Abstract:
A device (60) for determining the constituents of a substance in a gas or gas mixture performs measurements on the gas or gas mixture used for washing a lens (10) in a projection apparatus (41) for projecting structures onto a substrate (100). The results of a first measurement performed on the gas fed to the lens (10) and the results of a measurement performed on the gas led away from the lens are compared to one another. If a substance is involved that, in particular, is one that contaminates, whereby leading to the formation of deposits on the lens (10) under the influence of high-energy radiation emitted by a light source (14), photochemical reactions, which adversely lead to the formation of deposits on the surface of the lens (10) can be inferred from the difference ensuing from said comparison. A signal is generated as a result of the comparison and can be used to take preventive measures against a degradation of the lens (10). Measuring devices (60), which can be mass spectrometers, electric or optical sensors, and other known methods can be used for performing substance analysis.
Abstract:
Eine Projektionsbelichtungsanlage (1) ist mit einer Beleuchtungseinrichtung (3) mit einer Lichtquelle, insbesondere einem UV-Licht emitierenden Laser, mit einem Projektionsobjektiv (7), mit einer Reticle-Ebene, in der ein Reticle (5) angeordnet ist, mit einer Wafer-Ebene, in der ein Wafer (2) angeordnet ist, und mit einem Spülgassystem zum Spülen des Innenraumes des Projektionsobjektives (7) und/oder der äusseren Bereiche, insbesondere der Reticle-Ebene und der Wafer-Ebene, versehen. Wenigstens eine Einrichtung (25,32,33) zur Überwachung wenigstens eines Spülgasstromes, die bei Unterschreiten einer vorgegebenen Spülgasdurchflussmenge die Strahlung der Lichtquelle zu dem Projektionsobjektiv (7) unterbricht, ist vorgesehen. Die Einrichtung (25,32,33) zur Überwachung des Spülgasstromes ist über eine Steuereinrichtung mit der Lichtquelle verbunden. Die Steuereinrichtung (27) ist mit einer Zeitschalteinrichtung (36) versehen.
Abstract:
Methods and system for compensating for effects of changes and variations of gas refractivity in a measurment and/or reference beam path of an interferometer are disclosed.
Abstract:
A method for purging a light−absorbing material from an optical path of exposure light with high efficiency and economically. When an exposure apparatus body (12) and a light source (11) are started up, a purge gas is fed to the exposure apparatus at a high flow rate. The illuminance of the exposure light is measured at an illumination optical system (20) relatively near the light source (11), and at a place near a substrate (W) relatively far from the light source (11). When the ratio between the measured illuminances is in a predetermined range, the purge gas feed mode is changed to a low flow rate mode.
Abstract:
An aligner in which light absorbing substances can be removed appropriately from the space between a projection optical system and a substrate without having any effect on the peripheral apparatus. The aligner has a gas supply port for supplying an energy-beam-permeable gas to the space between the projection optical system and the substrate, and an exhaust port provided on the outside of the gas supply port while being directed toward the space and discharging a gas containing the permeable gas from the space at a rate higher than the supply rate of the permeable gas.
Abstract:
The present invention provides a method and system for controlling the refractive index of gaseous mixture of the projection optics of a lithographic tool. In one embodiment, the present invetion corrects projection optic aberrations due to altitude specific barometric pressure variations. Furthermore, the present invetion provides control over the aberrations of an optical system, the ability to compensate for altitude changes, teh ability to compensate for pressure changes, and the ability to purge gases fro teh optical system. In an embodiment, the system of the present inveiton includes at least one gas supply to provide a gas for a mixture, at least one mass flow controller associated with each gas supple, where the mass flow controller measures and controls the quantity of a respective gas for the mixture, and at least one flow gauge, or filter arrangement, to substantially maintain laminar flow within the lithography apparatus. According to another embodiment of the present invention, the system further includes at least one filter to purify each gas for each gas supply, and at least one temperature control unit to maintain the temperature of the mixture at predetermined thermal specifications.
Abstract:
An optical device for illumination includes a first space (SP1) surrounding an optical path of an energy beam for irradiating an object, a second space (SP2) surrounding the first space (SP1), and a third space (SP3) surrounding the second space (SP2). The first to third spaces (SP1, SP2, SP3) are controlled to have different target doping concentrations. A source of contamination such as an actuator can thus be isolated to maintain the space surrounding the optical path chemically clean.
Abstract:
An exposing method in which the gas present at least along a part of the optical path of an exposing beam can be stably replaced with a gas through which the exposing beam is transmitted at low operating cost. The gas in a gas-tight unit (8) enclosing a beam matching unit, an illuminating optical system, a reticle stage system, a projection optical system, or a wafer stage system of an exposing apparatus is replaced with a low-absorption gas (GA, GB) through which the exposing beam is transmitted by a gas replacing unit (S). After a predetermined repetition of a step of reducing the pressure of the gas in the gas-tight unit (8) to a first pressure lower than the atmospheric pressure by using a gas evacuating device (7) and a step of supplying the low-absorption gas (GA, GB) in to the gas-tight unit (8) to a pressure between the first pressure and the atmospheric pressure, the low-absorption gas (GA, GB) is supplied into the gas-tight unit (8) to nearly the atmospheric pressure.
Abstract:
Air conditioners (52, 56, 58) arranged in a machine room (14) communicate through channels (26, 24) with an exposure room (16) to be air-conditioned. Exhaust from the exposure room returns to the machine room through the exhaust channel provided with a chemical filter (CF1), which removes substantially all contaminant attributed to the gassing of the exposure system (22) and included in the exhaust from the exposure room to the machine room. As a result, the exposure room is kept chemically clean. Accurate exposure controls and high throughput are maintained over a long period.