公开(公告)号：WO2006028942A3

公开(公告)日：2006-06-15

申请号：PCT/US2005031239

申请日：2005-09-01

Applicant: EASTMAN KODAK CO ,  RICKS THEODORE K ,  SHARMA RAVI

Inventor： RICKS THEODORE K ,  SHARMA RAVI

IPC: H01L21/98 ,  H01L23/34

CPC classification number: H01L24/95 ,  H01L23/345 ,  H01L24/86 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/532 ,  H01L2924/15153

Abstract: A support (60) and a method for assembling micro-components (80, 84) to binding sites (62, 64, 66, 68) on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid (72) is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid (73) having first micro-components (80) adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas (92, 94) proximate to the selected binding sites (62, 66) so as to inhibit first micro-components from engaging the binding sites (62, 66) .

Abstract translation: 提供支撑件（60）以及用于将微组件（80,84）组装到支撑件上的结合部位（62,64,66,68）的方法。 支撑件具有适于在结合位点之间传导电能的电导体图案。 根据该方法，电信号通过包括至少一个导体的至少一个导电路径，使得靠近结合位点的每个导电路径的一部分产生热量，施加第一流体（72） 适于在加热时适于增加粘度的载体，并且具有适于接合结合位点的具有第一微组件（80）的载体流体（73）施加到载体上。 其中来自至少一个导电路径的热量增加了靠近所选择的结合位点（62,66）的区域（92,94）中的第一流体的粘度，以便抑制第一微量组分与结合位点（62 ，66）。

公开(公告)号：WO2006028942A2

公开(公告)日：2006-03-16

申请号：PCT/US2005/031239

申请日：2005-09-01

Applicant: EASTMAN KODAK COMPANY ,  RICKS, Theodore K. ,  SHARMA, Ravi

Inventor： RICKS, Theodore K. ,  SHARMA, Ravi

IPC: H01L21/98 ,  H01L23/34

CPC classification number: H01L24/95 ,  H01L23/345 ,  H01L24/86 ,  H01L25/50 ,  H01L2224/95085 ,  H01L2224/95136 ,  H01L2224/95145 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15155 ,  H01L2924/15165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/532 ,  H01L2924/15153

Abstract: A support and a method for assembling micro-components to binding sites on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid having first micro-components adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas proximate to the selected binding sites so as to inhibit first micro-components from engaging the binding sites.

Abstract translation: 提供了一种用于将微组件组装到载体上的结合位点的支撑体和方法。 支撑件具有适于在结合位点之间传导电能的电导体图案。 根据该方法，电信号通过包括至少一个导体的至少一个导电路径，使得靠近结合位点的每个导电路径的一部分产生热量，第一流体被施加到支撑件 其适于在加热时增加粘度，并且具有适于接合结合位点的具有第一微量组分的载体流体被施加到载体上。 其中来自至少一个导电路径的热量增加了接近所选结合位点的区域中第一流体的粘度，以便抑制第一微组件接合结合位点。