公开(公告)号：WO2014018212A1

公开(公告)日：2014-01-30

申请号：PCT/US2013/047970

申请日：2013-06-26

Applicant: APPLIED MATERIALS, INC. ,  RANISH, Joseph M. ,  HUNTER, Aaron Muir

Inventor： RANISH, Joseph M. ,  HUNTER, Aaron Muir

IPC: H01L21/02 ,  H05K7/20

CPC classification number: F25B29/00 ,  C23C14/541 ,  C23C16/4411 ,  C23C16/46 ,  H01L21/67115

Abstract: Embodiments of the present invention provide a heating assembly using a heat exchange device to cool a plurality of heating element. The heating assembly includes a plurality of heating elements, a cooling element having one or more cooling channels for receiving cooling fluid therein, and a heat exchange device disposed between the plurality of heating elements and the cooling element. The heat exchange device comprises a hot interface disposed adjacent to and in thermal contact with the plurality of heating elements and a cold interface disposed adjacent to and in thermal contact with the cooling element.

Abstract translation: 本发明的实施例提供了一种使用热交换装置来冷却多个加热元件的加热组件。 加热组件包括多个加热元件，具有用于接收冷却流体的一个或多个冷却通道的冷却元件和设置在多个加热元件和冷却元件之间的热交换器件。 所述热交换装置包括邻近所述多个加热元件设置并与所述多个加热元件热接触的热界面以及与所述冷却元件相邻并与其接触的冷界面。

公开(公告)号：WO2013181263A1

公开(公告)日：2013-12-05

申请号：PCT/US2013/043133

申请日：2013-05-29

Applicant: APPLIED MATERIALS, INC. ,  LAWRENCE LIVERMORE NATIONAL SECURITY, LLC ,  RANISH, Joseph M. ,  HUNTER, Aaron Muir ,  SOULES, Thomas F. ,  RUBENCHIK, Alexander M.

Inventor： RANISH, Joseph M. ,  HUNTER, Aaron Muir ,  SOULES, Thomas F. ,  RUBENCHIK, Alexander M.

IPC: H01L21/324 ,  H01L21/02

CPC classification number: H05B3/00 ,  H01L21/268 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/68792 ,  Y10S148/09 ,  Y10S148/093

Abstract: Embodiments of the present invention provide apparatus and methods for performing rapid thermal processing. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes a heating source disposed outside a chamber body and configured to provide thermal energy towards a processing volume. The substrate support defines a substrate supporting plane, and the substrate support is configured to support the substrate in the substrate supporting plane. The heating source includes a frame member having an inner wall surrounding an area large enough to encompass a surface area of the substrate, and a plurality of diode laser tiles mounted on the inner wall of the frame member. Each of the plurality of diode laser tiles is directed towards a corresponding area in the processing volume.

Abstract translation: 本发明的实施例提供了用于执行快速热处理的装置和方法。 本发明的一个实施例提供一种用于处理衬底的装置。 该设备包括设置在室主体外部并被配置为朝向处理容积提供热能的加热源。 衬底支撑件限定衬底支撑平面，并且衬底支撑件构造成在衬底支撑平面中支撑衬底。 加热源包括框架构件，该框架构件具有包围足以包围基板的表面区域的区域的内壁和安装在框架构件的内壁上的多个二极管激光瓦片。 多个二极管激光瓦片中的每一个朝向处理体积中的相应区域。

公开(公告)号：WO2013112313A1

公开(公告)日：2013-08-01

申请号：PCT/US2013/021470

申请日：2013-01-14

Applicant: APPLIED MATERIALS, INC. ,  SEREBRYANOV, Oleg ,  RANISH, Joseph M. ,  HUNTER, Aaron Muir

Inventor： SEREBRYANOV, Oleg ,  RANISH, Joseph M. ,  HUNTER, Aaron Muir

IPC: H01L21/324 ,  H01L21/02

CPC classification number: H01L21/68764 ,  F27B17/0025 ,  F27D11/00 ,  H01L21/324 ,  H01L21/67115 ,  H01L21/68785 ,  H05B3/0047

Abstract: Embodiments of the present invention provide thermal processing chambers including a drive mechanism and a heating assembly disposed on opposite sides of a substrate support assembly. Particularly, the heating assembly is disposed below the substrate support assembly to process a substrate with a device side facing up and the drive mechanism is disposed above the substrate assembly.

Abstract translation: 本发明的实施例提供了热处理室，其包括设置在基板支撑组件的相对侧上的驱动机构和加热组件。 特别地，加热组件设置在基板支撑组件下方以处理基板，其中装置侧朝上并且驱动机构设置在基板组件上方。

公开(公告)号：WO2012115907A3

公开(公告)日：2013-01-24

申请号：PCT/US2012025818

申请日：2012-02-20

Applicant: APPLIED MATERIALS INC ,  KOELMEL BLAKE ,  RANISH JOSEPH M ,  MAYUR ABHILASH J

Inventor： KOELMEL BLAKE ,  RANISH JOSEPH M ,  MAYUR ABHILASH J

IPC: H01L21/683 ,  G02F1/13 ,  H01L21/324

CPC classification number: H01L21/67346 ,  F27D5/0037 ,  F27D11/12 ,  F27D2005/0081 ,  H01L21/67115 ,  H01L21/68735

Abstract: Embodiments of the present invention provide an edge ring for supporting a substrate with increased temperature uniformity. More particularly, embodiments of the present invention provide an edge ring having one or more surface area increasing structures formed on an energy receiving surface of the edge ring.

Abstract translation: 本发明的实施例提供了一种用于支撑具有增加的温度均匀性的基板的边缘环。 更具体地，本发明的实施例提供一种边缘环，其具有形成在边缘环的能量接收表面上的一个或多个表面积增加结构。

公开(公告)号：WO2009137773A2

公开(公告)日：2009-11-12

申请号：PCT/US2009043305

申请日：2009-05-08

Applicant: APPLIED MATERIALS INC ,  RANISH JOSEPH M ,  SORABJI KHURSHED ,  LERNER ALEXANDER N ,  HUNTER AARON M

Inventor： RANISH JOSEPH M ,  SORABJI KHURSHED ,  LERNER ALEXANDER N ,  HUNTER AARON M

IPC: H01L21/324

CPC classification number: H01L21/324 ,  H01L21/67115 ,  H01L21/67248

Abstract: Methods and apparatus for hyperbaric rapid thermal processing of a substrate are described. Methods of processing a substrate in a rapid thermal processing chamber are described that include passing a substrate from outside the chamber through an access port onto a support in the interior region of the processing chamber, closing a port door sealing the chamber, pressurizing the chamber to a pressure greater than 1.5 atmospheres absolute and directing radiant energy toward the substrate. Hyperbaric rapid thermal processing chambers are described which are constructed to withstand pressures greater than at least about 1.5 atmospheres absolute or, optionally, 2 atmospheres of absolute pressure. Processing chambers may include pressure control valves to control the pressure within the chamber.

Abstract translation: 描述了用于衬底高压快速热处理的方法和装置。 描述了在快速热处理室中处理基板的方法，其包括将基板从室外通过进入端口传送到处理室的内部区域中的支撑件上，关闭密封该室的端口门，将该室加压至 绝对压力大于1.5个大气压，并将辐射能量引向基板。 描述了高压快速热处理室，其被构造为承受大于至少约1.5大气压绝对压力或任选地大气压绝压的压力。 处理室可以包括压力控制阀，以控制室内的压力。

公开(公告)号：WO2009105599A1

公开(公告)日：2009-08-27

申请号：PCT/US2009/034614

申请日：2009-02-20

Applicant: APPLIED MATERIALS, INC. ,  RANISH, Joseph M. ,  CHURTON, Kelly ,  LINDSAY, Mark E. ,  PLESHA, Mischa Ann ,  BERTA, Sage

Inventor： RANISH, Joseph M. ,  CHURTON, Kelly ,  LINDSAY, Mark E. ,  PLESHA, Mischa Ann ,  BERTA, Sage

IPC: H01L21/324 ,  H01L21/02

CPC classification number: H01L21/324 ,  H01L21/67017 ,  H01L21/67098 ,  H01L21/67115

Abstract: A silver reflector for reflecting radiation from a lamp in a semiconductor processing chamber is disclosed. The reflector may be a sleeve to be disposed in a lightpipe or part of a lamphead. The silver may be in the form of a coating on the sleeve or the lamphead.

Abstract translation: 公开了一种用于在半导体处理室中反射来自灯的辐射的银反射器。 反射器可以是套筒以设置在光管或灯头的一部分中。 银可以是套筒或灯头上的涂层形式。

公开(公告)号：WO2009094275A3

公开(公告)日：2009-07-30

申请号：PCT/US2009/030996

申请日：2009-01-14

Applicant: APPLIED MATERIALS, INC. ,  KOELMEL, Blake ,  LERNER, Alexander, N. ,  RANISH, Joseph, M. ,  SANGAM, Kedarnath ,  SORABJI, Khurshed

Inventor： KOELMEL, Blake ,  LERNER, Alexander, N. ,  RANISH, Joseph, M. ,  SANGAM, Kedarnath ,  SORABJI, Khurshed

IPC: H01L21/683 ,  H01L21/687 ,  H01L21/205 ,  H01L21/324

Abstract: Embodiments of the invention contemplate a method, apparatus and system that are used to support, position, and rotate a substrate during processing. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein remove the need for complex, costly and often unreliable components that would be required to accurately position and rotate a substrate during one or more processing steps, such as an rapid thermal processing (RTP) process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, atomic layer deposition (ALD) process, dry etching process, wet clean, and/or laser annealing process.

公开(公告)号：WO2013162712A1

公开(公告)日：2013-10-31

申请号：PCT/US2013/029344

申请日：2013-03-06

Applicant: APPLIED MATERIALS, INC. ,  RANISH, Joseph M.

Inventor： RANISH, Joseph M.

IPC: H01L21/205 ,  H01L21/324 ,  H01L21/02

CPC classification number: H01L21/02104 ,  G02B17/002 ,  H01L21/67115

Abstract: Embodiments described herein generally relate to apparatus for heating substrates. The apparatus generally include a process chamber having a substrate support therein. A plurality of lamps is positioned to provide radiant energy through an optically transparent dome to a substrate positioned on the substrate support. A light focusing assembly is positioned within the chamber to influence heating and temperature distribution on the substrate and to facilitate formation of a film on a substrate having uniform properties, such as density. The light focusing assembly can include one or more reflectors, light pipes, or refractive lenses.

Abstract translation: 本文描述的实施例一般涉及用于加热衬底的装置。 该设备通常包括其中具有衬底支撑件的处理室。 多个灯被定位成通过光学透明的圆顶将辐射能提供给位于基板支撑件上的基板。 光聚焦组件位于腔室内以影响衬底上的加热和温度分布，并且有助于在具有均匀性质如密度的衬底上形成膜。 光聚焦组件可以包括一个或多个反射器，光管或折射透镜。

公开(公告)号：WO2012166313A4

公开(公告)日：2013-03-14

申请号：PCT/US2012037311

申请日：2012-05-10

Applicant: APPLIED MATERIALS INC ,  KOELMEL BLAKE ,  RANISH JOSEPH M ,  SANCHEZ ERROL C

Inventor： KOELMEL BLAKE ,  RANISH JOSEPH M ,  SANCHEZ ERROL C

IPC: H01L21/68

CPC classification number: H01L21/68 ,  H01L21/67115 ,  H01L21/67259

Abstract: Embodiments of the present invention provide apparatus and methods for positioning a substrate in a processing chamber using capacitive sensors. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes first and second capacitive sensors disposed in an inner volume. The first capacitive sensor is positioned to detect a location of an edge of the substrate at a first angular location. The second capacitive sensor is positioned to detect a vertical position of the substrate.

Abstract translation: 本发明的实施例提供使用电容传感器将衬底定位在处理室中的设备和方法。 本发明的一个实施例提供了一种用于处理基板的设备。 该装置包括设置在内部容积中的第一和第二电容式传感器。 第一电容式传感器被定位成在第一角度位置处检测衬底的边缘的位置。 第二电容式传感器定位成检测基板的垂直位置。

公开(公告)号：WO2012166313A2

公开(公告)日：2012-12-06

申请号：PCT/US2012/037311

申请日：2012-05-10

Applicant: APPLIED MATERIALS, INC. ,  KOELMEL, Blake ,  RANISH, Joseph M. ,  SANCHEZ, Errol C.

Inventor： KOELMEL, Blake ,  RANISH, Joseph M. ,  SANCHEZ, Errol C.

IPC: H01L21/68

CPC classification number: H01L21/68 ,  H01L21/67115 ,  H01L21/67259

Abstract: Embodiments of the present invention provide apparatus and methods for positioning a substrate in a processing chamber using capacitive sensors. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus includes first and second capacitive sensors disposed in an inner volume. The first capacitive sensor is positioned to detect a location of an edge of the substrate at a first angular location. The second capacitive sensor is positioned to detect a vertical position of the substrate.

Abstract translation: 本发明的实施例提供了使用电容式传感器将衬底定位在处理室中的装置和方法。 本发明的一个实施例提供一种用于处理衬底的装置。 该装置包括设置在内部容积中的第一和第二电容传感器。 第一电容传感器被定位成在第一角度位置处检测衬底的边缘的位置。 第二电容传感器被定位成检测基板的垂直位置。