公开(公告)号：WO2009078807A1

公开(公告)日：2009-06-25

申请号：PCT/SG2007/000430

申请日：2007-12-17

Applicant: EM TECHNOLOGIES GROUP PTE LTD ,  MATITSINE, Serguei

Inventor： MATITSINE, Serguei

IPC: H01Q15/10 ,  H01P3/16 ,  H01Q13/28

CPC classification number: C08J9/0085 ,  C08J9/35 ,  H01B3/004 ,  H01B3/47 ,  H01Q15/10 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/249924 ,  Y10T428/249937 ,  Y10T428/249948 ,  Y10T428/25 ,  Y10T428/2982

Abstract: An artificial dielectric material comprising a plurality of blocks of dielectric material, each block have at least one conductive fibre or wire embedded within. A method of making the material is disclosed where a plurality of strands or wires are embedded in dielectric layer which is then chopped in blocks. These blocks then fall randomly into a container in any order or pattern and are glued into a solid layer.

Abstract translation: 一种包括多个电介质材料块的人造电介质材料，每个嵌段具有嵌入其中的至少一个导电纤维或电线。 公开了一种制造材料的方法，其中多个线束或线被嵌入在电介质层中，然后将其切成块状。 这些块然后以任何顺序或图案随机落入容器中，并且胶合成固体层。

公开(公告)号：WO2005027197A3

公开(公告)日：2006-04-13

申请号：PCT/US2004028741

申请日：2004-09-03

Applicant: MERRIMAC IND INC

Inventor： LOGOTHETIS JAMES J

IPC: H01L23/66 ,  H01P3/08 ,  H01P3/16 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/46 ,  H01P5/103 ,  H03H7/38

CPC classification number: H01L23/66 ,  H01L24/97 ,  H01L2223/6627 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/12034 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P3/085 ,  H01P3/16 ,  H05K1/0237 ,  H05K1/056 ,  H05K1/183 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4697 ,  H05K2203/063 ,  H05K2203/065 ,  Y10T29/49016 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

Abstract translation: 耦合组件包括多个复合衬底层和以堆叠布置结合在一起的凸缘层熔合。 衬底层位于凸缘层的顶部，并且包括连接到信号输入和信号输出的嵌入式信号处理电路。 通过衬底层的区域形成空腔以暴露信号连接端子。 这些信号连接端子耦合到嵌入式信号处理电路，并且它们使得能够在法兰和衬底层的熔接之后将电路元件添加到组件，并且它们使得能够将该添加的元件耦合到信号处理电路。

公开(公告)号：WO2004017455A1

公开(公告)日：2004-02-26

申请号：PCT/JP2003/010316

申请日：2003-08-13

Applicant: 東京エレクトロン株式会社 ,  湯浅 光博

Inventor： 湯浅 光博

IPC: H01P3/16

CPC classification number: H01P3/165 ,  H01P11/006 ,  Y10T29/49016

Abstract: ＭＥＭＳ回路を組み込んだ基板上に導体膜を形成し、その上に誘電率の低い誘電体Ａ膜と誘電率の高い誘電体Ｂ膜を形成し、その上に導体膜を形成する。ミリ波は、誘電体線路である誘電体Ｂ膜によってガイドされ、導体に反射しながら伝搬する。

Abstract translation: 在已经制造了MEMS电路的基板上形成导电膜; 在导电膜上形成具有低介电常数的电介质A膜和具有高介电常数的电介质B膜; 并且在电介质膜上形成导电膜。 毫米波由作为电介质波导管的电介质B膜引导，并被导体反射而传播。

公开(公告)号：WO02011234A1

公开(公告)日：2002-02-07

申请号：PCT/KR2000/000852

申请日：2000-08-02

IPC: H01P3/16 ,  H01P1/20 ,  H01P1/383 ,  H03F3/10 ,  H03F3/46 ,  H03F7/00 ,  H03F11/00 ,  H01P1/387 ,  H01P7/08

CPC classification number: H01P1/383 ,  H01P1/2002 ,  H03F3/10

Abstract: The present invention relates to a high frequency amplifier with the multi-space structure, which may amplify various frequencies by installing a Gunn diode in the multi-space structure composed of non-radiative dielectric waveguides of various different sizes. The present invention provides an amplifier circuit with the multi-space structure, which includes: a Gunn diode inserted in a space between two metal plates of a certain distance from each other; a circulator which revolves the input waves and determines the transmission direction; the first non-radiative dielectric waveguide which is connected to the circulator, sending the input waves from the input terminal to the circulator; the second non-radiative dielectric waveguide which also is connected to the circulator, sending the input signals from the circulator to the Gunn diode and sending the amplified signals from the Gunn diode back to the circulator; and the third non-radiative dielectric waveguide which is connected to the circulator, sending the amplified signals, which come into the circulator through the second non-radiative dielectric waveguide, to the output terminal. The present invention provides a broadband amplification function by further including a resonance circuit composed of multiple blocks of non-radiative dielectric waveguides. The present invention, by providing a Gunn diode amplifier using the multi-space non-radiative dielectric waveguides, makes it unnecessary to construct multiple packages in order to amplify various frequencies. Thus, the present invention has an economical advantage. Moreover, the broadband amplifier with the Gunn diode and dielectric resonance circuits of the present invention may be very useful for super-high speed broadband communication devices in this multimedia era. 12

Abstract translation: 本发明涉及具有多空间结构的高频放大器，其可以通过在由各种不同尺寸的非辐射介质波导构成的多空间结构中安装耿氏二极管来放大各种频率。 本发明提供一种具有多空间结构的放大器电路，其包括：插入两个彼此间隔一定距离的金属板之间的空间中的耿氏二极管; 循环器，其旋转输入波并确定传输方向; 连接到循环器的第一非辐射介质波导，将输入波从输入端发送到循环器; 第二非辐射介质波导也连接到循环器，将输入信号从循环器发送到耿氏二极管，并将放大的信号从耿氏二极管发送回环行器; 以及连接到循环器的第三非辐射介质波导，将通过第二非辐射介质波导进入循环器的放大信号发送到输出端。 本发明通过进一步包括由多个非辐射介质波导块组成的谐振电路提供宽带放大功能。 本发明通过提供使用多空间非辐射介质波导的耿氏二极管放大器，使得不需要构建多个封装以放大各种频率。 因此，本发明具有经济的优点。 此外，具有本发明的耿氏二极管和介质谐振电路的宽带放大器在该多媒体时代对于超高速宽带通信设备可能是非常有用的。 12

公开(公告)号：WO8603891A3

公开(公告)日：1988-01-14

申请号：PCT/US8502423

申请日：1985-12-12

Applicant: MARTIN MARIETTA CORP

Inventor： SEQUEIRA HERMANN BRIAN

IPC: H01P1/10 ,  H01P1/20 ,  H01P1/32 ,  H01P1/37 ,  H01P1/38 ,  H01P3/08 ,  H01P3/16 ,  H01P5/08 ,  H01Q13/20 ,  H01Q13/24 ,  H01Q13/28

CPC classification number: H01P3/082 ,  H01P1/10 ,  H01P1/32 ,  H01P3/16 ,  H01Q13/20

Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness ds and permittivity epsilons; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity epsilong, where epsilong > epsilons, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness dl, and permittivity epsilonl, where epsilong > epsilonl, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band. Radiation losses due to coupling of the desired mode to the substrate modes and the conductors are furthermore reduced and the polarization of the dominant mode is such as to render said structure relatively insensitive to small deviations from parallelism among the different interfaces.

公开(公告)号：WO2022107499A1

公开(公告)日：2022-05-27

申请号：PCT/JP2021/037692

申请日：2021-10-12

Applicant: ＡＧＣ株式会社

Inventor： 熊谷　翔 ,  長江　眞平 ,  森本　康夫 ,  加賀谷　修

IPC: H01P3/16 ,  H01P3/12 ,  H01P5/08 ,  H01P5/103 ,  H01Q13/22

Abstract: 第１周波数の第１電磁波と、前記第１周波数より低い第２周波数の第２電磁波と、を伝送可能な伝送路であって、長手方向に断面が同一形状であって、比誘電率が第１比誘電率である第１誘電体により形成される第１導波部と、前記第１導波部の外周を覆い、比誘電率が前記第１周波数において前記第１比誘電率より小さい第２比誘電率である第２誘電体により形成される第２導波部と、前記第２導波部の外周を覆い、導電性部材により形成される被覆部と、を備え、前記被覆部は、外周面から貫通して前記第２導波部を露出し、前記第２電磁波を透過する第１開口部を有する伝送路。

公开(公告)号：WO2021244828A1

公开(公告)日：2021-12-09

申请号：PCT/EP2021/062529

申请日：2021-05-11

Applicant: HUBER+SUHNER AG

Inventor： FRANZ, Manser ,  HÜGEL, Ulf

IPC: H01P5/08 ,  H01P5/10 ,  H01P3/16 ,  H01P5/087 ,  H01P5/1022

Abstract: P23710PC00 26/26 ABSTRACT The disclosure is directed to a PMF-transceiver (1) comprising a housing (2) with a recess (5) in which a printed circuit board (6) is arranged. The printed circuit board (6) comprises at least one radiating element (7) being in a mounted position inter- connected to a thereto related PMF-cable (18) by a PMF-interposer (13) arranged 5 between the printed circuit board (6) and the PMF-cable (18) and comprising a main body (14) arranged in a cavity (17) in the housing (2). The PMF-interposer (13) extends between the radiating element (7) and the PMF-cable (19). (Figure 1)

公开(公告)号：WO2021167073A1

公开(公告)日：2021-08-26

申请号：PCT/JP2021/006402

申请日：2021-02-19

Applicant: ダイキン工業株式会社

Inventor： 吉本　洋之 ,  徳平　勝貞 ,  山中　拓

IPC: H01P3/16

Abstract: 電磁波の突き抜けを低減することが可能な誘電体導波線路を提供する。本開示は、中心誘電体Ａ１と、中心誘電体Ａ１の周囲に設けられた誘電体層Ａ２と、誘電体層Ａ２の周囲に設けられた誘電体層Ａ３とを備える誘電体導波線路であって、中心誘電体Ａ１は、ポリテトラフルオロエチレンを含み、中心誘電体Ａ１、誘電体層Ａ２及び誘電体層Ａ３の２５℃、６ＧＨｚにおける比誘電率をそれぞれεＡ１、εＡ２及びεＡ３と表すとき、εＡ１が２．２０以下であり、εＡ２が１．９０以下であり、εＡ３が１．５５以下であり、εＡ１＞εＡ２＞εＡ３である誘電体導波線路に関する。

公开(公告)号：WO2020080902A1

公开(公告)日：2020-04-23

申请号：PCT/KR2019/013782

申请日：2019-10-18

Applicant: 삼성전자 주식회사

Inventor： 홍은석

IPC: H04M1/02 ,  H01P3/08 ,  H01P3/16

Abstract: 본 발명의 다양한 실시 예에 따른 전자 장치는 제1 배선, 상기 제1 배선을 따라 상기 제1 배선의 일 측면에 형성된 제2 배선, 및 상기 제1 배선을 따라 상기 제1 배선의 다른 측면에 형성된 제3 배선을 포함하는 제1 레이어, 상기 제1 배선, 상기 제2 배선, 및 상기 제3 배선을 따라 형성되고, 상기 제2 배선 및 상기 제3 배선과 전기적으로 연결된 접지 면(ground plane)을 포함하는 제2 레이어, 및 상기 제 1 레이어와 상기 제 2 레이어 사이에 배치되고 제1 유전율을 가지는 절연층을 포함하는 회로 기판, 및 상기 제1 배선을 따라 상기 제1 유전율 보다 낮은 제2 유전율의 유전체가 채워질 수 있는 이격 공간을 갖도록 상기 제 1 레이어 위에 배치되고, 상기 전자 장치의 접지와 전기적으로 연결되는 도전성 부재를 포함할 수 있다.

公开(公告)号：WO2019193478A1

公开(公告)日：2019-10-10

申请号：PCT/IB2019/052647

申请日：2019-03-31

Applicant: MARVELL WORLD TRADE LTD.

Inventor： AHIRWAR, Vijay ,  TAM, Sai-Wang ,  WONG, Alden C.

IPC: H01P3/16 ,  H01P3/02 ,  H01B11/22 ,  H04B3/44

Abstract: A waveguide (20, 72) includes a core (32, 76) and an electrically-conductive transmission line (36, 60, 84). The core includes an electrically-insulating material that is transmissive at millimeter-wave frequencies. The core is configured to receive a millimeter- wave signal at a first end of the waveguide, and to guide the millimeter-wave signal to a second end of the waveguide. The electrically-conductive transmission line is coupled in propinquity to the core and is configured to conduct an electrical signal between the first end of the waveguide and the second end of the waveguide, in parallel with the millimeter-wave signal guided in the core.