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    METHOD OF PRODUCING AN ABRASIVE PRODUCT CONTAINING CUBIC BORON NITRIDE
    91.
    发明申请
    METHOD OF PRODUCING AN ABRASIVE PRODUCT CONTAINING CUBIC BORON NITRIDE 审中-公开
    生产含立方氮化硼磨料产品的方法

    公开(公告)号：WO02012578A2

    公开(公告)日：2002-02-14

    申请号：PCT/IB2001/001385

    申请日：2001-08-03

    IPC: B22F3/10 ,  C22C1/05 ,  C22C26/00 ,  C22C29/02 ,  C22C29/00

    CPC classification number: C22C29/02 ,  B22F2005/001 ,  C22C26/00

    Abstract: A method of producing an abrasive product consists of providing a mixture of a mass of discrete carbide particles and a mass of cubic boron nitride particles, the cubic boron nitride particles being present in the mixture in an amount such that the cubic boron nitride content of the abrasive product is 25% or less by weight, and subjecting the mixture to elevated temperature and pressure conditions at which the cubic boron nitride is crystallographically stable and at which substantially no hexagonal boron nitride is formed, in the presence of a bonding metal or alloy capable of bonding the mixture into a coherent, sintered product, to form the abrasive product. The bonding metal or alloy comprises a combination of a transition metal or a transition alloy and up to 40% by volume of the bonding metal or alloy of a second metal which is a stronger nitride or boride former than the transition metal or the transition metal alloy.

    Abstract translation: 本发明涉及一种生产磨料产品的方法，该磨料产品包括生成大量离散碳化物颗粒和大量立方氮化硼颗粒的混合物，立方氮化硼颗粒存在于 以这样的量进行混合，使得磨料产品的立方氮化硼含量至多为25重量％，并且使所述混合物经受高压和高温条件，在此条件下立方氮化硼稳定在 在能够将混合物粘合到烧结的粘附产品上以形成磨料产品的金属或粘合合金的存在下形成晶面并且不形成六方氮化硼。 该金属或粘结合金包含过渡金属或过渡合金的组合以及至多40体积％的具有尺寸规的第二金属的所述金属或合金化合金。 硼化物或氮化物比过渡金属或过渡金属合金强。

    ELECTRODE FOR DISCHARGE SURFACE TREATING AND PRODUCTION METHOD THEREOF AND DISCHARGE SURFACE TREATING METHOD
    93.
    发明申请
    ELECTRODE FOR DISCHARGE SURFACE TREATING AND PRODUCTION METHOD THEREOF AND DISCHARGE SURFACE TREATING METHOD 审中-公开
    放电表面处理电极及其生产方法及放电表面处理方法

    公开(公告)号：WO01024961A1

    公开(公告)日：2001-04-12

    申请号：PCT/JP1999/006630

    申请日：1999-11-29

    IPC: C22C29/00 ,  C23C26/00 ,  C23C26/02 ,  B23H1/06 ,  B23H7/24 ,  B23H9/00

    CPC classification number: C22C26/00 ,  B22F2003/248 ,  B22F2998/00 ,  B22F2998/10 ,  C22C29/00 ,  C23C26/00 ,  C23C26/02 ,  B22F1/025 ,  B22F3/02 ,  B22F3/1021 ,  B22F2201/20 ,  B22F2202/07 ,  B22F1/0059

    Abstract: An electrode for discharge surface treating (10) is formed by mixing cBN powder (11), which is an electrically insulating hard substance, with Co alloy powder (12), which is a conductive substance, for charging into a press die, and by compression-molding the mixture; a hard coating (20), consisting of cBN and Co alloy, both high in hardness even under a high-temperature environment, is formed on a material to be treated (16) by generating discharge between the electrode (10) and the material (16) by using a discharge surface treating power supply (17).

    Abstract translation: 用于放电表面处理的电极（10）通过将作为电绝缘硬质物质的cBN粉末（11）与作为导电物质的Co合金粉末（12）混合，将其装入压模中， 压缩成型混合物; 通过在电极（10）和材料（10）之间产生放电，在待处理材料（16）上形成硬质涂层（20），其由cBN和Co合金组成，即使在高温环境下也具有高硬度 16）通过使用放电表面处理电源（17）。

    METHOD FOR MAKING Ni-Si MAGNETRON SPUTTERING TARGETS AND TARGETS MADE THEREBY
    95.
    发明申请
    METHOD FOR MAKING Ni-Si MAGNETRON SPUTTERING TARGETS AND TARGETS MADE THEREBY 审中-公开
    制造Ni-Si磁控溅射靶材及其靶材的方法

    公开(公告)号：WO99025892A1

    公开(公告)日：1999-05-27

    申请号：PCT/US1998/024983

    申请日：1998-11-19

    IPC: B21B1/38 ,  B21B3/02 ,  C22C19/03 ,  C22F1/10 ,  C23C14/34 ,  B21B1/46 ,  B22D23/00 ,  C22C29/00 ,  B22F1/05

    CPC classification number: C22C19/03 ,  B21B1/38 ,  B21B3/02 ,  C22F1/10 ,  C23C14/3414

    Abstract: A method for making a nickel/silicon sputter target, targets made thereby and sputtering processes using such targets. The method includes the step of blending molten nickel with sufficient molten silicon so that the blend may be cast to form an alloy containing no less than 4.5 wt.% silicon. Preferably, the cast ingot is then shaped by rolling it to form a plate having a desired thickness. Sputter targets so formed are capable of use in a conventional magnetron sputter process; that is, one can be positioned near a cathode in the presence of an electric potential difference and a magnetic field so as to induce sputtering of nickel ion from the sputter target onto the substrate.

    Abstract translation: 制造镍/硅溅射靶的方法，由此制成的靶和使用这种靶的溅射工艺。 该方法包括将熔融镍与足够的熔融硅共混的步骤，使得共混物可以流延以形成含有不少于4.5重量％的硅的合金。 优选地，通过将​​铸造锭轧制以形成具有期望厚度的板来成形铸锭。 如此形成的溅射靶能够用于传统的磁控溅射工艺; 也就是说，可以在存在电位差和磁场的情况下将其定位在阴极附近，以便将镍离子从溅射靶溅射到衬底上。

    SPUTTER TARGETS AND METHODS OF MAKING SAME
    96.
    发明申请
    SPUTTER TARGETS AND METHODS OF MAKING SAME 审中-公开
    飞秒瞄准器及其制作方法

    公开(公告)号：WO99019102A1

    公开(公告)日：1999-04-22

    申请号：PCT/US1998/021852

    申请日：1998-10-14

    IPC: B22F3/15 ,  B22F9/08 ,  C22C29/18 ,  C23C14/34 ,  B22F3/16 ,  C22C29/00

    CPC classification number: B22F9/082 ,  B22F3/15 ,  C22C29/18 ,  C23C14/3414

    Abstract: Refractory metal/Si sputter targets and methods of preparing such targets are disclosed. The targets are made via atomization techniques wherein an inert gas stream impinges upon the requisite molten metals to form powder particles. The particles are pressure consolidated into the near net shape desired for a given target configuration. Ti/Si targets are preferred and are characterized by having low oxygen content on the order of about 50-1,000 ppm with an oxygen content of about 100-1,000 ppm being more preferred. These targets also have a grain size distribution wherein substantially all of the grains are less than 20 mu m in size. Sputtering of such targets minimizes the amount of harmful particulates formed on the sputter coated substrates.

    Abstract translation: 公开了耐火金属/ Si溅射靶及其制备方法。 目标通过雾化技术制造，其中惰性气流冲击所需的熔融金属以形成粉末颗粒。 颗粒被压力固化成给定目标构型所需的近净形状。 Ti / Si靶是优选的，其特征在于具有约50-1,000ppm量级的低氧含量，更优选氧含量为约100-1,000ppm。 这些靶也具有粒度分布，其中基本上所有的颗粒的尺寸都小于20μm。 这种靶材的溅射使溅射涂覆的基材上形成的有害微粒的量最小化。

    TOUGH-COATED HARD POWDERS AND SINTERED ARTICLES THEREOF
    97.
    发明申请
    TOUGH-COATED HARD POWDERS AND SINTERED ARTICLES THEREOF 审中-公开
    粗糙硬质粉末及其烧结物品

    公开(公告)号：WO98051419A1

    公开(公告)日：1998-11-19

    申请号：PCT/US1998/009767

    申请日：1998-05-13

    IPC: C22C29/04 ,  B22F1/02 ,  C09K3/14 ,  C22C1/05 ,  C22C29/00 ,  C22C29/06 ,  C22C29/14 ,  C22C29/16 ,  C23C28/00 ,  B05D7/00 ,  B22F3/00

    CPC classification number: C09K3/1445 ,  B22F1/025 ,  B22F2005/001 ,  B22F2998/00 ,  C22C29/00 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/2991 ,  Y10T428/2993 ,  B22F2207/07

    Abstract: A sintered material and the tough-coated hard powder (TCHP) to make such a material is comprised of core particles that consist essentially of a first metal compound having the formula MaXb. M is a metal selected from the group consisting of titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, aluminum, boron and silicon while X represents one ormore elements selected from the group consisting of nitrogen, carbon, boron and oxygen. The letters a and b represent numbers greater than zero up to and including four. The core particles are surrounded by an intermediate layer consisting essentially of a second metal compound, different in composition from the first metal compound thereby forming coated particles. The material of the intermediate layer has a higher relative fracture toughness than the material comprising the core particles and is capable of bonding with the metal compound(s) forming the core particles and also being capable of bonding with iron, cobalt or nickel. The coated particles are surrounded by an outer layer of iron, cobalt, nickel, their alloys, their mixtures and their intermetallic compounds. The intimate liaison of multiproperty alloys within the TCHP grains allows the combination of normally conflicting sintered article performance characteristics (e.g., strength and hardness) at levels heretofore unseen in the powder metallurgical art.

    Abstract translation: 制造这种材料的烧结材料和韧性涂覆的硬质粉末（TCHP）由基本上由具有式MaXb的第一金属化合物组成的核心颗粒组成。 M是选自钛，锆，铪，钒，铌，钽，铬，钼，钨，铝，硼和硅的金属，而X表示选自氮，碳，硼中的一种或多种元素 和氧气。 字母a和b表示大于零直到并包括四的数字。 核心颗粒被基本上由第二金属化合物组成的中间层包围，第二金属化合物的组成与第一金属化合物不同，从而形成被覆颗粒。 中间层的材料具有比包含芯颗粒的材料更高的相对断裂韧性，并且能够与形成芯颗粒的金属化合物结合，并且还能够与铁，钴或镍结合。 涂覆的颗粒被铁，钴，镍，它们的合金，它们的混合物和它们的金属间化合物的外层包围。 TCHP颗粒内的多种合金的紧密联系允许在粉末冶金领域中以往未见的水平将通常冲突的烧结制品性能特征（例如强度和硬度）组合。

    TOOL FOR COLDFORMING OPERATIONS
    98.
    发明申请
    TOOL FOR COLDFORMING OPERATIONS 审中-公开
    加工作业用工具

    公开(公告)号：WO1998003689A1

    公开(公告)日：1998-01-29

    申请号：PCT/SE1997001265

    申请日：1997-07-11

    Applicant: SANDVIK AB (publ)

    Inventor： SANDVIK AB (publ) ,  CARPENTER, Michael, John ,  SWEETMAN, Gary, William

    IPC: C22C29/00

    CPC classification number: C23C30/005 ,  B21C3/02 ,  B21C25/025 ,  B21J1/04 ,  B21J5/00 ,  B21K5/00 ,  B21K5/20 ,  C22C29/08 ,  Y10T407/27 ,  Y10T428/252 ,  Y10T428/31678

    Abstract: An improved hard wearing surface zone is being formed in a tungsten carbide-cobalt cemented carbide. This has been achieved by a post-sintering heat treatment in a boron nitride containing environment of a hard metal of a suitable composition. The effect is most pronounced when the heat treatment is made of a hard metal which has previously been sintered to achieve a high carbon content through a suitable choice of chemical composition and processing conditions.

    Abstract translation: 在碳化钨 - 钴硬质合金中形成改善的耐磨表面区域。 这已经通过在适当组成的硬质金属的含氮化硼的环境中的后烧结热处理来实现。 当通过适当选择的化学组成和加工条件，预先烧结以获得高碳含量的硬质金属进行热处理时，效果最明显。

    HIGH THERMAL CONDUCTIVITY, MATCHED CTE, LOW DENSITY COMPOSITE
    100.
    发明申请
    HIGH THERMAL CONDUCTIVITY, MATCHED CTE, LOW DENSITY COMPOSITE 审中-公开
    高热导率，匹配CTE，低密度复合材料

    公开(公告)号：WO1995004165A1

    公开(公告)日：1995-02-09

    申请号：PCT/US1994008151

    申请日：1994-07-20

    Applicant: E-SYSTEMS, INC. ,  MONTESANO, Mark, J. ,  WIGAND, John, T. ,  ROESCH, Joseph, Cesare

    Inventor： E-SYSTEMS, INC.

    IPC: C22C29/00

    CPC classification number: H01L23/3733 ,  C22C26/00 ,  H01L23/3732 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/12146 ,  H01L2924/00

    Abstract: The method and composite of the present invention has a significant advantage over known composites in the size of the diamond particles contained therein. Without a change in the diamond/metal ratio, the larger size diamond particles (about 110 microns and about 160 microns in size) provide a composite (20) of increased thermal conductivity without sacrificing CTE. Thus the CTE of the composite (20) may be matched with the CTE of the electrical components (18) with which it is associated and still retain the advantages of high conductivity. While exemplary embodiments of the present invention have been described, it is to be understood that the embodiments described are illustrative only and the scope of the invention is to be defined solely by the appended claims when accorded a full range of equivalence, many variations and modifications naturally occuring to those skilled in the art from a perusal hereof.

    Abstract translation: 本发明的方法和复合材料在其中所含的金刚石颗粒的尺寸方面具有优于已知复合材料的显着优点。 没有金刚石/金属比的变化，较大尺寸的金刚石颗粒（约110微米和约160微米的尺寸）提供了增加导热性的复合材料（20），而不牺牲CTE。 因此，复合材料（20）的CTE可以与其相关联的电气部件（18）的CTE匹配，并且仍然保持高导电性的优点。 尽管已经描述了本发明的示例性实施例，但是应当理解，所描述的实施例仅是说明性的，并且本发明的范围仅在所附权利要求中被限定为全部范围的等同性，许多变化和修改 从本文中可以看出本领域技术人员自然发生。

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