公开(公告)号：WO2018200401A1

公开(公告)日：2018-11-01

申请号：PCT/US2018/028921

申请日：2018-04-23

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： BREINGAN, William, Gilbert ,  HOFMEISTER, Chris ,  TADDEI, John

IPC: B01D46/00 ,  B08B15/02 ,  B08B3/14

CPC classification number: B01D45/14 ,  B08B17/025

Abstract: The wafer processing system includes a rotatable wafer support member for supporting a wafer and a plurality of collections trays disposed about a peripheral edge of the wafer support member. The collection trays are arranged in a stacked configuration, each collection tray having an inner wall portion and an outer wall portion that converge to define a trough section for collecting fluid. The system includes a chamber exhaust outlet that is formed in the housing for venting gas from the interior of the housing outside of the collection trays and a chemical exhaust outlet that is formed in the housing for venting gas that flows through the collection chamber to the chemical exhaust outlet. The chemical exhaust outlet can be fluidly isolated from the chamber exhaust outlet.

公开(公告)号：WO2016081106A1

公开(公告)日：2016-05-26

申请号：PCT/US2015/055812

申请日：2015-10-15

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： TADDEI, John ,  YUTKOWITZ, Jonathan

IPC: C02F1/00 ,  C02F1/66 ,  C02F1/68 ,  C02F1/72

CPC classification number: C02F1/68 ,  C02F2209/005 ,  C02F2209/03 ,  C02F2209/05

Abstract: An apparatus and method to convert high resistivity (18 MOhm/cm) deionized water into lower resistivity deionized water with a tight resistivity range. The apparatus is diminished in size to require less space, has an improved sensitivity resistivity probe to permit a lower operating range, an increased communication rate with updated control logic to permit holding tighter tolerances. The method is environmentally friendly in that it replaces the use of harsh chemistries and eliminates the generation of hazardous waste.

Abstract translation: 将高电阻率（18MOhm / cm）去离子水转换成电阻率较低的去离子水的设备和方法。 该装置的尺寸减小以需要更少的空间，具有改进的灵敏度电阻率探​​头以允许较低的操作范围，与更新的控制逻辑增加的通信速率以允许保持更严格的公差。 该方法是环保的，因为它取代了苛刻化学品的使用并消除了危险废物的产生。

公开(公告)号：WO2019245915A1

公开(公告)日：2019-12-26

申请号：PCT/US2019/037278

申请日：2019-06-14

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： BREINGAN, William, Gilbert ,  ITZKOWITZ, Herman

IPC: H01L21/67 ,  B65G25/02 ,  B65G47/90 ,  B65G47/91 ,  B65G49/07 ,  B65G53/02

Abstract: An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements. Gas provided to the plurality of nozzles exits the nozzles in a stream directed parallel to the supporting surface and the stream of gas generates forces that enable wafers to be securely supported in a floating manner over the supporting surface without coming into direct contact with the supporting surface.

公开(公告)号：WO2018136644A1

公开(公告)日：2018-07-26

申请号：PCT/US2018/014255

申请日：2018-01-18

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： TADDEI, John ,  VIT, Paul ,  NULMAN, Kenji ,  ANDERS, Jim

IPC: B01D27/10 ,  B01D29/90 ,  B01D35/12 ,  F16K27/04 ,  G05B19/04 ,  H01L21/02

Abstract: An apparatus and method for removing post MLO (Material Lift Off) materials from a recycle solvent stream utilize a space efficient design and in a fashion that greatly reduces equipment downtime to maintenance and in a health friendly fashion.

公开(公告)号：WO2016081105A1

公开(公告)日：2016-05-26

申请号：PCT/US2015/055811

申请日：2015-10-15

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： TADDEI, John ,  YUTKOWITZ, Jonathan

IPC: B01F3/04

CPC classification number: G05D21/02 ,  B01F3/04106 ,  B01F15/00227 ,  B01F15/0408 ,  C02F1/685 ,  C02F2103/04

Abstract: An apparatus and method to convert high resistivity (18 MOhm/cm) deionized water into lower resistivity deionized water with a tight resistivity range (150 KOhm/cm +\- 50 KOhm/cm) without adding metals to the DI. The invention discreetly injects carbon dioxide in an on demand fashion through a metals free fluid path.

Abstract translation: 将高电阻率（18MOhm / cm）去离子水转化成电阻率较低的去离子水（150KOhm / cm±50KOhm / cm）的装置和方法，而不向DI中添加金属。 本发明通过无金属流体路径以按需方式谨慎地注入二氧化碳。

公开(公告)号：WO2019246426A1

公开(公告)日：2019-12-26

申请号：PCT/US2019/038289

申请日：2019-06-20

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： TADDEI, John ,  GOLDBERG, David, A. ,  LAWRENCE, Elena ,  COCHRAN, Ian ,  ORLANDO, Christopher ,  SWALLOW, James

IPC: H01L21/02 ,  G03F7/26 ,  G01B11/06

Abstract: A semiconductor etch process is provided in which an undercut is minimized during an etch process through tight control of etch profile, recognition of etch completion, and minimization of over etch time to increase productivity.

公开(公告)号：WO2019241067A1

公开(公告)日：2019-12-19

申请号：PCT/US2019/036055

申请日：2019-06-07

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： HONIGMAN, Steven ,  NULMAN, Kenji

IPC: B05B1/00 ,  B05B1/02 ,  B05B1/12 ,  B05B1/30 ,  B05B3/00 ,  B05B7/02 ,  B08B3/00

Abstract: A device for spraying substrates comprises a longitudinal extending fluid dispensing head coupled to a supply of fluid and including a perpendicularly extending flange, a spacer having first and second ends, the first end of the spacer coupled to the extending flange of the dispensing head, a nozzle adapted to eject fluid coupled to the second end of the spacer, and a locking nut enclosing the spacer and securely the dispensing head, spacer and nozzle.

公开(公告)号：WO2018200394A1

公开(公告)日：2018-11-01

申请号：PCT/US2018/028901

申请日：2018-04-23

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： BREINGAN, William, Gilbert ,  HOFMEISTER, Chris ,  TADDEI, John

IPC: H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687 ,  B05C13/02 ,  C23C14/50

CPC classification number: H01L21/68764 ,  H01L21/67051 ,  H01L21/6708 ,  H01L21/6838 ,  H01L21/68728 ,  H01L21/68735 ,  H01L21/68742 ,  H01L21/68785

Abstract: A reconfigurable wafer spin chuck for supporting a wafer includes a rotatable chuck base having a first opening formed therein and including one or more support members extending upwardly therefrom. The spin chuck is reconfigurable between a first chuck type and a second chuck type, wherein the first chuck type comprises a non-contact wafer type chuck and the second chuck type comprises an open backside frame type chuck. In the non- contact wafer type chuck, a first insert is mounted to the chuck base and supported by the one or more support members and in the open backside frame type chuck, a second insert is mounted to the chuck base and supported by the one or more support members. The wafer is spaced a first distance from the first insert and is spaced a second distance from the second insert, the second distance being greater than the first distance.

公开(公告)号：WO2018160461A1

公开(公告)日：2018-09-07

申请号：PCT/US2018/019476

申请日：2018-02-23

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： MAUER, Laura ,  TADDEI, John ,  CLARK, John ,  NULMAN, Kenji

IPC: H01L21/00

Abstract: A system and method are provided for etching semiconductor wafers (integrated circuit substrates) with advanced packaging using a two-step wet etching process. The first etch step uses an etchant that is non-selective to at least the wafer material (silicon) and metals, such as copper and titanium, that are present in the wafer. The second etch step uses an etchant that is selective to the wafer material (silicon) and has low selectivity for the metals, thereby leaving them at least substantially intact.

公开(公告)号：WO2019094288A1

公开(公告)日：2019-05-16

申请号：PCT/US2018/058894

申请日：2018-11-02

Applicant: VEECO PRECISION SURFACE PROCESSING LLC

Inventor： VIT, Paul ,  BREINGAN, William, Gilbert ,  HOFMEISTER, Christopher

IPC: H01L21/67

Abstract: A dispense arm device for controllably discharging a fluid onto a substrate includes a dispense head coupled to and contained within an arm portion of the dispense arm device, wherein the dispense head having a valve assembly that is configured to operate in: (1) a recirculation mode in which a dispense outlet formed in the dispense head is closed off and a recirculation path is opened for allowing heated chemistry that is delivered to the dispense head to be delivered back from the dispense head to a remote location (e.g., a recycle tank); and (2) a dispense mode in which the dispense outlet is opened to allow heated chemistry to be discharged from the dispense head and the recirculation path is closed off.