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公开(公告)号:US20240361352A1
公开(公告)日:2024-10-31
申请号:US18644107
申请日:2024-04-24
发明人: Jin Kook JUN , Chan Ho Lee , Seung Hyun NOH
CPC分类号: G01R1/0466 , G01R31/2863
摘要: A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.
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公开(公告)号:US12130402B2
公开(公告)日:2024-10-29
申请号:US17659649
申请日:2022-04-18
发明人: Sangkyu Lee , Hyun Ju Chung , Chang Seob Yang
摘要: A core electrode based on multiple rods, which is a core electrode employed in an underwater electric field sensor electrode, includes: a signal part to which a signal line is connected; a seawater reaction part that electrochemically reacts with seawater; and a waterproof molding part for waterproofing the signal part, in which the seawater reaction part is composed of a plurality of rods made of a silver-silver chloride.
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公开(公告)号:US12105138B2
公开(公告)日:2024-10-01
申请号:US17928867
申请日:2021-05-28
发明人: Young taek Shin , Byeong cheol Lee
CPC分类号: G01R31/2863 , G01R1/0466 , G01R1/06733 , G01R1/07314
摘要: Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.
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公开(公告)号:US12099088B2
公开(公告)日:2024-09-24
申请号:US17683104
申请日:2022-02-28
发明人: Jan Hesselbarth , José Moreira
IPC分类号: G01R31/302 , G01R1/04 , G01R31/28 , G01R31/303 , H01L21/66
CPC分类号: G01R31/3025 , G01R1/045 , G01R31/2822 , G01R31/303 , H01L22/14 , H01L2924/00 , H01L2924/0002
摘要: Devices for testing a DUT having a circuit coupled to an antenna are disclose. The device can include a DUT location for receiving a DUT, and an adapter or probe is used to wirelessly “over-the-air” (OTA) electronically test a DUT with an embedded antenna or antenna array with the measurement probe 140 located in close proximity to the DUT. The probe can be located very close to the DUT (e.g., in the near-field region). Although the probe is located in close proximity to the DUT antenna or antenna array elements it does not significantly disturb or interfere with probe during testing.
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公开(公告)号:US20240295584A1
公开(公告)日:2024-09-05
申请号:US18571734
申请日:2022-06-08
申请人: YOKOWO CO., LTD.
发明人: Daisuke HOSOKAWA
CPC分类号: G01R1/0466 , G01R1/06722 , G01R1/06733 , H01R13/2421 , H01R2201/20
摘要: A socket includes a probe having a first tapered portion and an insulating support provided with a through-hole having a second tapered portion to receive the first tapered portion. A first tapered angle of the first tapered portion is less than a second tapered angle of the second tapered portion.
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公开(公告)号:US20240288472A1
公开(公告)日:2024-08-29
申请号:US18566151
申请日:2021-06-29
发明人: Naoki SAMURA , Yasuhiko NARA
CPC分类号: G01R1/06794 , G01R1/0408 , G06T7/74 , G06T2207/10061 , G06T2207/30148 , G06T2207/30204
摘要: A probe device includes a sample stage 125 that supports a sample, a probe unit 143 to which a probe 141 brought into contact with a predetermined sample surface of the sample is attached, a first camera 111A that images the sample and the probe, and a first camera optical axis adjustment stage 112A that adjusts an optical axis of the first camera, in which the optical axis of the first camera is parallel to the sample surface, and the first camera optical axis adjustment stage allows the optical axis of the first camera to be moved in a direction perpendicular to the sample surface.
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公开(公告)号:US12066482B2
公开(公告)日:2024-08-20
申请号:US17603198
申请日:2020-04-02
申请人: ENPLAS CORPORATION
发明人: Yoshinobu Hagiwara
CPC分类号: G01R31/2863 , G01R1/0466 , G01R31/2896 , H01R33/76 , H01R33/97
摘要: A socket for an electrical component including a socket main body 11 including a contact pin, an operating member 12 provided in the socket main body 11 in a vertically movable manner and urged upward, an opening/closing body 14 provided in the socket main body 11 as being capable of being opened and closed and configured to press an electrical component arranged in the socket main body 11 by being closed, an opening/closing link mechanism 15 connected to the opening/closing body 14 with a base end part 15a thereof connected to the socket main body 11 and the operating member 12 to close the opening/closing body 14 when being lifted by the operating member 14, and a depression mechanism 16 which depresses a leading end part 15b of the opening/closing link mechanism 15 when the opening/closing body 14 is closed.
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公开(公告)号:US12061212B2
公开(公告)日:2024-08-13
申请号:US17609912
申请日:2019-06-05
发明人: Dong Weon Hwang , Logan Jae Hwang , Jae Baek Hwang
CPC分类号: G01R1/0441 , G01R1/06722 , G01R31/2886
摘要: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.
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公开(公告)号:US12055577B2
公开(公告)日:2024-08-06
申请号:US17956859
申请日:2022-09-30
发明人: Man Xu , Sunjiaxing Wei , Yangtao Peng , Yunshun Peng
CPC分类号: G01R31/1272 , G01R1/0408 , G01R31/20
摘要: Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section.
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公开(公告)号:US20240230715A1
公开(公告)日:2024-07-11
申请号:US18402696
申请日:2024-01-02
申请人: Dong Weon HWANG , Jae Baek HWANG , HICON CO., LTD.
CPC分类号: G01R1/045 , G01R1/06722 , G01R31/2889
摘要: Proposed is a socket device used for testing integrated circuits (ICs) and, more particularly, a test socket device with a thin structure especially suitable for ICs required to process high-speed signals. The socket device includes a socket body configured to accommodate a ground probe and a signal probe, each having an upper contact pin, a lower contact pin and a coil spring, and to have noise shielding properties, and an insulating thin film member having electrical insulation properties and attached to the lower part or upper/lower parts of the socket body to elastically support the probes, and thus the socket device has a thin structure suitable for ICs required to process high-speed signals, and is easy to manufacture.
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