公开(公告)号：WO2009023649A1

公开(公告)日：2009-02-19

申请号：PCT/US2008/072835

申请日：2008-08-11

Applicant: TEXAS INSTRUMENTS INCORPORATED ,  EMBONG, Saat, Shukri ,  MOHMAD, Suhairi ,  SAID, Mohd Hanafi Bin, Mohd

Inventor： EMBONG, Saat, Shukri ,  MOHMAD, Suhairi ,  SAID, Mohd Hanafi Bin, Mohd

IPC: H01L23/48

CPC classification number: H01L21/4832 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/83 ,  H01L24/85 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4848 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/83855 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20752 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/49121 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Packaged integrated circuits (102) and methods to form a packaged integrated circuit are disclosed. A disclosed method comprises attaching an integrated circuit to a substrate, coupling a first end of a bond wire (112) directly to the substrate without an intervening bonding pad and a second end of the bond wire to a contact of the integrated circuit, encapsulating the integrated circuit and the bond wire, and removing the substrate to expose the first end of the bond wire.

Abstract translation: 公开了封装集成电路（102）和形成封装集成电路的方法。 所公开的方法包括将集成电路附接到衬底，将接合线（112）的第一端直接耦合到衬底，而没有中间接合焊盘和接合线的第二端到集成电路的接触，封装 集成电路和接合线，并且去除衬底以露出接合线的第一端。