公开(公告)号：WO2009032201A3

公开(公告)日：2009-12-30

申请号：PCT/US2008010259

申请日：2008-08-29

Applicant: BOYD JOHN W ,  WHITWELL WILLIAM P ,  HICKS GEORGE ,  HICKS RONNIE D ,  DIMMICK TIMOTHY J

Inventor： BOYD JOHN W ,  WHITWELL WILLIAM P ,  HICKS GEORGE ,  HICKS RONNIE D ,  DIMMICK TIMOTHY J

IPC: B66F9/14

CPC classification number: B66B9/04

Abstract: An elevating platform assembly is provided. In accordance with one exemplary embodiment a platform is present and is moveable along a travel distance of a mast. A cylinder is provided and is capable of being actuated. The cylinder is used to move the platform along the travel distance.

Abstract translation: 提供了一种升降平台组件。 根据一个示例性实施例，存在平台并且可以沿着桅杆的行进距离移动。 提供了一个圆柱体并且能够被致动。 气缸用于沿着行驶距离移动平台。

公开(公告)号：WO2008140697A1

公开(公告)日：2008-11-20

申请号：PCT/US2008/005744

申请日：2008-05-02

Applicant: LAM RESEARCH CORPORATION ,  WANG, Zhonghui ,  ARUNAGIRI, Tiruchirapalli ,  REDEKER, Fritz ,  DORDI, Yezdi ,  BOYD, John ,  KOROLIK, Mikhail

Inventor： WANG, Zhonghui ,  ARUNAGIRI, Tiruchirapalli ,  REDEKER, Fritz ,  DORDI, Yezdi ,  BOYD, John ,  KOROLIK, Mikhail

IPC: H01L21/304

CPC classification number: H01L21/02074

Abstract: Methods for cleaning semiconductor wafers following chemical mechanical polishing are provided. An exemplary method exposes a wafer to a thermal treatment in an oxidizing environment followed by a thermal treatment in a reducing environment. The thermal treatment in the oxidizing environment both removes residues and oxidizes exposed copper surfaces to form a cupric oxide layer. The thermal treatment in the reducing environment then reduces the cupric oxide to elemental copper. This leaves the exposed copper clean and in condition for further processing, such as electroless plating.

Abstract translation: 提供了化学机械抛光后的半导体晶片清洗方法。 一种示例性方法将晶片暴露于氧化环境中的热处理，然后在还原环境中进行热处理。 在氧化环境中的热处理既去除残留物，又氧化暴露的铜表面以形成氧化铜层。 然后，在还原环境中的热处理将氧化铜还原为元素铜。 这使得暴露的铜清洁并进行进一步处理，例如化学镀。

公开(公告)号：WO2008030729A3

公开(公告)日：2008-06-26

申请号：PCT/US2007076955

申请日：2007-08-28

Applicant: TTB TECHNOLOGIES LLC ,  BOYD JOHN E

Inventor： BOYD JOHN E

IPC: G06F15/16 ,  G06F3/00 ,  G06Q10/00

CPC classification number: G06Q10/109 ,  G06Q10/10

Abstract: Methods and systems for assisting individuals arrange meetings such as networking meetings with other individuals at a specified time (or within a specified time range) and at a specified place (or within a specified geographic region). More specifically, (Fig 7), methods and systems for allowing individuals to post an invitation to for a meeting on an on-line network.

Abstract translation: 在指定时间（或指定时间范围内）和指定地点（或指定地理区域内）协助个人安排会议等与其他人进行网络会议的方法和系统。 更具体地，（图7），用于允许个人向在线网络上的会议发布邀请的方法和系统。

公开(公告)号：WO2008073245A1

公开(公告)日：2008-06-19

申请号：PCT/US2007/024859

申请日：2007-12-05

Applicant: LAM RESEARCH CORPORATION ,  DORDI, Yezdi ,  BOYD, John M. ,  REDEKER, Fritz C. ,  THIE, William ,  ARUNAGIRI, Tiruchirapalli ,  YOON, Hyungsuk Alexander

Inventor： DORDI, Yezdi ,  BOYD, John M. ,  REDEKER, Fritz C. ,  THIE, William ,  ARUNAGIRI, Tiruchirapalli ,  YOON, Hyungsuk Alexander

IPC: H01L21/28 ,  H01L21/283 ,  H01L21/20

CPC classification number: H01L23/53238 ,  H01L21/28562 ,  H01L21/76846 ,  H01L21/76856 ,  H01L21/76862 ,  H01L21/76873 ,  H01L21/76874 ,  H01L2221/1089 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An interconnect structure is provided, including a layer of dielectric material having at least one opening and a first barrier layer on sidewalls defining the opening. A ruthenium-containing second barrier layer overlays the first barrier layer, the second barrier layer having a ruthenium zone, a ruthenium oxide zone, and a ruthenium-rich zone. The ruthenium zone is interposed between the first barrier layer and the ruthenium oxide zone. The ruthenium oxide zone is interposed between the ruthenium zone and the ruthenium-rich zone.

Abstract translation: 提供互连结构，包括具有至少一个开口的介电材料层和在限定开口的侧壁上的第一阻挡层。 含钌的第二阻挡层覆盖第一阻挡层，第二阻挡层具有钌区，氧化钌区和富钌区。 钌区介于第一阻挡层和氧化钌区之间。 钌氧化物区位于钌区和富钌区之间。

公开(公告)号：WO2008027216A2

公开(公告)日：2008-03-06

申请号：PCT/US2007018270

申请日：2007-08-17

Applicant: LAM RES CORP ,  DORDI YEZDI ,  REDEKER FRITZ C ,  BOYD JOHN ,  THIE WILLIAM ,  ARUNAGIRI TIRUCHIRAPALLI ,  HOWALD ARTHUR M ,  YOON HYUNGSUK ALEXANDER ,  VERTOMMEN JOHAN

Inventor： DORDI YEZDI ,  REDEKER FRITZ C ,  BOYD JOHN ,  THIE WILLIAM ,  ARUNAGIRI TIRUCHIRAPALLI ,  HOWALD ARTHUR M ,  YOON HYUNGSUK ALEXANDER ,  VERTOMMEN JOHAN

IPC: B05D3/00 ,  B05D1/18 ,  B29C71/04 ,  C23C16/00

CPC classification number: H01L21/0206 ,  H01L21/02068 ,  H01L21/02074 ,  H01L21/28518 ,  H01L21/288 ,  H01L21/32115 ,  H01L21/76846 ,  H01L21/76849 ,  H01L21/76883

Abstract: The embodiments provide processes and integrated systems that produce a metal-to-metal or a silicon-to-metal interface to enhance electro-migration performance, to provide lower metal resistivity, and to improve metal-to-metal or silicon-to-metal interfacial adhesion for copper interconnects. An exemplary method of preparing a substrate surface to selectively deposit a thin layer of a cobalt-alloy material on a copper surface of in an integrated system to improve electromigration performance of a copper interconnect is provided. The method includes removing contaminants and metal oxides from the substrate surface in the integrated system, and reconditioning the substrate surface using a reducing environment after removing contaminants and metal oxides in the integrated system. The method also includes selectively depositing the thin layer of cobalt-alloy material on the copper surface of the copper interconnect in the integrated system after reconditioning the substrate surface. System to practice the exemplary method described above are also provided.

公开(公告)号：WO2008027215A2

公开(公告)日：2008-03-06

申请号：PCT/US2007/018254

申请日：2007-08-17

Applicant: LAM RESEARCH CORPORATION ,  YOON, Hyungsuk, Alexander ,  BOYD, John, M. ,  KOROLIK, Mikhail ,  DORDI, Yezdi ,  REDEKER, Fritz, C.

Inventor： YOON, Hyungsuk, Alexander ,  BOYD, John, M. ,  KOROLIK, Mikhail ,  DORDI, Yezdi ,  REDEKER, Fritz, C.

IPC: B05D5/12 ,  C23C16/00 ,  B05D3/00 ,  C23C14/00 ,  B05C13/02 ,  H05K3/00 ,  B29C71/04 ,  C23C14/32

CPC classification number: H01L21/67207 ,  C23C16/0227 ,  C23C16/452 ,  C23C16/45514 ,  C23C16/45517 ,  C23C16/45551 ,  C23C16/56 ,  H01L21/28556 ,  H01L21/28562 ,  H01L21/76843 ,  H01L21/76868

Abstract: The embodiments provide integrated apparatus and methods that perform substrate surface treatment and film deposition for copper interconnect with improved metal migration performance and reduced void propagation. In one exemplary embodiment, a chamber for performing surface treatment and film deposition is provided. The chamber includes a first proximity head for substrate surface treatment configured to dispense a first treatment gas to treat a portion of a surface of a substrate under the first proximity head for substrate surface treatment. The chamber also includes a first proximity head for atomic layer deposition (ALD) configured to sequentially dispensing a first reactant gas and a first purging gas to deposit a first ALD film under the second proximity head for ALD.

Abstract translation: 这些实施例提供对铜互连进行衬底表面处理和膜沉积的综合设备和方法，具有改善的金属迁移性能和减少的空隙传播。 在一个示例性实施例中，提供了用于进行表面处理和膜沉积的室。 腔室包括用于衬底表面处理的第一邻近头部，其构造成分配第一处理气体以处理第一邻近头部下方的衬底表面的一部分用于衬底表面处理。 该室还包括用于原子层沉积（ALD）的第一邻近头，其被配置成顺序地分配第一反应气体和第一吹扫气体，以将第一ALD膜沉积在ALD的第二接近头下方。

公开(公告)号：WO2008002977A3

公开(公告)日：2008-03-06

申请号：PCT/US2007072241

申请日：2007-06-27

Applicant: LAM RES CORP ,  DORDI YEZDI ,  THIE WILLIAM ,  BOYD JOHN M ,  REDEKER FRITZ C ,  OWCZARZ ALEKSANDER

Inventor： DORDI YEZDI ,  THIE WILLIAM ,  BOYD JOHN M ,  REDEKER FRITZ C ,  OWCZARZ ALEKSANDER

IPC: C23C26/00 ,  B05D1/18

CPC classification number: H01L21/02074 ,  C23C18/1628 ,  C23C18/38 ,  C23C18/50 ,  H01L21/288 ,  H01L21/76849 ,  H01L21/76883 ,  Y10S134/902

Abstract: An electroless plating chamber is provided. The electroless plating chamber includes a chuck configured to support a substrate and a bowl surrounding a base and a sidewall of the chuck. The base has an annular channel defined along an inner diameter of the base. The chamber includes a drain connected to the annular channel. The drain is capable of removing fluid collected from the chuck. A proximity head capable of cleaning and substantially drying the substrate is included in the chamber. A method for performing an electroless plating operation is also provided.

Abstract translation: 提供无电镀室。 化学镀室包括配置成支撑基板的卡盘和围绕卡盘的基部和侧壁的碗。 底座具有沿着底座的内径限定的环形通道。 该腔室包括连接到环形通道的排水口。 排水口能够去除从卡盘收集的流体。 能够清洁和基本上干燥基板的接近头包括在腔室中。 还提供了一种执行化学镀操作的方法。

公开(公告)号：WO2006088713A2

公开(公告)日：2006-08-24

申请号：PCT/US2006004504

申请日：2006-02-08

Applicant: LAM RES CORP ,  YUN SEOKMIN ,  BOYD JOHN M ,  WILCOXSON MARK ,  DE LARIOS JOHN

Inventor： YUN SEOKMIN ,  BOYD JOHN M ,  WILCOXSON MARK ,  DE LARIOS JOHN

IPC: C23G1/00 ,  B08B3/00 ,  B08B3/10 ,  B08B3/12 ,  H01L21/00

CPC classification number: H01L21/67028 ,  C23G1/00 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/67051 ,  Y10S134/902

Abstract: A method for removing post-processing residues in a single wafer cleaning system is provided. The method initiates with providing a first heated fluid to a proximity head disposed over a substrate. Then, a meniscus of the first fluid is generated between a surface of the substrate and an opposing surface of the proximity head. The substrate is linearly moved under the proximity head. A single wafer cleaning system is also provided.

Abstract translation: 提供了一种用于去除单个晶片清洁系统中的后处理残留物的方法。 该方法通过向设置在基板上的接近头部提供第一加热流体而开始。 然后，在基板的表面和邻近头部的相对表面之间产生第一流体的弯月面。 基板在邻近头部下线性移动。 还提供单个晶片清洁系统。

公开(公告)号：WO2006012174A2

公开(公告)日：2006-02-02

申请号：PCT/US2005022172

申请日：2005-06-23

Applicant: LAM RES CORP ,  KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

Inventor： KOROLIK MIKHAIL ,  BOYD JOHN M ,  MIKHAYLICH KATRINA ,  RAVKIN MICHAEL ,  REDEKER FRED C ,  DE LARIOS JOHN M

IPC: H01L21/3065

CPC classification number: H01L21/31133 ,  H01L21/6708

Abstract: One embodiment provides a method of processing a substrate. The method includes applying a solution to a surface of a substrate. At least one reacting species has been produced by dissociation of the solution by applying energy such as a light to the solution. A first material on the substrate is reacted and removing the reacted first material. A system for processing a substrate is also described.

Abstract translation: 一个实施例提供了一种处理衬底的方法。 该方法包括将溶液施加到基底的表面。 至少一种反应物质是通过将溶液中的光等能量进行解离来解离的。 将基板上的第一材料反应并除去反应的第一材料。 还描述了一种用于处理衬底的系统。

公开(公告)号：WO0143017A9

公开(公告)日：2002-05-10

申请号：PCT/US0029189

申请日：2000-10-20

Applicant: QUALCOMM INC ,  JACOBS PAUL E ,  ANTONIO FRANKLIN P ,  DORNER STEVEN ,  NOERENBERG JOHN W ,  BELK JEFFREY K ,  OGDON BENJAMIN P ,  BECKLEY JEFFREY D ,  BIRD ALAN ,  BOYD JOHN D ,  PURLIA JOHN S ,  RHODES WILLIAM J ,  ROSS DAVID J ,  DUDZIAK MATTHEW J

Inventor： JACOBS PAUL E ,  ANTONIO FRANKLIN P ,  DORNER STEVEN ,  NOERENBERG JOHN W ,  BELK JEFFREY K ,  OGDON BENJAMIN P ,  BECKLEY JEFFREY D ,  BIRD ALAN ,  BOYD JOHN D ,  PURLIA JOHN S ,  RHODES WILLIAM J ,  ROSS DAVID J ,  DUDZIAK MATTHEW J

IPC: G06Q10/00 ,  G06Q30/00 ,  G06F17/60

CPC classification number: G06Q10/107 ,  G06Q30/02

Abstract: Software for use on a client device that is configured for communications via a communications network provides a communications function that effects an advertisement download communication link between the client device and an advertisement distribution server system via the communications network, at selected advertisement download times, an advertisement download function that downloads advertisements from the advertisement distribution server system via the advertisement download communication link, an advertisement storage function for storing downloaded advertisements on a storage medium associated with the client device, and an advertisement display function that effects display of one or more selected ones of the stored advertisements. Moreover, the software advantageously includes at least two operating modes, a first operating mode in which the advertisement download function is activated, and a second operating mode in which the advertisement download function is not activated.

Abstract translation: 配置用于通过通信网络进行通信的客户端设备上使用的软件提供通过功能，通过经由通信网络，在所选择的广告下载时间，在广告下载通信链接，广告下载通信链接，广告下载通信链接，广告下载时间，广告 下载功能，其通过广告下载通信链接从广告分发服务器系统下载广告;广告存储功能，用于在与客户端设备相关联的存储介质上存储下载的广告;以及广告显示功能，其显示一个或多个所选择的广告 的存储广告。 此外，软件有利地包括至少两种操作模式，其中广告下载功能被激活的第一操作模式以及广告下载功能未被激活的第二操作模式。