公开(公告)号：WO2013036394A2

公开(公告)日：2013-03-14

申请号：PCT/US2012052524

申请日：2012-08-27

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  STEPHANOU PHILIP JASON ,  LONDERGAN ANA RANGELOVA ,  GOUSEV EVGENI PETROVICH ,  SHENOY RAVINDRA VAMAN

Inventor： STEPHANOU PHILIP JASON ,  LONDERGAN ANA RANGELOVA ,  GOUSEV EVGENI PETROVICH ,  SHENOY RAVINDRA VAMAN

IPC: B81C1/00

CPC classification number: B81C1/0038 ,  B81B2203/0392 ,  B81C2201/0107 ,  B81C2201/0188 ,  B81C2201/038 ,  C23C18/1653 ,  C25D5/10 ,  C25D5/18 ,  C25D5/48 ,  C25D7/00 ,  Y10T428/12493 ,  Y10T428/24612

Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.

Abstract translation: 本公开提供了高表面积堆叠分层金属结构，器件，装置，系统和相关方法的实现。 基板上的多个堆叠层可以由包含第一金属和第二金属的电镀槽制造。 调制的电镀电流可沉积交替的第一金属层和合金层，合金层包括第一金属和第二金属。 可以通过选择性地蚀刻第一金属层的一些部分以限定堆叠的分层结构来形成合金层之间的间隙。 堆叠分层结构可用于形成电容器，电感器，催化反应器，传热管，非线性弹簧，过滤器，电池和重金属净化器的应用。

公开(公告)号：WO2013036394A3

公开(公告)日：2013-03-14

申请号：PCT/US2012/052524

申请日：2012-08-27

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  STEPHANOU, Philip Jason ,  LONDERGAN, Ana Rangelova ,  GOUSEV, Evgeni Petrovich ,  SHENOY, Ravindra Vaman

Inventor： STEPHANOU, Philip Jason ,  LONDERGAN, Ana Rangelova ,  GOUSEV, Evgeni Petrovich ,  SHENOY, Ravindra Vaman

IPC: B81C1/00 ,  C25D5/10 ,  C25D5/18 ,  C23C28/02

Abstract: This disclosure provides implementations of high surface area stacked layered metallic structures, devices, apparatus, systems, and related methods. A plurality of stacked layers on a substrate may be manufactured from a plating bath including a first metal and a second metal. A modulated plating current can deposit alternate first metal layers and alloy layers, the alloy layers including the first metal and the second metal. Gaps between the alloy layers can be formed by selectively etching some portions of the first metal layers to define a stacked layered structure. Stacked layered structures may be useful in applications to form capacitors, inductors, catalytic reactors, heat transfer tubes, non-linear springs, filters, batteries, and heavy metal purifiers.

公开(公告)号：WO2012125481A2

公开(公告)日：2012-09-20

申请号：PCT/US2012028551

申请日：2012-03-09

Applicant: QUALCOMM MEMS TECHNOLOGIES INC ,  BURNS DAVID WILLIAM ,  SHENOY RAVINDRA VAMAN

Inventor： BURNS DAVID WILLIAM ,  SHENOY RAVINDRA VAMAN

IPC: B81B1/00

CPC classification number: B81C1/00095 ,  H01L2924/0002 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/42 ,  H05K2201/09854 ,  H05K2203/025 ,  H05K2203/1572 ,  Y10T29/49165 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.

Abstract translation: 本公开提供了通过玻璃基板提供电连接的系统，方法和装置。 在一个方面，提供了一种包括透玻璃通孔的薄膜贯穿玻璃通孔和共形地涂覆透玻璃通孔的侧壁的薄导电膜。 透玻璃通孔的轮廓可以包括在玻璃的中间部分重叠的凹部，其中贯通玻璃通孔侧壁向内弯曲以形成凹部。 在另一方面，提供一种或多种形成透玻璃通孔的方法。 在一些实施方案中，所述方法包括双面工艺以在玻璃基板中形成对准的通孔，其一起形成轮廓的贯穿玻璃通孔，随后沉积导电材料的薄的连续膜。

公开(公告)号：WO2011136960A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/032869

申请日：2011-04-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  STEPHANOU, Philip, Jason ,  BURNS, David, William ,  SHENOY, Ravindra, Vaman

Inventor： STEPHANOU, Philip, Jason ,  BURNS, David, William ,  SHENOY, Ravindra, Vaman

IPC: G01P15/125 ,  G01P15/18 ,  G01P15/08

CPC classification number: G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using accelerometers. Some such accelerometers include a substrate, a first plurality of electrodes, a second plurality of electrodes, a first anchor attached to the substrate, a frame and a proof mass. The substrate may extend substantially in a first plane. The proof mass may be attached to the frame, may extend substantially in a second plane and may be substantially constrained for motion along first and second axes. The frame may be attached to the first anchor, may extend substantially in a second plane and may be substantially constrained for motion along the second axis. A lateral movement of the proof mass in response to an applied lateral acceleration along the first or second axes may result in a change in capacitance at the first or second plurality of electrodes.

Abstract translation: 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用加速度计的计算机程序。 一些这样的加速度计包括基板，第一多个电极，第二多个电极，附接到基板的第一锚固件，框架和检验块。 衬底可以基本上在第一平面中延伸。 检测块可以附接到框架，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第一和第二轴线的运动。 框架可以附接到第一锚固件，可以基本上在第二平面中延伸，并且可以基本上被约束用于沿着第二轴线的运动。 响应于沿着第一或第二轴的施加的横向加速度，检测质量块的横向移动可能导致第一或第二多个电极处的电容变化。

公开(公告)号：WO2013003078A1

公开(公告)日：2013-01-03

申请号：PCT/US2012/042783

申请日：2012-06-15

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  SHENOY, Ravindra, Vaman ,  GOUSEV, Evgeni, P.

Inventor： SHENOY, Ravindra, Vaman ,  GOUSEV, Evgeni, P.

IPC: G02B26/00 ,  G02B26/08 ,  B81B7/00 ,  H05K3/00 ,  G09G3/34

CPC classification number: G02B26/001 ,  B81B2203/0353 ,  B81B2207/096 ,  B81C1/00301 ,  G02B26/0816 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/73204 ,  H01L2924/12044 ,  H01L2924/1461 ,  Y10T428/24322 ,  Y10T428/24331 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for bonding a device substrate formed of a substantially transparent material to a carrier substrate. A laser etch stop layer may be formed on the device substrate. The carrier substrate may be coated with a releasable layer, such as a polymer layer. Vias may be formed in the device substrate by laser drilling. The vias may be filled with conductive material, e.g., by electroplating or by filling the vias with a conductive paste. One or more types of devices may then be attached to the device substrate and configured for electrical communication with the vias. In some implementations, passive devices may be formed on the device substrate before the vias are formed. Before or after device fabrication, the substrates may be separated. The substrates may be separated by laser irradiation or chemical dissolution of the releasable layer.

Abstract translation: 本公开提供了用于将由基本上透明的材料形成的器件衬底接合到载体衬底的系统，方法和装置。 激光蚀刻停止层可以形成在器件衬底上。 载体基底可以涂覆有可释放层，例如聚合物层。 可以通过激光钻孔在器件衬底中形成通孔。 通孔可以用导电材料填充，例如通过电镀或通过用导电浆填充通孔。 然后可以将一种或多种类型的设备附接到设备基板并且被配置为与通孔电气通信。 在一些实施方案中，可以在形成通孔之前在器件衬底上形成无源器件。 在器件制造之前或之后，可以分离衬底。 可以通过激光照射或可释放层的化学溶解来分离基板。

公开(公告)号：WO2012125503A1

公开(公告)日：2012-09-20

申请号：PCT/US2012/028624

申请日：2012-03-09

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC., ,  BLACK, Justin, Phelps ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  PETERSEN, Kurt, Edward ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BUCHAN, Nicholas, Ian

Inventor： BLACK, Justin, Phelps ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason ,  PETERSEN, Kurt, Edward ,  ACAR, Cenk ,  SHENOY, Ravindra, Vaman ,  BUCHAN, Nicholas, Ian

IPC: H01L41/08 ,  H01L41/113 ,  B81B3/00 ,  G01C19/56

CPC classification number: H01L41/1132 ,  B81B3/0078 ,  B81B2201/0242 ,  G01C19/5769 ,  H01L41/08 ,  H01L41/081

Abstract: This disclosure provides systems, apparatus, and devices and methods of fabrication for electromechanical devices. In one implementation, an apparatus includes a metal proof mass and a piezoelectric component as part of a MEMS device. Such apparatus can be particularly useful for MEMS gyroscope devices. For instance, the metal proof mass, which may have a density several times larger than that of silicon, is capable of reducing the quadrature and bias error in a MEMS gyroscope device, and capable of increasing the sensitivity of the MEMS gyroscope device.

Abstract translation: 本公开提供了用于机电装置的系统，装置，装置和制造方法。 在一个实施方案中，装置包括作为MEMS器件的一部分的金属防爆质量体和压电部件。 这种装置对于MEMS陀螺仪装置尤其有用。 例如，可能具有比硅的密度大几倍的密度的金属质量块能够降低MEMS陀螺仪器件中的正交和偏置误差，并且能够增加MEMS陀螺仪器件的灵敏度。

公开(公告)号：WO2012125481A3

公开(公告)日：2012-09-20

申请号：PCT/US2012/028551

申请日：2012-03-09

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  BURNS, David, William ,  SHENOY, Ravindra, Vaman

Inventor： BURNS, David, William ,  SHENOY, Ravindra, Vaman

IPC: H05K1/03 ,  H05K3/42 ,  B81C1/00

Abstract: This disclosure provides systems, methods and apparatus providing electrical connections through glass substrates. In one aspect, a thin film through-glass via including a through-glass via hole and a thin conductive film that conformally coats the sidewalls of the through-glass via hole is provided. A contour of a through-glass via hole may include concave portions that overlap at a midsection of the glass, with the through-glass via hole sidewalls curved inward to form the concave portions. In another aspect, one or more methods of forming through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a contoured through-glass via hole, followed by deposition of a thin continuous film of a conductive material.

公开(公告)号：WO2012054355A1

公开(公告)日：2012-04-26

申请号：PCT/US2011/056454

申请日：2011-10-14

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  GANAPATHI, Srinivasan, Kodaganallur ,  BUCHAN, Nicholas Ian ,  PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, Vaman ,  LIN, Peng, Cheng ,  CHENG, Ericson

Inventor： GANAPATHI, Srinivasan, Kodaganallur ,  BUCHAN, Nicholas Ian ,  PETERSEN, Kurt, Edward ,  SHENOY, Ravindra, Vaman ,  LIN, Peng, Cheng ,  CHENG, Ericson

IPC: G06F3/041

CPC classification number: G06F3/044 ,  G02B26/0833 ,  G06F3/03547 ,  G06F3/045 ,  G06F21/32 ,  G06F21/83 ,  G06F2203/04103 ,  G06F2203/04106 ,  G06K9/0002

Abstract: This disclosure provides systems, methods and apparatus for a combined sensor device. In some implementations, a combined sensor device includes a wrap-around configuration wherein an upper flexible substrate has patterned conductive material on an extended portion to allow routing of signal lines, electrical ground, and power. One or more integrated circuits or passive components, which may include connecting sockets, may be mounted onto the flexible layer to reduce cost and complexity. Such implementations may eliminate a flex cable and may allow a bezel-less configuration.

Abstract translation: 本公开提供了用于组合的传感器装置的系统，方法和装置。 在一些实施方式中，组合传感器装置包括环绕构型，其中上柔性衬底在延伸部分上具有图案化的导电材料，以允许信号线，电接地和功率的路由。 可以将包括连接插座的一个或多个集成电路或无源组件安装在柔性层上以降低成本和复杂性。 这样的实现可以消除柔性电缆并且可以允许无边框配置。

公开(公告)号：WO2011136972A1

公开(公告)日：2011-11-03

申请号：PCT/US2011/032932

申请日：2011-04-18

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  ACER, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

Inventor： ACER, Cenk ,  SHENOY, Ravindra, Vaman ,  BLACK, Justin, Phelps ,  PETERSEN, Kurt, Edward ,  GANAPATHI, Srinivasan, Kodaganallur ,  STEPHANOU, Philip, Jason

IPC: G01C19/56

CPC classification number: G01C19/5769 ,  G01C19/5712 ,  G01C19/5719 ,  G01C19/5747 ,  G01C25/00 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/082 ,  H01L41/25 ,  H01L41/311 ,  H01L41/312 ,  Y10T29/42 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/49155

Abstract: This disclosure provides systems, methods and apparatus, including computer programs encoded on computer storage media, for making and using gyroscopes. Such gyroscopes may include a sense frame, a proof mass disposed outside the sense frame, a pair of anchors and a plurality of drive beams. The plurality of drive beams may be disposed on opposing sides of the sense frame and between the pair of anchors. The drive beams may connect the sense frame to the proof mass. The drive beams may be configured to cause torsional oscillations of the proof mass substantially in a first plane of the drive beams. The sense frame may be substantially decoupled from the drive motions of the proof mass. Such devices may be included in a mobile device, such as a mobile display device.

Abstract translation: 本公开提供了系统，方法和装置，包括在计算机存储介质上编码的用于制造和使用陀螺仪的计算机程序。 这种陀螺仪可以包括检测框架，设置在感测框架外部的检测质量块，一对锚固件和多个驱动梁。 多个驱动梁可以设置在感测框架的相对侧之间并且在一对锚固件之间。 驱动梁可将感应框架连接到检测质量块。 驱动梁可以被配置成基本上在驱动梁的第一平面中引起防弹块的扭转振荡。 感测框架可以与证明质量块的驱动运动基本上分离。 这样的设备可以被包括在诸如移动显示设备的移动设备中。

公开(公告)号：WO2013033124A1

公开(公告)日：2013-03-07

申请号：PCT/US2012/052719

申请日：2012-08-28

Applicant: QUALCOMM MEMS TECHNOLOGIES, INC. ,  SHENOY, Ravindra, Vaman ,  BURNS, David, William ,  PETERSEN, Kurt, Edward ,  WORTHINGTON, Erica, Jade

Inventor： SHENOY, Ravindra, Vaman ,  BURNS, David, William ,  PETERSEN, Kurt, Edward ,  WORTHINGTON, Erica, Jade

IPC: B81B7/00 ,  H01L23/498

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/097 ,  B81B2207/098 ,  B81C2203/0792 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  Y10T156/1052 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and apparatus for providing electrical connections through glass substrates. In one aspect, a through-glass via including a peripheral through-glass via hole and sidewall metallization is provided. Sidewall metallization can include multiple conductive lines facilitating increased interconnect density. In another aspect, one or more methods of forming peripheral through-glass vias are provided. In some implementations, the methods include double-sided processes to form aligned via holes in a glass substrate that together form a through-glass via hole, followed by sidewall metallization and dicing through the through-glass via hole.

Abstract translation: 本公开提供了通过玻璃基板提供电连接的系统，方法和装置。 在一个方面，提供了一种包括周边透玻璃通孔和侧壁金属化的透玻璃通孔。 侧壁金属化可以包括促进增加的互连密度的多条导线。 在另一方面，提供了一种或多种形成外围玻璃通孔的方法。 在一些实施方式中，所述方法包括双面工艺以在玻璃基板中形成对准的通孔，所述对准的通孔一起形成贯穿玻璃通孔，随后侧壁金属化和通过玻璃通孔进行切割。