Abstract:
The present invention relates to a test system (100) interposed between a clock monitor (152) and an internal memory block (125) of a self-timed memory. In an example embodiment, the test system (100) receives an internal clock signal (104) from the clock monitor (152), an external clock signal (CL) and a control signal (CS). A multiplexer (110) of the test system provides in dependence upon the control signal (CS) the internal clock signal (104) to the internal memory block (125) during a normal mode of operation of the self-timed memory and the external clock signal (CL) to the internal memory block (125) during a test mode (108) of the self-timed memory. The test system (100) enables control of the clock cycle of the internal memory block (125) by directly applying the external clock signal (CL) during test mode. Thus, the internal memory block is stressed properly enabling the detection of small delay faults.
Abstract:
An apparatus (Fig.2) and method for generating a plurality of synchronizing signals for synchronizing operation of the device in which the apparatus is located, such as in semiconductor memory devices. The apparatus can generate a plurality of synchronizing signals (CLKSYNC) based on a corresponding plurality of input clock signals (CLK ) and select one of the synchronizing signals to be provided as the synchronizing clock signal (CLK DEL). Alternatively, the apparatus can generate a plurality of internal clock signals (CLK1, CLK2). based on an input clock signal (CLK), and generate a corresponding plurality of synchronizing signals from the plurality of internal clock signals. One of the synchronizing signals is selected by the apparatus as the synchronizing clock signal. Alternatively, the apparatus can receive a clock signal, generate a synchronized clock signal therefrom, and generate a synchronizing pulse in response to number of periods of the synchronized clock signal, the number based on a selection signal provided to the apparatus.
Abstract:
A first device delivers a clock offset message to a second device. The second device offsets its data transmission according to the clock offset message. A test pattern is transmitted from the second device to the first device. The first device then checks the received test pattern to determine whether the transmission was successful. The first device can then deliver an additional clock offset message to the second device to instruct the second device to offset its data transmission by a different value than was used previously. The second device again transmits the test pattern and the first device again checks the received pattern. By trying a number of clock offset values and determining which values result in successful transmissions of data, the first device can determine the optimal clock offset value and instruct the second device to use this value for all transmissions.
Abstract:
Verfahren und Vorrichtung zum Prüfen von Halbleiterspeichereinrichtungen. Die Erfindung betrifft ein Prüfverfahren für Halbleiterspeichereinrichtungen (P), die einen bidirektionalen Datenstrobe-Anschluss für ein Datenstrobe-Signal (DQS) aufweisen, an einer Prüfapparatur (PA), wobei die Prüfung des Datenstrobe-Signals durch einen Datentransfer zwischen der zu prüfenden Halbleiterspeichereinrichtung (P) und einer zweiten Halbleiterspeichereinrichtung gleichen Typs (R) erfolgt, sowie eine dafür geeignete Vorrichtung.
Abstract:
The access times of semiconductor memories are subject to production-dependent fluctuations, even with identical technological parameters. These fluctuations lead to a certain amount of slow memory chips. By boosting the internal distribution voltage of the slower semiconductor memory by an amount dependent in each case on the semiconductor memory in question, the access time is reduced. The method is applied in semiconductor memories, in particular dynamic semiconductor memories.
Abstract:
In one example in accordance with the present disclosure a control circuit is described. The control circuit includes a source following component to receive an input voltage and output a switching voltage. The circuit also includes an input leg of a current mirror coupled to the source following component. The input leg of the current mirror replicates the switching voltage to an output leg of the current mirror of a memristive bit cell. The circuit also includes a number of current control components. At least one of the current control components enforces a constant current through the source following component and other current control components maintain the input leg of the current mirror and the output leg of the current mirror at the same current.
Abstract:
Techniques for injecting a delay to simulate latency are provided. In one aspect, it may be determined that a current epoch should end. A delay may be injected. The delay may simulate the latency of non-volatile memory access during the current epoch. The current epoch may then end. A new epoch may then begin.
Abstract:
In a chip-to-chip signaling system includes at least one signaling link coupled between first and second ICs, the first IC has an interface coupled to the signaling link and timed by a first interface timing signal. The second IC has an interface coupled to the signaling link and timed by a second interface timing signal that is mesochronous with respect to the first interface timing signal. The second IC further has phase adjustment circuitry that adjusts a phase of the second interface timing signal using a digital counter implemented with Josephson-junction circuit elements.
Abstract:
A nonvolatile memory die is tested to determine certain parameters such as read time, which are then recorded in the nonvolatile memory die. After the die is incorporated into a memory system, and firmware is downloaded, the nonvolatile memory system uses the recorded parameters to determine how to configure the memory system for operation within specified limits, such as determining how much delay to apply to read operations.
Abstract:
Example embodiments relate to response control for memory modules that include or interface with non-compliant memory technologies. A memory module may include an interface to a memory bus that complies with a data transfer standard, wherein the memory bus communicates with a memory controller, and an interface to a non-compliant memory technology that does not comply with the data transfer standard. The memory module may include a command monitoring circuit to determine whether a command from the memory controller has been or will be completed by the non-compliant memory circuit within a defined amount of time within which a command should be completed according to the data transfer standard. The memory module may include an error causing circuit that signals to the memory controller or an operating system when the command has not or will not complete within the defined amount of time.