TEST SOCKET AND ASSEMBLY DEVICE THEREOF
    1.
    发明公开

    公开(公告)号:US20240361352A1

    公开(公告)日:2024-10-31

    申请号:US18644107

    申请日:2024-04-24

    IPC分类号: G01R1/04 G01R31/28

    CPC分类号: G01R1/0466 G01R31/2863

    摘要: A test socket for testing the electrical characteristics of a semiconductor device provides a test socket, including a housing in which a plurality of first through holes are formed; a cover in which a plurality of second through holes are formed; and a plurality of contact pins inserted into the plurality of first and second through holes, wherein the plurality of contact pins include an elastic part capable of elastic deformation in the longitudinal direction; a first contact part comprising: a first support part extending from one end of the elastic part, a stroke part connected to an end of the first support part and movable in the longitudinal direction, and a first contact tip connected to an end of the stroke part and exposed in the first through hole.

    Test socket
    3.
    发明授权

    公开(公告)号:US12105138B2

    公开(公告)日:2024-10-01

    申请号:US17928867

    申请日:2021-05-28

    摘要: Disclosed is a test socket. The test socket includes a first block comprising a first base member of a conductive material and a first insulating member of an insulating material, a second block comprising a second base member of a conductive material and a second insulating member of an insulating material, a gap member of an insulating material, interposed between the first block and the second block, a first probe supported being in contact with the first base member and being not in contact with the second base member, a second probe supported being not in contact with the first base member and being in contact with the second base member, and electronic parts provided in the gap member and placed on a conductive path by which the first base member and the second base member are electrically connected.

    Probe Device
    6.
    发明公开
    Probe Device 审中-公开

    公开(公告)号:US20240288472A1

    公开(公告)日:2024-08-29

    申请号:US18566151

    申请日:2021-06-29

    IPC分类号: G01R1/067 G01R1/04 G06T7/73

    摘要: A probe device includes a sample stage 125 that supports a sample, a probe unit 143 to which a probe 141 brought into contact with a predetermined sample surface of the sample is attached, a first camera 111A that images the sample and the probe, and a first camera optical axis adjustment stage 112A that adjusts an optical axis of the first camera, in which the optical axis of the first camera is parallel to the sample surface, and the first camera optical axis adjustment stage allows the optical axis of the first camera to be moved in a direction perpendicular to the sample surface.

    Socket for electrical component
    7.
    发明授权

    公开(公告)号:US12066482B2

    公开(公告)日:2024-08-20

    申请号:US17603198

    申请日:2020-04-02

    摘要: A socket for an electrical component including a socket main body 11 including a contact pin, an operating member 12 provided in the socket main body 11 in a vertically movable manner and urged upward, an opening/closing body 14 provided in the socket main body 11 as being capable of being opened and closed and configured to press an electrical component arranged in the socket main body 11 by being closed, an opening/closing link mechanism 15 connected to the opening/closing body 14 with a base end part 15a thereof connected to the socket main body 11 and the operating member 12 to close the opening/closing body 14 when being lifted by the operating member 14, and a depression mechanism 16 which depresses a leading end part 15b of the opening/closing link mechanism 15 when the opening/closing body 14 is closed.

    Spring contact and socket having spring contact embedded therein

    公开(公告)号:US12061212B2

    公开(公告)日:2024-08-13

    申请号:US17609912

    申请日:2019-06-05

    IPC分类号: G01R1/04 G01R1/067 G01R31/28

    摘要: The present disclosure relates to a socket having a thin structure and to a spring contact suitable thereto. The socket includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110), a lower contact pin (120) assembled to the upper contact pin such that the upper and lower contact pins cross each other to mutually linearly operate, and a coil spring (130) supporting the upper and lower contact pins (110 and 120); a lower film plate (310) including a plurality of first through-holes (311) through which the respective spring contacts (100) are positioned; an intermediate plate (320) provided on the lower film plate (310) and including second through-holes formed at positions corresponding to the first through-holes (311); and an upper film plate (330) provided on the intermediate plate (320) and including third through-holes formed at positions corresponding to the second through-holes.

    Electrical tree test device for silicone rubber material for cable accessory and method for preparing sample

    公开(公告)号:US12055577B2

    公开(公告)日:2024-08-06

    申请号:US17956859

    申请日:2022-09-30

    IPC分类号: G01R31/12 G01R1/04 G01R31/20

    摘要: Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section.

    SOCKET DEVICE FOR TESTING ICs
    10.
    发明公开

    公开(公告)号:US20240230715A1

    公开(公告)日:2024-07-11

    申请号:US18402696

    申请日:2024-01-02

    IPC分类号: G01R1/04 G01R1/067 G01R31/28

    摘要: Proposed is a socket device used for testing integrated circuits (ICs) and, more particularly, a test socket device with a thin structure especially suitable for ICs required to process high-speed signals. The socket device includes a socket body configured to accommodate a ground probe and a signal probe, each having an upper contact pin, a lower contact pin and a coil spring, and to have noise shielding properties, and an insulating thin film member having electrical insulation properties and attached to the lower part or upper/lower parts of the socket body to elastically support the probes, and thus the socket device has a thin structure suitable for ICs required to process high-speed signals, and is easy to manufacture.