PROCEDE DE FABRICATION D'UNE PIECE MICROMECANIQUE EN SILICIUM

    公开(公告)号:WO2019076742A1

    公开(公告)日:2019-04-25

    申请号:PCT/EP2018/077842

    申请日:2018-10-12

    IPC分类号: B81C1/00 G04D3/00 G04B13/00

    摘要: L'invention concerne un procédé de fabrication (10) d'une pièce micromécanique (11) en silicium comportant les étapes suivantes : - usinage (50) d'une plaque de silicium (12) de sorte à créer une structure micromécanique (13), ladite structure (13) comportant au moins une face de contact (14) destinée à supporter des efforts et au moins une face de positionnement (15) destinée à positionner ladite structure (13); - dépôt (51) d'une couche de nitrure de silicium (16) sur toutes les faces de ladite structure (13); - gravure (52) de ladite couche de nitrure de silicium (16) sur au moins une face de positionnement (15); et - oxydation (53) de ladite au moins une face de positionnement (15) sur les parties dépourvues de nitrure de silicium.

    METHOD OF FABRICATING A MICRO MACHINED CHANNEL

    公开(公告)号:WO2019054873A1

    公开(公告)日:2019-03-21

    申请号:PCT/NL2018/050610

    申请日:2018-09-17

    申请人: BERKIN B.V.

    IPC分类号: B81C1/00

    摘要: The invention relates to a method of fabricating a micro machined channel, comprising the steps of providing a substrate of a first material and having a buried layer of a different material therein, and forming at least two trenches in said substrate by removing at least part of said substrate. Said trenches are provided at a distance from each other and at least partly extend substantially parallel to each other, as well as towards said buried layer. The method comprises the step of forming at least two filled trenches by providing a second material different from said first material and filling said at least two trenches with at least said second material; forming an elongated cavity in between said filled trenches by removing at least part of said substrate extending between said filled trenches; and forming an enclosed channel by providing a layer of material in said cavity and enclosing said cavity.

    A MEMS MICROPHONE, A MANUFACTURING METHOD THEREOF AND AN ELECTRONIC APPARATUS

    公开(公告)号:WO2018223389A1

    公开(公告)日:2018-12-13

    申请号:PCT/CN2017/087771

    申请日:2017-06-09

    申请人: GOERTEK. INC

    发明人: ZOU, Quanbo

    摘要: A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane (402) monolithically integrated with the MEMS microphone chip; and a housing (411, 412) including an acoustic port (413), wherein the MEMS microphone device is mounted in the housing (411, 412), and the mesh membrane (402) is arranged between the MEMS microphone chip and the acoustic port (413) as a particle filter for the MEMS microphone chip. According to an embodiment, a relatively thin mesh filter can be provided to a MEMS microphone with relatively high reliability.

    멤스 디바이스 및 그 제조방법
    85.
    发明申请

    公开(公告)号:WO2018221753A1

    公开(公告)日:2018-12-06

    申请号:PCT/KR2017/005569

    申请日:2017-05-29

    IPC分类号: B81B7/02 B81C1/00

    CPC分类号: B81B7/02 B81C1/00

    摘要: 비정질탄소막을 희생층으로 이용한 멤스 디바이스 및 그 제조 방법이 제공된다. 본 발명의 일 실시예에 따르면, 하부 구조체; 상기 하부 구조체의 상부로 이격되어 배치된 멤스 구조체; 상기 하부 구조체와 상기 멤스 구조체를 전기적으로 연결하는 전기적 연결 구조체; 및 상기 멤스 구조체의 상부로 이격되어 배치되는 플레이트부와 상기 플레이트부로부터 상기 멤스 구조체로 연장되는 비어 연결부를 구비하는 광흡수 구조체;를 포함하는, 멤스 디바이스를 제공한다.

    수직성장 전주가공물과 그 제작 방법

    公开(公告)号:WO2018208074A1

    公开(公告)日:2018-11-15

    申请号:PCT/KR2018/005299

    申请日:2018-05-09

    申请人: 성낙훈

    发明人: 성낙훈

    摘要: 본 발명은 도금체의 수직성장을 가능케 하는 수직성장 마스타를 사용하여 수직성장 된 전주가공물의 가공방법과 그 방법으로 만들어진 전주가공물에 대한 것이다. 본 발명의 수직성장 마스타의 상부표면에는 돌출부와 공간부가 형성되어 진다. 상기 공간부에는 비도전성 물질로 충진 또는 코팅 또는 도포를 한다. 상기 충진 또는 코팅 또는 도포된 공간부에는 도금용액이 내부에 갇히어 정체영역을 형성하게 된다. 본 발명의 특징은 공간부에 비도전성 물질을 충진 또는 코팅 또는 도포하여, 공간부에 정체영역이 발생하도록 하는 것을 특징으로 한다. 본 발명의 수직성장 마스타를 통하여 전주가공을 실행하면, 전주가공물은 수평성장은 거의 하지 않고, 수직성장이 되게 하는 것을 특징으로 한다. 전주가공물이 수직성장이 됨에 따라 정체영역도 상부로 함께 상승한다.

    MOLDED PANELS
    87.
    发明申请
    MOLDED PANELS 审中-公开

    公开(公告)号:WO2018203872A1

    公开(公告)日:2018-11-08

    申请号:PCT/US2017/030374

    申请日:2017-05-01

    摘要: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

    INKJET PRINTING PROCESS
    88.
    发明申请

    公开(公告)号:WO2018202576A1

    公开(公告)日:2018-11-08

    申请号:PCT/EP2018/060879

    申请日:2018-04-27

    摘要: The invention is directed to an only inkjet-printing-based process for depositing functional materials, preferably PZT, on a substrate, preferably platinized silicon. Substrate templating (via SAMs) and material deposition are both performed by an inkjet printing process. The invention also relates to a composition to be used as a SAM precursor ink which is a thiol in a solvent mixture. The invention further concerns a cartridge for a printing machine with such a composition. The invention also relates to the use of such a cartridge, alone, or as a kit with another cartridge containing a precursor of the functional material, in particular to perform both steps of the printing method. The invention also relates to the product, for instance a microsystem, obtained by the process of the invention.