ELECTRODE SUBSTRATE
    2.
    发明公开
    ELECTRODE SUBSTRATE 审中-公开

    公开(公告)号:US20240328985A1

    公开(公告)日:2024-10-03

    申请号:US18678044

    申请日:2024-05-30

    摘要: An electrode substrate includes an insulation substrate and a reference electrode on the insulation substrate. The reference electrode includes a silver layer, a first silver chloride layer, and a second silver chloride layer. The silver layer is on the insulation substrate. The first silver chloride layer is on the silver layer on the insulation substrate, and covers the silver layer. The second silver chloride layer is on the first silver chloride layer on the insulation substrate, and covers the first silver chloride layer. An area void fraction of the first silver chloride layer is larger than an area void fraction of the second silver chloride layer in any longitudinal section.

    Methods and Devices for High Resistance and Low Resistance Conductor Layers Mitigating Skin Depth Loss

    公开(公告)号:US20220319741A1

    公开(公告)日:2022-10-06

    申请号:US17709047

    申请日:2022-03-30

    发明人: Shinichi Iketani

    IPC分类号: H01B13/00 H01B5/16

    摘要: Methods and devices are contemplated incorporating both high resistance conductive materials (HRCM) and conductors. A HRCM is deposited on a conductor, such that the surface between the HRCM and the conductor is relatively smooth. A dielectric material is then deposited onto an exposed surface of the HRCM. The surface of the HRCM meeting the dielectric material is roughed or otherwise impressed such that it has a Ra of at least 5 μm. The ratio of resistivity between the HRCM and the conductor is at least 50:1 or 100:1, and the ratio of conductivity between the conductive material and the resistive material is at least 9:1, 19:1, or 99:1.

    Connection structure
    7.
    发明授权

    公开(公告)号:US11013126B2

    公开(公告)日:2021-05-18

    申请号:US16465184

    申请日:2017-11-22

    发明人: Yuta Araki

    摘要: A connection structure: a first electronic component having a terminal pattern in which a plurality of terminals are arranged side by side in a radial form and a second electronic component having a terminal pattern corresponding to the terminal pattern of the first electronic component are anisotropically conductively connected using an anisotropic conductive film, (i) the effective connection area per terminal is 3000 μm2 or more, and the number density of conductive particles in the anisotropic conductive film is 2000 particles/mm2 or more and 20000 particles/mm2 or less, (ii) as the anisotropic conductive film, adopted is an anisotropic conductive film in which the conductive particles are arranged in a lattice form, and the arrangement pitch and the arrangement direction are configured such that each terminal captures three or more conductive particles, or (iii) as the anisotropic conductive film, adopted is an anisotropic conductive film having a multiple circular region.

    STRETCHABLE WIRING FILM AND METHOD FOR FORMING THE SAME

    公开(公告)号:US20200207952A1

    公开(公告)日:2020-07-02

    申请号:US16707208

    申请日:2019-12-09

    发明人: Jun HATAKEYAMA

    摘要: A stretchable wiring film includes: (A) a stretchable film made of, at least as a top surface of the stretchable film, a cured product of a stretchable film material containing a silicone polyurethane resin; and (B) a stretchable wiring. The top surface of the stretchable film has a repeated uneven pattern formed with depths of 0.1 μm to 5 mm and pitches of 0.1 μm to 10 mm. The stretchable wiring is formed on the top surface of the stretchable film where the repeated uneven pattern is formed. Thus, the present invention provides: a stretchable wiring film having less decrease in electric conductivity in stretching and excellent water repellency on the film top surface; and a method for forming the stretchable wiring film.

    Anisotropic conductive film and connection structure

    公开(公告)号:US10269467B2

    公开(公告)日:2019-04-23

    申请号:US15741135

    申请日:2016-07-11

    摘要: An anisotropic conductive film is thermo-polymerizable and includes an electrically insulating base layer, an adhesive layer, an intermediate layer sandwiched therebetween, and electrically conductive particles retained by any of the layers. The intermediate layer and the adhesive layer each have a melt viscosity higher than the melt viscosity of the electrically insulating base layer. The electrically conductive particles are independent of one another when the anisotropic conductive film is viewed in plan. The modulus of elasticity of the anisotropic conductive film as a whole, at 100° C., after thermal polymerization, is higher than 1800 MPa.