Abstract:
A memory device includes a plurality of memory cells and a controller. The controller is configured to program each of the memory cells to one of a plurality of program states, and to read the memory cells using a read operation of applied voltages to the memory cells. During the read operation, separations between adjacent ones of the program states vary based on frequencies of use of the program states in the plurality of memory cells.
Abstract:
A neural network device having a first plurality of synapses that includes a plurality of memory cells. Each memory cell includes a floating gate over a first portion of a channel region and a first gate over a second portion of the channel region. The memory cells are arranged in rows and columns. A plurality of first lines each electrically connect together the first gates in one of the memory cell rows, a plurality of second lines each electrically connect together the source regions in one of the memory cell rows, and a plurality of third lines each electrically connect together the drain regions in one of the memory cell columns. The first plurality of synapses receives a first plurality of inputs as electrical voltages on the plurality of third lines, and provides a first plurality of outputs as electrical currents on the plurality of second lines.
Abstract:
A memory device having plurality of upwardly extending semiconductor substrate fins, a memory cell formed on a first fin and a logic device formed on a second fin. The memory cell includes source and drain regions in the first fin with a channel region therebetween, a polysilicon floating gate extending along a first portion of the channel region including the side and top surfaces of the first fin, a metal select gate extending along a second portion of the channel region including the side and top surfaces of the first fin, a polysilicon control gate extending along the floating gate, and a polysilicon erase gate extending along the source region. The logic device includes source and drain regions in the second fin with a second channel region therebetween, and a metal logic gate extending along the second channel region including the side and top surfaces of the second fin.
Abstract:
A memory device with memory cells in rows and columns, word lines connecting together the control gates for the memory cell rows, bit lines electrically connecting together the drain regions for the memory cell columns, first sub source lines each electrically connecting together the source regions in one of the memory cell rows and in a first plurality of memory cell columns, second sub source lines each electrically connecting together the source regions in one of the memory cell rows and in a second plurality of memory cell columns, first and second source lines, first select transistors each connected between one of first sub source lines and the first source line, second select transistors each connected between one of second sub source lines and the second source line, and select transistor lines each connected to gates of one of the first select transistors and one of the second select transistors.
Abstract:
A non- volatile memory cell formed on a semiconductor substrate having an upper surface with an upwardly extending fin with opposing first and second side surfaces. First and second electrodes are in electrical contact with first and second portions of the fin. A channel region of the fin includes portions of the first and second side surfaces that extend between the first and second portions of the fin. A floating gate extends along the first side surface of a first portion of the channel region, where no portion of the floating gate extends along the second side surface. A word line gate extends along the first and second side surfaces of a second portion of the channel region. A control gate is disposed over the floating gate. An erase gate has a first portion disposed laterally adjacent to the floating gate and a second portion disposed vertically over the floating gate.
Abstract:
A non- volatile memory cell formed on a semiconductor substrate having an upper surface with an upwardly extending fin with opposing first and second side surfaces. First and second electrodes are in electrical contact with first and second portions of the fin. A channel region of the fin includes portions of the first and second side surfaces that extend between the first and second portions of the fin. A floating gate extends along the first side surface of a first portion of the channel region, where no portion of the floating gate extends along the second side surface. A word line gate extends along the first and second side surfaces of a second portion of the channel region. A control gate is disposed over the floating gate. An erase gate has a first portion disposed laterally adjacent to the floating gate and a second portion disposed vertically over the floating gate.
Abstract:
A memory device includes a memory cell, a logic device and a high voltage device formed on the same semiconductor substrate. Portions of the upper surface of the substrate under the memory cell and the high voltage device are recessed relative to the upper surface portion of the substrate under the logic device. The memory cell includes a polysilicon floating gate disposed over a first portion of a channel region of the substrate, a polysilicon word line gate disposed over a second portion of the channel region, a polysilicon erase gate disposed over a source region of the substrate, and a metal control gate disposed over the floating gate and insulated from the floating gate by a composite insulation layer that includes a high-K dielectric. The logic device includes a metal gate disposed over the substrate. The high voltage device includes a polysilicon gate disposed over the substrate.
Abstract:
A method of forming a memory device that includes forming a first insulation layer on a semiconductor substrate, forming a conductive material layer on the first insulation layer, forming an insulation block on the conductive material layer, forming an insulation spacer along a side surface of the insulation block and on the conductive material layer, etching the conductive material layer to form a block of the conductive material disposed directly under the insulation block and the insulation spacer, removing the insulation spacer, forming a second insulation layer having a first portion wrapping around an exposed upper edge of the block of the conductive material and a second portion disposed on a first portion of the first insulation layer over the substrate, and forming a conductive block insulated from the block of the conductive material by the second insulation layer and from the substrate by the first and second insulation layers.
Abstract:
A fusion reactor includes a vacuum chamber, a fuel source for providing fuel to the vacuum chamber, an evacuation pump for evacuating the fuel from the vacuum chamber, a first electrode disposed in the vacuum chamber and at a chamber axis, a second electrode disposed in the vacuum chamber (which includes an aperture through which the chamber axis extends), magnets disposed in the vacuum chamber for producing a magnetic field along the chamber axis, and control electronics. The control electronics control the fuel source and the evacuation pump to provide a low pressure of the fuel in the vacuum chamber, provide a voltage to the first electrode for producing an electron beam along the chamber axis and through the aperture of the second electrode, and provide one or more voltages to the second electrode for compressing the fuel toward the chamber axis to induce nuclear fusion.
Abstract:
A method of forming split gate non-volatile memory cells on the same chip as logic and high voltage devices having HKMG logic gates. The method includes forming the source and drain regions, floating gates, control gates, and the poly layer for the erase gates and word line gates in the memory area of the chip. A protective insulation layer is formed over the memory area, and an HKMG layer and poly layer are formed on the chip, removed from the memory area, and patterned in the logic areas of the chip to form the logic gates having varying amounts of underlying insulation.