: Tomohiro Yamaji , Tsuyoshi Yamamoto
CPC分类号: G06N10/00 , G06N10/40 , H03B15/003 , H10N60/805 , H10N60/82
摘要: A resonator, an oscillator, and a quantum computer capable of preventing oscillation conditions for generating a parametric oscillation from becoming complicated are provided. A resonator includes at least one loop circuit in which a first superconducting line, a first Josephson junction, a second superconducting line, and a second Josephson junction are connected in a ring shape, in which critical current values of the first and second Josephson junctions are different from each other.
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公开(公告)号:US20230284539A1
公开(公告)日:2023-09-07
申请号:US18179085
申请日:2023-03-06
申请人: Terra Quantum AG
发明人: Valerii Vinokour , Yakov Kopelevich
CPC分类号: H10N60/82 , H10N60/85 , H10N60/01 , H04L63/0428
摘要: A superconductor device comprises a graphite structure, a first electrode, a second electrode, and a wrinkle region. The graphite structure comprises at least one topmost atomic layer. The first electrode is arranged over the at least one topmost atomic layer. The second electrode is arranged over the at least one topmost atomic layer and spaced apart from the first electrode. The wrinkle region is comprised in the at least one topmost atomic layer. The wrinkle region is arranged between the first electrode and the second electrode and comprises a plurality of wrinkles with a pair of wrinkles. The first electrode and the second electrode both electrically contact both wrinkles of the pair. A distance between the wrinkles of the pair is at most 0.2 μm.
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公开(公告)号:US20240337896A1
公开(公告)日:2024-10-10
申请号:US17384159
申请日:2021-07-23
发明人: Abram L. Falk , Chi Xiong , SWETHA KAMLAPURKAR , Jason S. Orcutt
CPC分类号: G02F1/3507 , G02F1/3503 , G02F1/3534 , G02F1/355 , H10N60/82 , H10N60/85 , G06N10/40 , H01P7/082
摘要: Techniques regarding quantum transducers are provided. For example, one or more embodiments described herein can include an apparatus that can comprise a superconducting microwave resonator having a microstrip architecture that can include a dielectric substrate positioned between a superconducting waveguide and a superconducting ground plane. The superconducting waveguide can have a first material composition. Also, the superconducting ground plane can have a second material composition that is distinct from the first material composition. Further, an optical resonator can be arranged with the dielectric substrate.
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公开(公告)号:US12035642B2
公开(公告)日:2024-07-09
申请号:US17078158
申请日:2020-10-23
IPC分类号: G11C11/44 , B82Y10/00 , G01R33/34 , G06N10/00 , G11C17/16 , G11C17/18 , H01L23/544 , H03H11/02 , H04L9/40 , H10N60/01 , H10N60/12 , H10N60/80 , H10N60/81 , H10N60/82 , H10N69/00
CPC分类号: H10N60/805 , G01R33/34023 , G11C11/44 , G11C17/16 , G11C17/18 , H01L23/544 , H03H11/02 , H04L63/0876 , H10N60/0912 , H10N60/12 , H10N60/815 , H10N60/82 , H10N69/00 , B82Y10/00 , G06N10/00 , H01L2223/54446
摘要: A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson junctions have a shorted tunnel barrier.
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公开(公告)号:US20240215460A1
公开(公告)日:2024-06-27
申请号:US18069996
申请日:2022-12-21
发明人: Baleegh Abdo , Jae-Woong Nah
摘要: A structure includes a first device having a first chip and a second chip. The second chip has a first side with a plurality of bumps and a second side with a plurality of first superconducting lines. A solder bonded layer attaches the first chip to the second chip. A second device has a first side with a plurality of pads facing the plurality of bumps in the second chip and a second side opposite the first side having a plurality of second superconducting lines. A solder shield material surrounds the plurality of bumps and the plurality of pads, and the plurality of bumps on the second chip are bonded to the plurality of pads on the second device. The solder shield material is connected to the plurality of first superconducting lines of the first device and to the plurality of second superconducting lines of the second device.
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公开(公告)号:US11699091B2
公开(公告)日:2023-07-11
申请号:US17140741
申请日:2021-01-04
发明人: Wayne Woods , Danna Rosenberg , Cyrus Hirjibehedin , Donna-Ruth Yost , Justin Mallek , Andrew Kerman , Mollie Schwartz , Jonilyn Yoder , William Oliver , Thomas Hazard
CPC分类号: G06N10/00 , H10N60/815 , H10N60/82 , B82Y10/00 , B82Y40/00
摘要: Qubit circuits having components formed deep in a substrate are described. The qubit circuits can be manufactured using existing integrated-circuit technologies. By forming components such as superconducting current loops, inductive, and/or capacitive components deep in the substrate, the footprint of the qubit circuit integrated within the substrate can be reduced. Additionally, coupling efficiency to and from the qubit can be improved and losses in the qubit circuit may be reduced.
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10.
公开(公告)号:US20240237557A1
公开(公告)日:2024-07-11
申请号:US18351575
申请日:2023-07-13
申请人: Fujitsu Limited
发明人: Makoto NAKAMURA
CPC分类号: H10N60/82 , H10N60/0912 , H10N60/12 , H10N69/00
摘要: A superconducting device includes: a substrate; a through hole provided in the substrate; a through electrode provided in the through hole, the through hole including a first portion and a second portion provided between the first portion and an inner wall surface of the through hole, in which the second portion is formed of a material including a first metal exhibiting superconductivity at a temperature lower than a criteria; a junction electrode electrically coupled to the through electrode, the junction electrode having at least a part provided outside the through hole and being formed of a material including a second metal exhibiting superconductivity at a temperature lower than a criteria; and a partition wall provided between the through electrode and the junction electrode and being formed of a material including the first metal, wherein a melting point of the first metal is higher than that of the second metal.
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