Abstract:
An electro-acoustic transducer (100) comprising: a body (110) defining a mounting surface (114) for mounting the electro-acoustic transducer (100) on a substrate and an opening (120) for allowing sound to enter or exit the body (110); a diaphragm (132) mounted in the body (110); and a compression chamber (118) located between the diaphragm (132) and the opening (120); wherein the opening (120) is located on the mounting surface (114).
Abstract:
An electro-acoustic transducer (100) comprising: a body (110) defining a mounting surface (114) for mounting the electro-acoustic transducer (100) on a substrate and an opening (120) for allowing sound to enter or exit the body (110); a diaphragm (132) mounted in the body (110); and a compression chamber (118) located between the diaphragm (132) and the opening (120); wherein the opening (120) is located on the mounting surface (114).
Abstract:
Es wird eine Anordnung zur Stressentkopplung bei einem Substrat (5), insbesondere bei einer Leiterplatte, vorgeschlagen, wobei mindestens ein Chip (10) vorgesehen ist. Der Chip (10) ist auf einem Chip-Bereich (15) des Substrates (5) angeordnet. Weiter ist mindestens eine Aussparung (20) um den Chip-Bereich (15) im Substrat (5) vorgesehen. Die Aussparung (20) verläuft dabei vertikal durch die gesamte Dicke des Substrates (5).
Abstract:
The invention relates to an actuating and/or sensing element, to a method for producing the same and to the use of said element. The aim of the invention is to provide an actuating and/or sensing element that can be inserted in integrated form into components, in particular inside said components, under increased loads. An actuating and/or sensing element according to the invention is designed in such a way that at least one sintered piezoelectric or electrostrictive component, which is contacted in an electrically conductive manner, is surrounded by a low temperature co-fired ceramic (LTCC).
Abstract:
The present invention provides a MEMS package, the MEMS package comprising a substrate which comprises a recess, and a MEMS device, situated in the recess.
Abstract:
A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.
Abstract:
A microphone module. The module comprises a carrier having a first side and an opposing second side and comprising a through hole. A microphone is disposed on the first side of the carrier and corresponding to the through hole. A processing chip is disposed on the first side of the carrier and coupled to the microphone. An encapsulant is disposed on the first side of the carrier to encapsulate the microphone and the processing chip.
Abstract:
The present invention relates to an electro-mechanical wave device used for movement of a mechanical member by friction, a motor comprising one or more wave devices and a method for the design and manufacture of the electro-mechanical wave device . According to the invention, an electro-mechanical wave device is provided (1) , comprising a substrate (2) for propagation of a mechanical wave and for transmission of electrical signals through conductors (4, 6, 8) accommodated by the substrate, a plurality of actuators (10a, 10b, 10c, 1Od) positioned on the substrate for generation of the mechanical wave, each of the actuators being connected to a respective set of conductors of the substrate for reception of an excitation signal transmitted by the set of conductors, whereby the actuators generate the mechanical wave propagating in the substrate along a predetermined propagation path in response to the excitation signals.
Abstract:
The invention relates to a flat substrate with an electrically conductive structure, which is integrated inside the flat substrate or applied to a surface of the flat substrate, and/or with a technically improved surface. The invention is characterized in that: at least one sensor is integrated inside the flat substrate or applied to a surface of the flat substrate, which generates sensor signals according to deformations occurring inside the flat substrate; at least one actuator is integrated inside the flat substrate or is applied to the surface of the flat substrate, which enables the flat substrate to mechanically deform when activated, and; a signal unit connected to the at least one sensor and to the at least one actuator is provided, which, on the basis of the sensor signals, generates actuator signals for activating the actuator so that deformations occurring inside the flat substrate are reduced.
Abstract:
A condenser microphone mountable on a main PCB is disclosed. The condenser microphone of the present invention comprises a cylinder-shaped case having one side which is opened and the other side which is closed; a first metal ring inserted into the case for an electrical connection; a disk-shaped back plate having a sound hole to be connected electrically to the case through the first metal ring; a ring-shaped spacer; a cylinder-shaped insulating ring having an open top part and an open bottom part to provide an electrical insulation and a mechanical support; a diaphragm inserted into the insulating ring and facing to the back plate while interposing the spacer between the diaphragm and the back plate; a second metal ring for being connected electrically to the diaphragm and supporting mechanically the diaphragm; and a PCB that is mounted with electronic components and is formed with a sound hole, the PCB being connected to the back plate through the second metal ring and the case, the PCB including connection terminals connected to the outside. Accordingly, the condenser microphone maintains the sound quality in a good state since the sound wave transfer path is short even if the component mount region of the main PCB on which the condenser microphone is mounted is directed toward an inner side of the electronic product at need.