公开(公告)号：WO2012151002A1

公开(公告)日：2012-11-08

申请号：PCT/US2012/028738

申请日：2012-03-12

Applicant: TESSERA, INC. ,  SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

Inventor： SATO, Hiroaki ,  KANG, Teck-Gyu ,  HABA, Belgacem ,  OSBORN, Philip, R. ,  WANG, Wei-Shun ,  CHAU, Ellis ,  MOHAMMED, Ilyas ,  MASUDA, Norihito ,  SAKUMA, Kazuo ,  HASHIMOTO, Kiyoaki ,  INETARO, Kurosawa ,  KIKUCHI, Tomoyuki

IPC: H01L25/10 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L25/043 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2224/17179 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48464 ,  H01L2224/49105 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic assembly (210) includes a substrate (212) having a first surface (214) and a second surface (216) remote from the first surface (214). A microelectronic element (222) overlies the first surface (214) and first electrically conductive elements (228) are exposed at one of the first surface (214) and the second surface (222). Some of the first conductive elements (228) are electrically connected to the microelectronic element (222). Wire bonds (232) have bases (234) joined to the conductive elements (228) and end surfaces (238) remote from the substrate (212) and the bases (234), each wire bond (232) defining an edge surface (237) extending between the base (234) and the end surface (238). An encapsulation layer (242) extends from the first surface (214) and fills spaces between the wire bonds (232) such that the wire bonds (232) are separated by the encapsulation layer (242). Unencapsulated portions of the wire bonds (232) are defined by at least portions of the end surfaces (238) of the wire bonds that are uncovered by the encapsulation layer (242).

Abstract translation: 微电子组件（210）包括具有远离第一表面（214）的第一表面（214）和第二表面（216）的基底（212）。 微电子元件（222）覆盖在第一表面（214）上，并且第一导电元件（228）在第一表面（214）和第二表面（222）之一处露出。 第一导电元件（228）中的一些电连接到微电子元件（222）。 线接合件（232）具有接合到导电元件（228）的基底（234）和远离基底（212）和基底（234）的端面（238），每个线接合（232）限定边缘表面（237） ）在所述基座（234）和所述端面（238）之间延伸。 封装层（242）从第一表面（214）延伸并填充引线键合（232）之间的空间，使得引线键合（232）由封装层（242）分离。 引线键合（232）的未封装部分由未被封装层（242）覆盖的引线接合的至少部分（238）限定。

公开(公告)号：WO2007075727A3

公开(公告)日：2007-08-23

申请号：PCT/US2006048499

申请日：2006-12-20

Applicant: TESSERA INC ,  HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

Inventor： HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a microelectronic assembly includes providing a microelectronic package having a substrate 400, a microelectronic element 410 overlying the substrate 400 and at least two conductive elements 418 projecting from a surface 402 of the substrate 400, the at least two conductive elements 418 having surfaces 434 remote from the surface 402 of the substrate 400. The method includes compressing the at least two conductive elements 418 so that the remote surfaces 434 thereof lie in a common plane, and after the compressing step, providing an encapsulant material 430 around the at least two conductive elements 418 for supporting the microelectronic package and so that the remote surfaces 434 of the at least two conductive elements 418 remain accessible at an exterior surface of the encapsulant material 430.

Abstract translation: 制造微电子组件的方法包括提供具有衬底400的微电子封装，覆盖衬底400的微电子元件410和从衬底400的表面402突出的至少两个导电元件418，所述至少两个导电元件418具有 表面434远离衬底400的表面402.该方法包括压缩至少两个导电元件418，使得它们的远端表面434位于公共平面中，并且在压缩步骤之后，围绕着该位置提供密封材料430 至少两个用于支撑微电子封装的导电元件418，并且使得至少两个导电元件418的远端表面434在密封剂材料430的外表面保持可访问。

公开(公告)号：WO2007075727A2

公开(公告)日：2007-07-05

申请号：PCT/US2006/048499

申请日：2006-12-20

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  KANG, Teck-Gyu ,  MOHAMMED, Ilyas ,  CHAU, Ellis

Inventor： HABA, Belgacem ,  KANG, Teck-Gyu ,  MOHAMMED, Ilyas ,  CHAU, Ellis

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a microelectronic assembly includes providing a microelectronic package having a substrate 400, a microelectronic element 410 overlying the substrate 400 and at least two conductive elements 418 projecting from a surface 402 of the substrate 400, the at least two conductive elements 418 having surfaces 434 remote from the surface 402 of the substrate 400. The method includes compressing the at least two conductive elements 418 so that the remote surfaces 434 thereof lie in a common plane, and after the compressing step, providing an encapsulant material 430 around the at least two conductive elements 418 for supporting the microelectronic package and so that the remote surfaces 434 of the at least two conductive elements 418 remain accessible at an exterior surface of the encapsulant material 430.

Abstract translation: 制造微电子组件的方法包括提供具有衬底400，覆盖衬底400的微电子元件410和从衬底400的表面402突出的至少两个导电元件418的微电子封装， 该至少两个导电元件418具有远离衬底400的表面402的表面434.该方法包括压缩该至少两个导电元件418，使得其远程表面434位于公共平面内，并且在压缩步骤之后， 在至少两个导电元件418周围提供用于支撑微电子封装的密封剂材料430，并且使得至少两个导电元件418的远程表面434在密封剂材料430的外表面处保持可接近。

公开(公告)号：WO2012061199A3

公开(公告)日：2012-06-28

申请号：PCT/US2011058080

申请日：2011-10-27

Applicant: TESSERA INC ,  HABA BELGACEM ,  MOHAMMED ILYAS ,  CHAU ELLIS ,  LEE SANG II ,  DESAI KISHOR

Inventor： HABA BELGACEM ,  MOHAMMED ILYAS ,  CHAU ELLIS ,  LEE SANG II ,  DESAI KISHOR

IPC: H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1601 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for making a microelectronic assembly includes providing a microelectronic element 30 with first conductive elements and a dielectric element 50 with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts 40 and other of the first or second conductive elements may include a bond metal 10 disposed between some of the conductive posts 40. An underfill layer 60 may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer 60 and at least deform the bond metal 10. The microelectronic element 30 and the dielectric element 50 can be heated to join them together. The height of the posts 40 above the surface may be at least forty percent of a distance between surfaces of the microelectronic element 30 and dielectric element 50.

Abstract translation: 制造微电子组件的方法包括：将微电子元件30提供有第一导电元件和具有第二导电元件的电介质元件50。 第一导电元件或第二导电元件中的至少一些可以是导电柱40，并且第一或第二导电元件中的另一个可以包括设置在一些导电柱40之间的接合金属10.底部填充层60可能过度一些 的第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得支柱刺穿底部填充层60并且至少使接合金属10变形。微电子元件30和电介质元件50可被加热到 一起加入 表面上方的柱40的高度可以是微电子元件30和电介质元件50的表面之间的距离的至少40％。

公开(公告)号：WO2008021575A3

公开(公告)日：2008-07-10

申请号：PCT/US2007018521

申请日：2007-08-16

Applicant: TESSERA INC ,  MOHAMMED ILYAS ,  HABA BELGACEM ,  MORAN SEAN ,  WANG WEI-SHUN ,  CHAU ELLIS ,  WADE CHRISTOPHER

Inventor： MOHAMMED ILYAS ,  HABA BELGACEM ,  MORAN SEAN ,  WANG WEI-SHUN ,  CHAU ELLIS ,  WADE CHRISTOPHER

IPC: H01L25/065 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L25/105 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00011

Abstract: A microelectronic package includes a lower unit 11 OA having a lower unit substrate with conductive features and a top and bottom surface 64, 66. The lower unit IIOA includes., one or more lower unit chips 112A, 132A overlying the top surface 64 of the' lower unit substrate 62 that are electrically connected to the conductive features 68, 70 of the lower unit substrate 62. The microelectronic package also includes an upper unit 110 including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips 112, 132 overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole 76.

Abstract translation: 微电子封装包括具有导电特征的下部单元基板和顶部和底部表面64,66的下部单元110A。下部单元IIOA包括一个或多个下部单元芯片112A，132A，其位于 下部单元基板62电连接到下部单元基板62的导电特征68,70。微电子封装还包括上部单元110，上部单元110包括具有导电特征的上部单元基板，顶部和底部表面以及在 这样的顶面和底面。 上部单元还包括一个或多个上部单元芯片112,132，其覆盖在上部单元基板的顶表面上，并且通过在孔76内延伸的连接与上部单元基板的导电特征电连接。

公开(公告)号：WO2012061199A2

公开(公告)日：2012-05-10

申请号：PCT/US2011/058080

申请日：2011-10-27

Applicant: TESSERA, INC. ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  CHAU, Ellis ,  LEE, Sang II ,  DESAI, Kishor

Inventor： HABA, Belgacem ,  MOHAMMED, Ilyas ,  CHAU, Ellis ,  LEE, Sang II ,  DESAI, Kishor

IPC: H01L21/56

CPC classification number: H01L23/49811 ,  H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/1601 ,  H01L2224/1605 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81143 ,  H01L2224/81193 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8349 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method for making a microelectronic assembly includes providing a microelectronic element 30 with first conductive elements and a dielectric element 50 with second conductive elements. At least some of either the first conductive elements or the second conductive elements may be conductive posts 40 and other of the first or second conductive elements may include a bond metal 10 disposed between some of the conductive posts 40. An underfill layer 60 may overly some of the first or second conductive elements. At least one of the first conductive elements may be moved towards the other of the second conductive elements so that the posts pierce the underfill layer 60 and at least deform the bond metal 10. The microelectronic element 30 and the dielectric element 50 can be heated to join them together. The height of the posts 40 above the surface may be at least forty percent of a distance between surfaces of the microelectronic element 30 and dielectric element 50.

Abstract translation: 制造微电子组件的方法包括提供具有第一导电元件的微电子元件30和具有第二导电元件的电介质元件50。 第一导电元件或第二导电元件中的至少一些可以是导电柱40，并且第一导电元件或第二导电元件中的另一个可以包括设置在一些导电柱40之间的键合金属10.底部填充层60可以过多地 的第一或第二导电元件。 第一导电元件中的至少一个可以朝向第二导电元件中的另一个移动，使得柱刺穿底部填充层60并且至少使键合金属10变形。微电子元件30和介电元件50可以被加热到 加入他们在一起。 在表面之上的柱40的高度可以是微电子元件30和电介质元件50的表面之间的距离的至少百分之四十。

公开(公告)号：WO2008021575A2

公开(公告)日：2008-02-21

申请号：PCT/US2007/018521

申请日：2007-08-16

Applicant: TESSERA, INC. ,  MOHAMMED, Ilyas ,  HABA, Belgacem ,  MORAN, Sean ,  WANG, Wei-shun ,  CHAU, Ellis ,  WADE, Christopher

Inventor： MOHAMMED, Ilyas ,  HABA, Belgacem ,  MORAN, Sean ,  WANG, Wei-shun ,  CHAU, Ellis ,  WADE, Christopher

IPC: H01L25/065 ,  H01L25/10 ,  H01L23/31

CPC classification number: H01L25/105 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00011

Abstract: A microelectronic package includes a lower unit 110A having a lower unit substrate with conductive features and a top and bottom surface 64, 66. The lower unit 110A includes., one or more lower unit chips 112A, 132A overlying the top surface 64 of the lower unit substrate 62 that are electrically connected to the conductive features 68 of the lower unit substrate 62. The microelectronic package also includes an upper unit 110 including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips 112, 132 overlying the top surface of the upper unit substrate and electrically connected to the conductive features 141 of the upper unit substrate by connections extending within the hole 76.

Abstract translation: 微电子封装包括具有导电特征的下部单元基板和顶部和底部表面64,66的下部单元110A。下部单元110A包括覆盖下部单元110的顶表面64的一个或多个下部单元芯片112A，132A 单元基板62，其电连接到下单元基板62的导电特征部68.微电子封装还包括上单元110，上单元110包括具有导电特征的上单元基板，顶表面和底表面以及在该顶部和底部之间延伸的孔 表面。 上部单元还包括一个或多个上部单元芯片112,132，其覆盖在上部单元基板的顶表面上，并且通过在孔76内延伸的连接电连接到上部单元基板的导电特征141。