Abstract:
Disclosed are Si-containing thin film forming precursors, methods of synthesizing the same, and methods of using the same to deposit silicon- containing films using vapor deposition processes for manufacturing semiconductors, photovoltaics, LCD-TFT, flat panel-type devices, refractory materials, or aeronautics.
Abstract:
Disclosed are Si-containing thin film forming precursors, methods of synthesizing the same, and methods of using the same to deposit silicon-containing films using vapor deposition processes for manufacturing semiconductors, photovoltaics, LCD-TFT, flat panel-type devices, refractory materials, or aeronautics.
Abstract:
Disclosed are processes for the use of bis-ketoiminate copper precursors for the deposition of copper-containing films via Plasma Enhanced Atomic Layer Deposition (PEALD) or Plasma Enhanced Chemical Vapor Deposition (PECVD).
Abstract:
Disclosed are hafnium- and zirconium-containing precursors and methods of providing the same. The disclosed precursors include a ligand and at least one aliphatic group as substituent selected to have greater degrees of freedom than the usual substituents. The disclosed precursors may be used to deposit hafnium- or zirconium-containing layers using vapor deposition methods such as chemical vapor deposition or atomic layer deposition.
Abstract:
Disclosed herein are mono-functional silylating compounds that may exhibit enhanced silylating capabilities. Also disclosed are method of synthesizing and using these compounds. Finally methods to determine effective silylation are also disclosed.
Abstract:
Methods of storing a precursor which decreases the precursor decomposition rate. A vessel is provided, where the vessel has an outer surface made of a first material, and an inner surface made of a second material. The first and second materials are different. A tantalum containing precursor is placed inside the vessel, and the vessel is heated to a temperature between 600°C and 15O0°C. At least part of the precursor is withdrawn from the vessel.
Abstract:
Methods and compositions for depositing metal films are described herein. In general, the disclosed methods utilize precursor compounds comprising gold, silver or copper. More specifically, the disclosed precursor compounds utilize neutral ligands derived from ethylene or acetylene.
Abstract:
Methods and compositions for depositing a cobalt containing film on one or more substrates are disclosed herein. A cobalt precursor, which comprises at least one pentadienyl ligand coupled to the cobalt for thermal stability, is introduced into a reaction chamber containing one or more substrates, and the cobalt precursor is deposited to form a cobalt containing film onto the substrate.
Abstract:
Methods and compositions for depositing high-k films are disclosed herein. In general, the disclosed methods utilize precursor compounds comprising Ta or Nb. More specifically, the disclosed precursor compounds utilize certain ligands coupled to Ta and/or Nb such as 1-methoxy-2-methyl-2-propanolate (mmp) to increase volatility. Furthermore, methods of depositing Ta or Nb compounds are disclosed in conjunction with use of Hf and/or Zr precursors to deposit Ta-doped or Nb-doped Hf and/or Zr films. The methods and compositions may be used in CVD, ALD, or pulsed CVD deposition processes.
Abstract:
Novel ruthenium precursors having melting points no more than about 50°C are described herein. The disclosed ruthenium precursors may be liquids at 25°C, which enables their use without addition of a solvent and also eliminating a source of impurities. Pure ruthenium films or ruthenium containing films depending on the co-reactant used with the precursors may be obtained without detectable incubation time. Besides CVD, an ALD regime may be obtained for pure ruthenium deposition as well as for deposition of other ruthenium containing films (SrRuO 3 , RuO 2 for example).
Abstract translation:本文描述了熔点不超过约50℃的新型钌前体。 所公开的钌前体可以是在25℃下的液体,这使得它们可以在不加入溶剂的情况下使用,也可以消除杂质源。 取决于与前体一起使用的共反应物的纯钌膜或含钌膜可以在没有可检测的孵育时间的情况下获得。 除了CVD之外,可以获得纯钌沉积以及其它含钌膜(例如SrR 3 O 3,RuO 2 N 2)的沉积的ALD状态。