公开(公告)号：WO2018182718A1

公开(公告)日：2018-10-04

申请号：PCT/US2017/025512

申请日：2017-03-31

申请人： INTEL IP CORPORATION ,  AUGUSTIN, Andreas ,  KOLLER, Sonja ,  WAIDHAS, Bernd ,  SEIDEMANN, Georg ,  WOLTER, Andreas ,  STOECKL, Stephan ,  WAGNER, Thomas ,  HAGN, Josef

发明人： AUGUSTIN, Andreas ,  KOLLER, Sonja ,  WAIDHAS, Bernd ,  SEIDEMANN, Georg ,  WOLTER, Andreas ,  STOECKL, Stephan ,  WAGNER, Thomas ,  HAGN, Josef

IPC分类号： H01Q9/04 ,  H01Q1/38

摘要： A patch antenna array is fabricated with a package-on-package setup that contains a transceiver. The patch antenna array has a footprint that intersects the transceiver footprint. The package-on-package setup includes through-mold vias that couple to a redistribution layer disposed between the patch antennas and the package-on-package setup.

公开(公告)号：WO2018125132A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069176

申请日：2016-12-29

申请人： INTEL IP CORPORATION ,  SEIDEMANN, Georg ,  WAGNER, Thomas ,  WOLTER, Andreas ,  WAIDHAS, Bernd

发明人： SEIDEMANN, Georg ,  WAGNER, Thomas ,  WOLTER, Andreas ,  WAIDHAS, Bernd

IPC分类号： H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H01L23/31

摘要： A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.

公开(公告)号：WO2015137936A1

公开(公告)日：2015-09-17

申请号：PCT/US2014/024112

申请日：2014-03-12

申请人： INTEL CORPORATION ,  MEYER, Thorsten ,  OFNER, Gerald ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  ALBERS, Sven ,  GEISSLER, Christian

发明人： MEYER, Thorsten ,  OFNER, Gerald ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  ALBERS, Sven ,  GEISSLER, Christian

IPC分类号： H01L23/12

CPC分类号： H01L23/49838 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/24195 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105

摘要： A microelectronic package including a passive microelectronic device disposed within a package body, wherein the package body is the portion of the microelectronic package which provides support and/or rigidity to the microelectronic package. In a flip-chip type microelectronic package, the package body may comprise a microelectronic substrate to which an active microelectronic device is electrically attached. In an embedded device type microelectronic package, the package body may comprise the material in which the active microelectronic device is embedded.

摘要翻译： 一种微电子封装，包括设置在封装主体内的无源微电子器件，其中所述封装体是所述微电子封装的对所述微电子封装提供支撑和/或刚度的部分。 在倒装芯片型微电子封装中，封装主体可以包括微电子衬底，活性微电子器件电连接到微电子衬底。 在嵌入式设备型微电子封装中，封装体可以包括其中嵌入有源微电子器件的材料。

公开(公告)号：WO2015088486A1

公开(公告)日：2015-06-18

申请号：PCT/US2013/073950

申请日：2013-12-09

申请人： INTEL CORPORATION ,  WOLTER, Andreas ,  MARUTHAMUTHU, Saravana ,  KNUDSEN, Mikael ,  MEYER, Thorsten ,  SEIDEMANN, Georg ,  HERRERO, Pablo ,  JAERVINEN, Pauli

发明人： WOLTER, Andreas ,  MARUTHAMUTHU, Saravana ,  KNUDSEN, Mikael ,  MEYER, Thorsten ,  SEIDEMANN, Georg ,  HERRERO, Pablo ,  JAERVINEN, Pauli

IPC分类号： H01L23/66

CPC分类号： H01L23/66 ,  H01L21/4846 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/526 ,  H01L2924/00

摘要： An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

摘要翻译： 在可用于封装模具的陶瓷上描述天线。 在一个示例中，封装具有管芯，管芯上的陶瓷衬底，附着到陶瓷衬底的天线以及将天线电连接到管芯的导电引线。

公开(公告)号：WO2018125202A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069469

申请日：2016-12-30

申请人： INTEL IP CORPORATION ,  WAGNER, Thomas ,  WOLTER, Andreas ,  SEIDEMANN, Georg

发明人： WAGNER, Thomas ,  WOLTER, Andreas ,  SEIDEMANN, Georg

IPC分类号： H01L25/065 ,  H01L23/498 ,  H01L23/525 ,  H01L25/00

摘要： A microelectronic package includes at least two semiconductor die, one die stacked over at least partially another. At least the upper die is oriented with its active surface facing in the direction of a redistribution structure, and one or more wires are coupled to extend from contacts on that active surface into conductive structures in the redistribution structure.

公开(公告)号：WO2014209307A1

公开(公告)日：2014-12-31

申请号：PCT/US2013/047993

申请日：2013-06-26

申请人： INTEL IP CORPORATION ,  MARUTHAMUTHU, Saravana ,  MEYER, Thorsten ,  HERRERO, Pablo ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  KNUDSEN, Mikael ,  JAERVINEN, Pauli

发明人： MARUTHAMUTHU, Saravana ,  MEYER, Thorsten ,  HERRERO, Pablo ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  KNUDSEN, Mikael ,  JAERVINEN, Pauli

IPC分类号： H04B1/48

CPC分类号： H03H9/0014 ,  H01Q5/335 ,  H03H7/40 ,  H04B1/0458

摘要： Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.

摘要翻译： 公开了用于体声波谐振器（BAWR）调谐器电路及其在集成电路（IC）封装中的使用和用于射频（RF）通信的移动通信设备的技术和配置。 在一些实施例中，移动通信设备可以包括天线; 具有输出端口的发射机电路，具有一个或多个BAWR的调谐器电路，耦合到天线的天线端口，耦合到发射机电路的输出端口的发射机端口和控制端口; 以及耦合到控制端口的控制电路，其被配置为至少部分地基于天线的阻抗来调节调谐器电路的阻抗，经由调谐调谐器电路的BAWR或另一部件。 可以描述和/或要求保护其他实施例。

公开(公告)号：WO2006116476A1

公开(公告)日：2006-11-02

申请号：PCT/US2006/015773

申请日：2006-04-25

申请人： SIGMA-ALDRICH CO. ,  LEUCK, Michael ,  WOLTER, Andreas

发明人： LEUCK, Michael ,  WOLTER, Andreas

IPC分类号： C07H21/04 ,  C07H21/02

CPC分类号： C07H21/02 ,  C07H21/04

摘要： The present invention discloses methods for the synthesis of oligonuclelotidesa and nucleoside phosphoramidites. The methods are based on employing aryl-substituted 5-phenyl-lH-tetrazoles with perfluroalkyl groups on the aromatic ring as activators. In one aspect the activators are used in the synthesis of oligonucleoties via the phosphoramidite approach. In this aspect the activators are highly efficient and can be applied with very short coupling times. In a further aspect, the activators of the invention are used in the synthesis of phosphoramidites through the reaction of nucleosides comprising a free hydroxyl group with phosphitylating agents. This aspect of the activators provide very pure phosphoramidites under mild conditions. The activators of the invention are further characterized as being highly soluble, non-hygroscopic and non-hazardous.

摘要翻译： 本发明公开了寡核苷酸和核苷亚磷酰胺的合成方法。 该方法基于在芳环上使用具有全氟烷基的芳基取代的5-苯基-1H-四唑作为活化剂。 在一个方面，活化剂用于通过亚磷酰胺方法合成寡核苷酸。 在这方面，活化剂是高效的并且可以以非常短的偶联时间施用。 在另一方面，本发明的活化剂用于通过包含游离羟基的核苷与磷酸化剂的反应来合成亚磷酰胺。 活化剂的这个方面在温和条件下提供非常纯的亚磷酰胺。 本发明的活化剂进一步被表征为高溶解性，非吸湿性和非危险性。