公开(公告)号：WO2015088486A1

公开(公告)日：2015-06-18

申请号：PCT/US2013/073950

申请日：2013-12-09

Applicant: INTEL CORPORATION ,  WOLTER, Andreas ,  MARUTHAMUTHU, Saravana ,  KNUDSEN, Mikael ,  MEYER, Thorsten ,  SEIDEMANN, Georg ,  HERRERO, Pablo ,  JAERVINEN, Pauli

Inventor： WOLTER, Andreas ,  MARUTHAMUTHU, Saravana ,  KNUDSEN, Mikael ,  MEYER, Thorsten ,  SEIDEMANN, Georg ,  HERRERO, Pablo ,  JAERVINEN, Pauli

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L21/4846 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01Q1/38 ,  H01Q1/50 ,  H01Q1/526 ,  H01L2924/00

Abstract: An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die.

Abstract translation: 在可用于封装模具的陶瓷上描述天线。 在一个示例中，封装具有管芯，管芯上的陶瓷衬底，附着到陶瓷衬底的天线以及将天线电连接到管芯的导电引线。

公开(公告)号：WO2014209307A1

公开(公告)日：2014-12-31

申请号：PCT/US2013/047993

申请日：2013-06-26

Applicant: INTEL IP CORPORATION ,  MARUTHAMUTHU, Saravana ,  MEYER, Thorsten ,  HERRERO, Pablo ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  KNUDSEN, Mikael ,  JAERVINEN, Pauli

Inventor： MARUTHAMUTHU, Saravana ,  MEYER, Thorsten ,  HERRERO, Pablo ,  WOLTER, Andreas ,  SEIDEMANN, Georg ,  KNUDSEN, Mikael ,  JAERVINEN, Pauli

IPC: H04B1/48

CPC classification number: H03H9/0014 ,  H01Q5/335 ,  H03H7/40 ,  H04B1/0458

Abstract: Techniques and configurations are disclosed for bulk acoustic wave resonator (BAWR) tuner circuits and their use in integrated circuit (IC) packages and mobile communication devices for radio frequency (RF) communication. In some embodiments, a mobile communication device may include an antenna; a transmitter circuit having an output port, a tuner circuit having one or more BAWRs, an antenna port coupled to the antenna, a transmitter port coupled to the output port of the transmitter circuit, and a control port; and a control circuit, coupled to the control port, configured to adjust an impedance of the tuner circuit, via adjustment of a BAWR or another component of the tuner circuit, based at least in part on an impedance of the antenna. Other embodiments may be described and/or claimed.

Abstract translation: 公开了用于体声波谐振器（BAWR）调谐器电路及其在集成电路（IC）封装中的使用和用于射频（RF）通信的移动通信设备的技术和配置。 在一些实施例中，移动通信设备可以包括天线; 具有输出端口的发射机电路，具有一个或多个BAWR的调谐器电路，耦合到天线的天线端口，耦合到发射机电路的输出端口的发射机端口和控制端口; 以及耦合到控制端口的控制电路，其被配置为至少部分地基于天线的阻抗来调节调谐器电路的阻抗，经由调谐调谐器电路的BAWR或另一部件。 可以描述和/或要求保护其他实施例。

公开(公告)号：WO2016048363A1

公开(公告)日：2016-03-31

申请号：PCT/US2014/057781

申请日：2014-09-26

Applicant: INTEL CORPORATION ,  MEYER, Thorsten ,  JAERVINEN, Pauli ,  PATTEN, Richard

Inventor： MEYER, Thorsten ,  JAERVINEN, Pauli ,  PATTEN, Richard

IPC: H01L25/07 ,  H01L23/49

CPC classification number: H01L25/0657 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49 ,  H01L23/528 ,  H01L24/19 ,  H01L24/20 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L24/96 ,  H01L25/07 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48235 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06548 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2924/207

Abstract: Embodiments of the present disclosure are directed towards an integrated circuit (IC) package including a first die at least partially embedded in a first encapsulation layer and a second die at least partially embedded in a second encapsulation layer. The first die may have a first plurality of die-level interconnect structures disposed at a first side of the first encapsulation layer. The IC package may also include a plurality of electrical routing features at least partially embedded in the first encapsulation layer and configured to route electrical signals between a first and second side of the first encapsulation layer. The second side may be disposed opposite to the first side. The second die may have a second plurality of die-level interconnect structures that may be electrically coupled with at least a subset of the plurality of electrical routing features by bonding wires.

Abstract translation: 本公开的实施例涉及集成电路（IC）封装，其包括至少部分地嵌入第一封装层中的第一裸片和至少部分地嵌入第二封装层中的第二裸片。 第一管芯可以具有设置在第一封装层的第一侧的第一多个管芯级互连结构。 IC封装还可以包括至少部分地嵌入在第一封装层中并被配置为在第一封装层的第一和第二侧之间路由电信号的多个电路由特征。 第二侧可以布置成与第一侧相对。 第二管芯可以具有第二多个管芯级互连结构，其可以通过接合引线与多个电路径特征的至少一个子集电耦合。