APPARATUS AND PROCESS FOR ATOMIC LAYER DEPOSITION
    95.
    发明申请
    APPARATUS AND PROCESS FOR ATOMIC LAYER DEPOSITION 审中-公开
    原子层沉积的装置和工艺

    公开(公告)号:WO2012118952A2

    公开(公告)日:2012-09-07

    申请号:PCT/US2012/027247

    申请日:2012-03-01

    Inventor: YUDOVSKY, Joseph

    CPC classification number: C23C16/45551 C23C16/54

    Abstract: Provided are atomic layer deposition apparatus and methods including multiple gas distribution plates including stages for moving substrates between the gas distribution plates.

    Abstract translation: 提供了包括多个气体分配板的原子层沉积设备和方法,其包括在气体分布板之间移动基板的阶段。

    MOSFET GATE ENGINEERING WITH DIPOLE FILMS
    100.
    发明申请

    公开(公告)号:WO2022170266A1

    公开(公告)日:2022-08-11

    申请号:PCT/US2022/015674

    申请日:2022-02-08

    Abstract: A metal gate stack on a substrate comprises: an interfacial layer on the substrate; a high-κ metal oxide layer on the interfacial layer, the high-κ metal oxide layer comprising a dipole region adjacent to the interfacial layer, the dipole region comprising niobium (Nb); a high-κ metal oxide capping layer on the high-κ metal oxide layer; a positive metal-oxide-semiconductor (PMOS) work function material above the high-κ metal oxide capping layer; and a gate electrode above the PMOS work function material. The dipole region is formed by driving Nb species of a Nb-based film into the high-κ metal oxide layer to form a dipole region.

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