公开(公告)号：WO2005098945A3

公开(公告)日：2006-03-02

申请号：PCT/US2005011058

申请日：2005-04-01

申请人： GEN SEMICONDUCTOR INC ,  CHOU PETER ,  DING CINDY ,  HAO ANNE

发明人： CHOU PETER ,  DING CINDY ,  HAO ANNE

IPC分类号： H01L23/495

CPC分类号： H01L24/40 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/48 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/4007 ,  H01L2224/4899 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/10155 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/37099

摘要： To provide a robust soldering process for a top finger of a surface mount device, a lead frame having a top finger and a semiconductor device having the same are disclosed, wherein the top finger comprises a groove and the groove is provided at the bottom surface of the top finger that establishes contact with a die and adjacent to the contact position between the top finger and die so as to prevent solder from overflowing onto a chip passivation ring, reducing the stress on the die and increasing the reliability.

摘要翻译： 为了提供用于表面安装器件的顶部指状物的坚固的焊接工艺，公开了具有顶部指状物的引线框架和具有其的半导体器件，其中顶部指状物包括沟槽，并且沟槽设置在 顶部指状物，其与模具建立接触并且邻近顶部指状物和管芯之间的接触位置，以防止焊料溢出到芯片钝化环上，从而减小了管芯上的应力并提高了可靠性。

公开(公告)号：WO2005098946A3

公开(公告)日：2006-07-27

申请号：PCT/US2005011181

申请日：2005-04-01

申请人： GEN SEMICONDUCTOR INC ,  CHOU PETER ,  DING CINDY ,  HAO ANNE

发明人： CHOU PETER ,  DING CINDY ,  HAO ANNE

IPC分类号： H01L23/495 ,  H01L29/40

CPC分类号： H01L24/40 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/35 ,  H01L24/37 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37099

摘要： To enhance the adhesion force between a lead frame and a molding compound of a surface mount semiconductor device, a lead frame having two opposite sides, with at least one tilt flap for locking a molding compound extending from one side and a reduced portion of the lead frame extending from the opposite side, and a surface mount semiconductor device having the same, are disclosed. The at least one tilt flap and the reduced portion are formed on the lead frame such that the adhesion force between the lead frame and the molding compound is enhanced.

摘要翻译： 为了增强引线框架和表面安装半导体器件的模塑料之间的粘附力，具有两个相对侧的引线框架，具有用于锁定从一侧延伸的模制化合物和引线的减少部分的至少一个倾斜翼片 公开了从相对侧延伸的框架和具有该框架的表面安装半导体器件。 所述至少一个倾斜翼片和所述缩小部分形成在所述引线框架上，使得所述引线框架和所述模塑料之间的粘附力增强。

公开(公告)号：WO2005098946A2

公开(公告)日：2005-10-20

申请号：PCT/US2005/011181

申请日：2005-04-01

申请人： GENERAL SEMICONDUCTOR, INC. ,  CHOU, Peter ,  DING, Cindy ,  HAO, Anne

发明人： CHOU, Peter ,  DING, Cindy ,  HAO, Anne

IPC分类号： H01L23/495

CPC分类号： H01L24/40 ,  H01L23/49551 ,  H01L23/49562 ,  H01L24/35 ,  H01L24/37 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37099

摘要： To enhance the adhesion force between a lead frame and a molding compound of a surface mount semiconductor device, a lead frame having two opposite sides, with at least one tilt flap for locking a molding compound extending from one side and a reduced portion of the lead frame extending from the opposite side, and a surface mount semiconductor device having the same, are disclosed. The at least one tilt flap and the reduced portion are formed on the lead frame such that the adhesion force between the lead frame and the molding compound is enhanced.

摘要翻译： 为了增强引线框架和表面安装半导体器件的模塑料之间的粘附力，具有两个相对侧的引线框架，具有用于锁定从一侧延伸的模制化合物和引线的减少部分的至少一个倾斜翼片 公开了从相对侧延伸的框架和具有该框架的表面安装半导体器件。 所述至少一个倾斜翼片和所述缩小部分形成在所述引线框架上，使得所述引线框架和所述模塑料之间的粘附力增强。

公开(公告)号：WO2005098945A2

公开(公告)日：2005-10-20

申请号：PCT/US2005/011058

申请日：2005-04-01

申请人： GENERAL SEMICONDUCTOR, INC. ,  CHOU, Peter ,  DING, Cindy ,  HAO, Anne

发明人： CHOU, Peter ,  DING, Cindy ,  HAO, Anne

IPC分类号： H01L23/495

CPC分类号： H01L24/40 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/48 ,  H01L2224/26145 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/37599 ,  H01L2224/4007 ,  H01L2224/4899 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/10155 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/37099

摘要： To provide a robust soldering process for a top finger of a surface mount device, a lead frame having a top finger and a semiconductor device having the same are disclosed, wherein the top finger comprises a groove and the groove is provided at the bottom surface of the top finger that establishes contact with a die and adjacent to the contact position between the top finger and die so as to prevent solder from overflowing onto a chip passivation ring, reducing the stress on the die and increasing the reliability.

摘要翻译： 为了提供用于表面安装器件的顶部手指的坚固的焊接工艺，公开了具有顶部指状物的引线框架和具有其的半导体器件，其中顶部指状物包括沟槽，并且沟槽设置在 顶部指状物，其与模具建立接触并且邻近顶部指状物和管芯之间的接触位置，以防止焊料溢出到芯片钝化环上，从而减小了管芯上的应力并提高了可靠性。