公开(公告)号：WO2012151002A1

公开(公告)日：2012-11-08

申请号：PCT/US2012/028738

申请日：2012-03-12

Applicant: TESSERA, INC. ,  SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

Inventor： SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly (210) includes a substrate (212) having a first surface (214) and a second surface (216) remote from the first surface (214). A microelectronic element (222) overlies the first surface (214) and first electrically conductive elements (228) are exposed at one of the first surface (214) and the second surface (222). Some of the first conductive elements (228) are electrically connected to the microelectronic element (222). Wire bonds (232) have bases (234) joined to the conductive elements (228) and end surfaces (238) remote from the substrate (212) and the bases (234), each wire bond (232) defining an edge surface (237) extending between the base (234) and the end surface (238). An encapsulation layer (242) extends from the first surface (214) and fills spaces between the wire bonds (232) such that the wire bonds (232) are separated by the encapsulation layer (242). Unencapsulated portions of the wire bonds (232) are defined by at least portions of the end surfaces (238) of the wire bonds that are uncovered by the encapsulation layer (242).

Abstract translation: 微电子组件（210）包括具有远离第一表面（214）的第一表面（214）和第二表面（216）的基底（212）。 微电子元件（222）覆盖在第一表面（214）上，并且第一导电元件（228）在第一表面（214）和第二表面（222）之一处露出。 第一导电元件（228）中的一些电连接到微电子元件（222）。 线接合件（232）具有接合到导电元件（228）的基底（234）和远离基底（212）和基底（234）的端面（238），每个线接合（232）限定边缘表面（237） ）在所述基座（234）和所述端面（238）之间延伸。 封装层（242）从第一表面（214）延伸并填充引线键合（232）之间的空间，使得引线键合（232）由封装层（242）分离。 引线键合（232）的未封装部分由未被封装层（242）覆盖的引线接合的至少部分（238）限定。